1. | EXECUTIVE SUMMARY |
1.1. | The Impact of Data Growth and Energy Consumption |
1.2. | Modern Applications are Demanding High Performance Storage |
1.3. | Memory bottlenecks for High Performance workloads |
1.4. | Hierarchy of computing memory |
1.5. | What are HDDs? How Do They Work? |
1.6. | Hard Disk Drive Market in 2024 |
1.7. | Forecast: Hard Disk Drive by Application |
1.8. | SSDs Cell Types |
1.9. | Key Manufactures of SSDs and Market Size |
1.10. | Evolution of Capacity in QLC SSDs & HDDs |
1.11. | Capacity Density Comparison of QLC SSDs & HDDs |
1.12. | QLC SSDs & HDDs Best Metric Comparison Table |
1.13. | Forecast: SSDs & NAND by Application |
1.14. | What is DRAM? |
1.15. | HBM |
1.16. | Forecast: Yearly Unit Sales and Market Size of High Bandwidth Memory (HBM) |
1.17. | Forecast: Memory by Application |
1.18. | Emerging memory technologies: PCRAM, FRAM, RRAM, MRAM. |
1.19. | Emerging Non-Volatile Memory Technology |
1.20. | Companies involved within the Emerging Memory Space |
1.21. | Emerging Memory is Taking the Embedded Route |
1.22. | Emerging Memory Still Has a Path to Viability as Storage-Class Memory |
1.23. | Forecast: Market size of Emerging Memory by Type |
1.24. | IDTechEx Analysis: Future Outlook for MRAM |
1.25. | IDTechEx Analysis: Future Outlook for ReRAM |
1.26. | IDTechEx insight: Commercial FeRAM should adopt HfO₂ to move out of niche |
1.27. | IDTechEx Outlook & Comments for FeRAM |
1.28. | Failure of PCM as Storage Class Memory (2015-2023) |
1.29. | IDTechEx Outlook & Comments for PCM |
1.30. | Memory and Storage Technology Readiness Level |
1.31. | Access More With an IDTechEx Subscription |
2. | INTRODUCTION |
2.1.1. | Understanding the Memory Hierarchy for General Computing |
2.1.2. | Trends for storage and memory in Todays tech climate |
2.2. | AI & HPC |
2.2.1. | HPC - overview |
2.2.2. | AI as a Leading Driver for Memory solutions |
2.2.3. | Data movement through storage tiers in clusters for AI workloads |
2.2.4. | Modern Applications are Demanding High Performance Storage |
2.2.5. | Memory bottlenecks for High Performance workloads |
2.2.6. | Overview of trends in HPC chip integration |
2.3. | Cloud Storage |
2.3.1. | The Impact of Data Growth and Energy Consumption |
2.3.2. | Rising Data Storage Costs |
2.3.3. | On-premises, cloud, and hybrid storage solutions: Shift towards cloud & hybrid |
2.4. | Embedded Memory |
2.4.1. | What are Embedded Memory and Embedded Systems? |
2.4.2. | Types of Embedded Memory |
2.4.3. | Embedded Flash Struggles with sub-28nm |
2.4.4. | Scaling Embedded Memory to Advanced Nodes is Important for Key Metrics |
2.5. | Edge Devices & IoT |
2.5.1. | Edge Devices also is a Driver for Memory Solutions |
2.5.2. | Edge vs Cloud characteristics |
2.5.3. | Embedded Memory in Automotive Vehicles |
2.5.4. | Edge AI in Smart Appliances |
3. | FORECASTS |
3.1. | Forecast Methodology |
3.2. | Forecast: Market size of Hard-Drive-Disk by Application |
3.3. | Forecast: SSDs & NAND by Application |
3.4. | Forecast: Market size of Storage Cloud/Data Center Market |
3.5. | Forecast: Market size of Storage Edge Market |
3.6. | Forecast: Memory by Application |
3.7. | Forecast: Yearly Unit Sales and Market Size of High Bandwidth Memory (HBM) |
3.8. | Forecasts: Memory and Storage for Servers for AI/HPC |
3.9. | Forecast: Memory & Storage Market by Application & Type |
3.10. | Forecast: Top Level Forecast Memory & Storage Market |
3.11. | Forecast: Market size of Emerging Memory by Type |
4. | STORAGE |
4.1. | Overview |
4.1.1. | The Impact of Data Growth and Energy Consumption |
4.1.2. | Rising Data Storage Costs |
4.1.3. | Modern Applications are Demanding High Performance |
4.1.4. | Trends for Storage in Todays Tech Climate |
4.1.5. | Understanding the Memory Hierarchy for General Computing |
4.1.6. | Storage in Datacentres |
4.1.7. | Flash storage is the leading storage technology for HPC and AI applications |
4.1.8. | HPC and AI require large-scale and high-performance data storage |
4.1.9. | Storage requirements varies depending on the AI workloads |
4.1.10. | Data movement through storage tiers in clusters for AI workloads |
4.1.11. | Example of SSD configurations and solutions for AI and HPC workloads |
4.1.12. | Examples of SK Hynix NAND Flash storage for AI and data centers |
4.1.13. | Solidigm (SK Hynix subsidiary) offers SSDs previously manufactured by Intel |
4.1.14. | Micron has a range of SSDs for applications in datacenters and AI |
4.1.15. | Micron's 9550 SSDs are designed for AI-critical workloads with PCIe Gen5 |
4.1.16. | KIOXIA offers a range of datacenter and enterprise SSD solutions |
4.1.17. | Storage in Edge Computing Devices |
4.2. | Hard Drive Disks (HDDs) |
4.2.1. | What are HDDs? How Do They Work? |
4.2.2. | Advancements in HDD Technology |
4.2.3. | Energy-Assisted Magnetic Recording (EAMR) Technologies |
4.2.4. | Data Centre HDD match up |
4.2.5. | Benefits and Drawbacks to HDDs relative to QLC SSDs |
4.2.6. | Hard Disk Drive Market in 2024 |
4.2.7. | HDDs Market Historically |
4.3. | Solid State Drives (SSDs) |
4.3.1. | What are SSDs? How Do They Work? |
4.3.2. | NAND Flash memory uses floating gates or charge traps to store data |
4.3.3. | Advancements in SSD Technology |
4.3.4. | NAND Layer Stacking |
4.3.5. | SK Hynix - NAND technology development |
4.3.6. | SK Hynix: Overcoming stacking limitations to increase capacity using 4D2.0 |
4.3.7. | KIOXIA uses BiCS 3D FLASHTM Technology to increase storage density |
4.3.8. | SSDs Cell Types |
4.3.9. | SLC SSDs |
4.3.10. | SSDs for storage class memory bridging gap to volatile memory |
4.3.11. | TLC SSDs |
4.3.12. | QLC SSDs |
4.3.13. | Increasing SSD capacity through emerging lower cost QLC NAND |
4.3.14. | QLC affords higher capacity at a lower cost per bit but with performance deficits |
4.3.15. | Benefits and Drawbacks to QLC SSDs |
4.3.16. | Use Cases of HDDs & QLC SSDs |
4.3.17. | Data center and enterprise SSD form factors transitioning towards EDSFF |
4.3.18. | Step change in sequential read bandwidth with each generation of PCIe |
4.3.19. | Evolution of PCIe generations in the SSD market |
4.3.20. | Key Manufactures of SSDs and Market Size |
4.3.21. | SSD Market Historically |
4.3.22. | Storage Market |
4.4. | Database Comparison - QLC SSD & HDD |
4.4.1. | Why Compare QLC SSDs & HDDs |
4.4.2. | Important KPI's for Comparison |
4.4.3. | Evolution of Capacity of QLC SSDs & HDDs |
4.4.4. | Capacity Density Comparison of QLC SSDs & HDDs |
4.4.5. | Sequential Bandwidth of QLC SSDs & HDDs |
4.4.6. | Capacity-to-Power Ratio of QLC SSDs & HDDs |
4.4.7. | Capacity Density / Power of QLC SSDs & HDDs |
4.4.8. | Capacity Density / Power of QLC SSDs & HDDs |
4.4.9. | QLC SSDs & HDDs Best Metric Comparison Table |
4.5. | Going Forward - Improving Current Technologies |
4.5.1. | SK Hynix Unveils Penta-Level 3D NAND Flash Memory in 2024 |
4.5.2. | Macronix Introduced Compute-In-Memory 3D NOR Flash technology for AI Applications in 2024 |
4.5.3. | SK Hynix introduced Accelerator-in-Memory for LLM Inference |
5. | MEMORY |
5.1. | Overview |
5.1.1. | Hierarchy of computing memory |
5.1.2. | Memory bottlenecks for HPC/AI workloads and processor under-utilization |
5.1.3. | What is DRAM? |
5.1.4. | What is SRAM? |
5.1.5. | Types of DRAM and Comparison of HBM with DDR |
5.1.6. | HBM vs DDR for computing - market trend |
5.2. | DDR Memory |
5.2.1. | Developments in double data rate (DDR) memory |
5.2.2. | DDR5 memory in AMD's 4th Gen EPYC processors for HPC workloads |
5.2.3. | DDR5 MRDIMM increases capacity and bandwidth for high CPU core counts |
5.2.4. | NVIDIA's Grace CPU uses LPDDR5X memory to lower power consumption |
5.2.5. | GDDR7 announced by major players targeting HPC and AI applications |
5.2.6. | Comparison of GDDR6 and GDDR7 modules |
5.3. | High Bandwidth Memory (HBM) |
5.3.1. | HBM |
5.3.2. | High bandwidth memory (HBM) and comparison with other DRAM technologies |
5.3.3. | Demand outgrows supply for HBM in 2024 |
5.3.4. | HBM (High Bandwidth Memory) packaging |
5.3.5. | HBM packaging transition to hybrid bonding |
5.3.6. | Benchmark of HBM performance utilizing µ bump and hybrid bonding |
5.3.7. | SK Hynix has started volume production of 12-layer HBM3E |
5.3.8. | Micron released 24GB HBM3E for NVIDIA H200 and is sampling 36GB HBM3E |
5.3.9. | Samsung expects production of HBM3E 36GB within 2024 |
5.3.10. | Overview of current HBM stacking technologies by 3 main players |
5.3.11. | Evolution of HBM generations and transition to HBM4 |
5.3.12. | Benchmarking of HBM technologies in the market from key players (1) |
5.3.13. | Benchmarking of HBM technologies in the market from key players (2) |
5.3.14. | Examples of CPUs and accelerators using HBM |
5.3.15. | Intel's CPU Max series for HPC workloads has HBM and optional DDR |
5.3.16. | AMD CDNA 3 APU architecture with unified HBM memory for HPC |
5.3.17. | Three main approaches to package HBM and GPU |
5.3.18. | Drawbacks of High Bandwidth Memory (HBM) |
5.4. | Memory Expansion |
5.4.1. | Samsung's CMM-D memory expansion for AI and datacenter server applications |
5.4.2. | Micron's CXL memory expansion modules for storage tiering in datacenters |
5.4.3. | Memory Market |
5.4.4. | DDR memory dominates CPUs whereas HBM is key to GPU performance |
5.5. | Memory Market |
5.5.1. | DDR memory dominates CPUs whereas HBM is key to GPU performance |
5.5.2. | Memory market |
6. | EMERGING STORAGE & MEMORY |
6.1. | Overview |
6.1.1. | Memory bottlenecks for HPC/AI workloads and processor under-utilization |
6.1.2. | Embedded Flash Struggles with sub-28nm |
6.1.3. | Scaling Embedded Memory to Advanced Nodes is Important for Key Metrics |
6.1.4. | Emerging memory technologies: PCRAM, FRAM, RRAM, MRAM. |
6.2. | Magnetoresistive RAM (MRAM) |
6.2.1. | What is Magnetoresistive RAM (MRAM)? How Does it Work? |
6.2.2. | Types of (MRAM) |
6.2.3. | Benefits and Drawbacks to MRAM |
6.2.4. | Current Applications of MRAM |
6.2.5. | MRAM Specific Companies & Startups |
6.2.6. | MRAM Specific Companies & Startups |
6.2.7. | Everspin Technologies is the leading supplier of discrete MRAM components |
6.2.8. | Everspin xSPI STT-MRAM sets new benchmark MRAM |
6.2.9. | Everspin Expands MRAM Portfolio for Edge AI and Embedded Systems |
6.2.10. | Everspin Target Markets is Growing With New applications |
6.2.11. | Avalanche Technology's MRAM Adoption in Aerospace Applications |
6.2.12. | TSMC's Involvement in MRAM |
6.2.13. | TSMC and NXP MRAM in Automotive Industry |
6.2.14. | TSMC: STT-MRAM Co-Optimized for AI Edge Devices |
6.2.15. | Samsung's Role in MRAM Research and Development |
6.2.16. | Samsung Unveils World Most Write Energy 14nm eMRAM Technology for Automotive Applications |
6.2.17. | Samsung Reveals Smallest-Cell eMRAM Compatible With 8nm Logic Node for Automotive Applications |
6.2.18. | Netsol Uses Samsung Foundry 28nm Process to produce MRAM Products |
6.2.19. | Kioxia Introduces World Smallest 1Selector-1MTJ Cell for 64 Gb Cross-Point MRAM |
6.2.20. | MRAM Market: Segmentation by Company Type |
6.2.21. | IDTechEx Analysis: Future Outlook for MRAM |
6.3. | Resistive RAM (ReRAM) |
6.3.1. | What is Resistive Ram (ReRAM)? How Does it Work? |
6.3.2. | Benefits and Drawbacks to ReRAM |
6.3.3. | Current Applications of ReRAM |
6.3.4. | ReRAM Market: Segmentation by Company Type |
6.3.5. | ReRAM Market Historically |
6.3.6. | ReRAM Specific Companies & Startups |
6.3.7. | ReRAM Specific Companies & Startups |
6.3.8. | Weebit Nano Developing and Licensing ReRAM Technology |
6.3.9. | Weebit Nano's Roadmap for ReRAM in AI Applications |
6.3.10. | CrossBar Inc Licensing ReRAM Technology |
6.3.11. | CrossBar Inc Provides High Performance Embedded and 3D High Density ReRAM |
6.3.12. | 4DS Memory Develops Area Based Interface Switching ReRAM |
6.3.13. | RAMXEED ReRAM Technology and Development |
6.3.14. | GlobalFoundries Demonstrates ReRAM in its 22FDX Platform |
6.3.15. | TSMC integrates ReRAM into its nRF54L Series SoCs AT 22nm |
6.3.16. | IDTechEx Analysis: Future Outlook for ReRAM |
6.4. | Ferroelectric RAM (FeRAM) |
6.4.1. | What is Ferroelectric RAM (FeRAM)? How Does it Work? |
6.4.2. | Benefits and Drawbacks to FeRAM |
6.4.3. | Current Applications of FeRAM |
6.4.4. | FeRAM Market: Segmentation by Company Type |
6.4.5. | RAMXEED FeRAM Technology and Development |
6.4.6. | Infineon is a leading supplier of FeRAM |
6.4.7. | Micron FeRAM Achieves Industry-Leading Density |
6.4.8. | Ferroelectric Memory Company Targets HfO2 FeRAM Commercialization |
6.4.9. | SK Hynix Unveils Ultra-High-Density 3D FeNAND Arrays for Analog Computation of Hyperscale AI Models |
6.4.10. | TSMC Showcases Ferroelectric FET Memory with Smallest Cell Area and High Endurance |
6.4.11. | IDTechEx Insight - Commercial FeRAM Needs HfO₂ to Stay Competitive |
6.4.12. | IDTechEx Outlook & Comments for FeRAM |
6.5. | Phase Change Memory (PCM) |
6.5.1. | What is Phase Change Memory (PCM/PCRAM) How Does it Work? |
6.5.2. | Benefits and Drawbacks to PCM |
6.5.3. | PCM Market: Segmentation by Company Type |
6.5.4. | PCM Market Lessons from Intel Optane Failure |
6.5.5. | Micron 3DXPoint |
6.5.6. | Failure of PCM as Storage Class Memory (2015-2023) |
6.5.7. | STMicroelectronics produces ePCM for Microcontrollers in automotive controllers |
6.5.8. | STMicroelectronics presents Single-Ended ePCM Memory Array for Neural Network Weight Storage in Edge-AI Applications |
6.5.9. | PCM Market |
6.5.10. | IDTechEx Outlook & Comments for PCM |
6.6. | Comparison of Emerging Memory Platforms |
6.6.1. | Emerging Memory Still Has a Path to Viability as Storage-Class Memory |
6.6.2. | Emerging Memory is Taking the Embedded Route |
6.6.3. | Comparison of Emerging Technology |
6.6.4. | IDTechEx Comparison of Commercialized Emerging Tech Products |
6.6.5. | Companies involved within the Emerging Memory Space |
7. | COMPANY PROFILES |
7.1. | Company Profiles Included with this Report |