1. | EXECUTIVE SUMMARY |
1.1. | 5G, next generation cellular communications network |
1.2. | Two types of 5G: Sub-6 GHz and mmWave 5G |
1.3. | Overview of challenges, trends and innovations for mmWave 5G |
1.4. | New opportunities for low-loss materials in mmWave 5G |
1.5. | Where low-loss materials will be used: beam forming system in base station |
1.6. | Where low-loss material will be used: substrate of mmWave antenna module for smartphone |
1.7. | Where low-loss material will be used: multiple parts inside packages |
1.8. | Low-loss materials can also be used in Radar |
1.9. | Low-loss materials can also be used in radome cover or molding housing |
1.10. | Overview of the low-loss materials covered by this report |
1.11. | The role of thermoplastics polymers and thermosetting polymers |
1.12. | Thermoset vs thermoplastics for 5G |
1.13. | Organic substrate materials evolution for 5G |
1.14. | Benchmark of commercialised low-loss organic laminates: Dk @ 10 GHz |
1.15. | Benchmark of commercialised low-loss organic laminates: Df @ 10 GHz |
1.16. | Strategies to achieve lower dielectric loss and trade-offs |
1.17. | Where is the limit of the Dk for modified thermoset |
1.18. | Main applications of Ceramic / LTCC in 5G |
1.19. | Filter technologies that can work at mmWave 5G and which one will be the future |
1.20. | LTCC and ceramic substrate will continue to play a key role in for RF filters |
1.21. | Comparison of organic laminates, ceramic and glass substrates |
1.22. | 2G to mmWave 5G: from body or case integrated to flex PCB integrated to antenna in package |
1.23. | EMC innovations trends for 5G applications |
1.24. | Challenges and key trends for EMI shielding for 5G devices |
1.25. | Low-loss materials forecast in 5G by revenue |
1.26. | Low-loss materials areas forecast in 5G by frequency |
1.27. | Low-loss materials areas forecast in 5G by market segments |
1.28. | Low-loss materials areas forecast in 5G by types of materials |
1.29. | Low-loss materials areas forecast in 5G base station by materials types |
1.30. | Low-loss materials areas forecast in 5G smartphones by material types |
1.31. | Low-loss materials areas forecast in 5G CPE and hotspots by material types |
2. | INTRODUCTION |
2.1. | 5G technology and the role of low-loss materials |
2.1.1. | 5G, next generation cellular communications network |
2.1.2. | What can 5G offer: high speed, massive connection and low latency |
2.1.3. | Two types of 5G: Sub-6 GHz and mmWave |
2.1.4. | 5G is live globally |
2.1.5. | 5G market forecast for services 2018-2030 |
2.1.6. | Global trends and new opportunities in 5G |
2.1.7. | 5G new radio technologies |
2.1.8. | 5G core network technologies |
2.1.9. | 5G infrastructure evolution |
2.1.10. | 5G station instalment forecast (2020-2030) by type of cell (macro, micro, pico/femto) |
2.1.11. | Structure of massive MIMO system |
2.1.12. | Challenges for radio frequency front end module (RF FEM) in mmWave 5G |
2.1.13. | Global market share and historic shipment of base station antennas and active antennas |
2.1.14. | 5G user equipment landscape |
2.1.15. | 5G mobile shipment units 2018-2030 |
2.1.16. | Shipment of customer promised equipment and hotspots by units 2018-2030 |
2.1.17. | Overview of challenges, trends and innovations for mmWave 5G |
2.1.18. | New opportunities for low-loss materials in mmWave 5G |
2.1.19. | Overview of the low-loss materials covered by this report |
2.1.20. | Where low-loss material will be used: beam forming system in base station |
2.1.21. | sub-6 GHz and mmWave 5G antennas systems for base station in one unit |
2.1.22. | Murata mmWave antenna module for base station |
2.1.23. | Where low-loss material will be used: substrate of mmWave antenna module for smartphone |
2.1.24. | Thermoplastic material for LDS smartphone antennas |
2.1.25. | Suppliers for LDS materials |
2.1.26. | Examples of 5G mmWave antenna for smartphone: Samsung |
2.1.27. | Examples of 5G mmWave antenna for smartphone: Qualcomm |
2.1.28. | mmWave 5G RF push up the RFFE cost for smartphones by 300% |
2.1.29. | Where low-loss material will be used: multiple parts inside packages |
2.1.30. | Roadmap of Df/Dk across all packaging materials as we transition from 4G to sub-6GHz 5G to mmwave 5G |
2.1.31. | Example of mmWave power amplifiers with advanced packages |
2.2. | Low-loss materials can also be used in radome cover or molding housing |
2.3. | mmWave radar technology will also need low-loss materials |
2.3.1. | Low-loss materials can also be used in Radar |
2.3.2. | Different levels of autonomy |
2.3.3. | Towards ADAS and Autonomous Driving: increasing sensor content |
2.3.4. | Towards ADAS and Autonomous Driving: increasing radar use |
2.3.5. | Different types of Radar: SRR, MRR and LRR |
2.3.6. | The evolving role of the automotive radar towards full 360deg 4D imaging radar |
2.3.7. | Automotive radars: role of legislation in driving the market |
2.3.8. | Why are radars essential to ADAS and autonomy? |
2.3.9. | Performance levels of existing automotive radars |
2.3.10. | Radar players and market share |
2.3.11. | Radar market forecasts (2020-2040) in all levels of autonomy/ADAS in vehicles and trucks (unit numbers) |
2.3.12. | Radar market forecasts (2020-2040) in all levels of autonomy/ADAS in vehicles and trucks (market value) |
2.3.13. | Radar market forecasts (2020-2040) in all levels of autonomy/ADAS in vehicles and trucks (market value) - moderate |
2.3.14. | Radar market forecasts (2020-2040) in all levels of autonomy/ADAS in vehicles and trucks (market value) - aggressive |
3. | LOW-LOSS SUBSTRATE MATERIALS |
3.1. | Introduction |
3.1.1. | Overview of low-loss substrate materials |
3.1.2. | Five important metrics for substrate materials will impact materials selection |
3.2. | Low-loss organic laminate overview |
3.2.1. | Electric properties of common polymer resin |
3.2.2. | The role of thermoplastics polymers and thermosetting polymers |
3.2.3. | Thermoset vs thermoplastics for 5G |
3.2.4. | Organic substrate materials evolution for 5G |
3.2.5. | Innovation trends for organic high frequency laminate materials |
3.2.6. | Hybrid system to reduce the cost for high frequency board |
3.2.7. | Key suppliers for high frequency and high-speed Copper Clad Laminate |
3.2.8. | Benchmark of commercialised low-loss organic laminates |
3.2.9. | Benchmark of commercialised low-loss organic laminates: Dk @ 10 GHz |
3.2.10. | Benchmark of commercialised low-loss organic laminates: Df @ 10 GHz |
3.2.11. | Other examples of low-loss laminate |
3.3. | Low-loss thermoset resins |
3.3.1. | Strategies to achieve lower dielectric loss and the trade-off |
3.3.2. | Polarizability and molar volume are the main factor for the dielectric loss |
3.3.3. | Use low polar functional groups or atomic bonds to reduce the Dk |
3.3.4. | Introducing bulky structures can reduce the Dk |
3.3.5. | Porous structure exhibits lower Dk |
3.3.6. | Rigid structure will lead to lower Df |
3.3.7. | Feature sizes will influence in the dielectric constant |
3.3.8. | Thinness will influence in the dielectric constant |
3.3.9. | Thinning the substrate at high frequencies: the challenge |
3.3.10. | Curing temperature influences the Df and Dk of polymers |
3.3.11. | Introducing an additive component might be necessary to optimise the performance |
3.3.12. | Strategy from Toray to reduce the Dk and Df for PI materials |
3.3.13. | Strategy from Taiyo Ink to reduce the Dk and Df for Epoxy materials |
3.3.14. | Strategy from Mitsubishi Gas Chemical to reduce the Dk and Df for BT resin laminate |
3.3.15. | Strategy from DuPont to reduce Dk and Df for Arylalkyl thermoset polymers |
3.3.16. | Strategy from JSR Corp to reduce Dk and Df for aromatic polyether polymer (HC polymer) |
3.3.17. | Strategy from Hitachi Chemical to reduce Dk and Df for polycyclic resin based substrate |
3.3.18. | Strategy from Taiyo Ink to reduce Dk and Df for Epoxy based build up materials |
3.3.19. | Strategy from Taiyo Ink to reduce Dk and Df for Epoxy based high-density RDL |
3.3.20. | Where is the limit of the Dk for modified thermoset |
3.3.21. | Isola |
3.3.22. | Isola: product for mmWave 5G |
3.3.23. | Low-loss thermoset laminates in Isola |
3.4. | Thermoplastic polymer: Liquid crystal polymer |
3.4.1. | LCP |
3.4.2. | Advantages and limitations of LCP |
3.4.3. | Classification of LCP |
3.4.4. | Smartphones use LCP antennas and FPCBs |
3.4.5. | LCP supply chain |
3.4.6. | Three type of LCP resins and the key players |
3.4.7. | Market share of LCP resin globally in 2019 |
3.4.8. | LCP as an alternative to PI for flexible printed circuit board |
3.4.9. | LCP vs PI: Dk and Df |
3.4.10. | LCP vs PI: moisture |
3.4.11. | LCP vs PI: flexibility |
3.4.12. | LCP vs MPI: cost |
3.4.13. | LCP vs MPI: FCCL signal loss |
3.4.14. | LCP resin and LCP-FCCL |
3.4.15. | Battle of next generation antennas for smartphone |
3.4.16. | 2G to mmwave 5G: from body or case integrated to flex PCB integrated to antenna in package |
3.4.17. | Murata: LCP antennas for smartphone |
3.4.18. | Performance of MetroCirc |
3.4.19. | Career Technology: key supplier for LCP materials |
3.4.20. | Avary/ZDT |
3.4.21. | KGK Kyodo Giken Kagaku |
3.4.22. | LCP FCCL in SYTECH for mmWave 5G |
3.4.23. | IQLP |
3.4.24. | LCP products from IQCP |
3.4.25. | LCP PCB board developed by IQLP and DuPont |
3.5. | Thermoplastic polymer: PTFE |
3.5.1. | Fluoropolymer and PTFE |
3.5.2. | Key properties of PTFE to be considered for 5G applications |
3.5.3. | Dielectric properties for PTFE |
3.5.4. | The Dk for PTFE based laminate depends on the crystallinity density |
3.5.5. | Key application of PTFE in 5G |
3.5.6. | Hybrid couplers using PTFE as substrate |
3.5.7. | Ceramic filled vs. glass-filled PTFE laminates |
3.5.8. | Concerns of using PTFE based laminate for high frequency 5G |
3.5.9. | Global manufacturing of PTFE resin |
3.5.10. | Rogers is the top supplier for PTFE laminates |
3.5.11. | Ceramic filled PTFE laminates in Rogers |
3.6. | Other organic materials |
3.6.1. | Sabic: PPO |
3.6.2. | Panasonic: MEGTRON |
3.6.3. | Solvay: PPS for base station antenna |
3.6.4. | Hydrocarbon based laminates |
3.6.5. | Polymer aerogels as antennas substrate |
3.6.6. | Blueshift: AeroZero for polyimide aerogel laminates |
3.6.7. | Other substrates: wood-derived cellulose nanofibril |
3.7. | Covestro: polycarbonates for injection molded enclosures and covers |
3.8. | Covestro: polycarbonates for thermal management |
3.9. | Inorganic substrate materials |
3.9.1. | Ceramic / LTCC |
3.9.2. | Where Ceramic / LTCC will be used in 5G |
3.9.3. | Ceramic substrates |
3.9.4. | From HTCC to LTCC |
3.9.5. | LTCC and HTCC packages substrate |
3.9.6. | HTCC metal-ceramic packages substrate |
3.9.7. | LTCC packages substrate for RF transitions |
3.9.8. | Benchmark of various LTCC materials |
3.9.9. | Dielectric constant: stability vs frequency for different inorganic substrates (LTCC, glass) |
3.9.10. | Temperature stability of dielectric parameters of HTCC and LTCC alumina |
3.9.11. | Filters are made commonly in LTCC substrate, but other technologies are in need |
3.9.12. | Filter technologies that can work at mmWave 5G and which one will be the future |
3.9.13. | Benchmark of various filter technologies for mmWave 5G applications |
3.9.14. | LTCC and ceramic substrate will continue to play a key role in for RF filters |
3.9.15. | Multilayer LTCC: production challenge |
3.9.16. | Ceramic materials can be used as thermal interface materials |
3.9.17. | NGK: multi-layer LTTC-based filters |
3.9.18. | Kyocera: LTCC substrate for package |
3.9.19. | Kyocera: LTCC vs. organic packages |
3.9.20. | Kyocera: R&D focus for LTCC packages |
3.9.21. | Kyocera LTCC for mmWave AiP (28GHz and 60 GHz) |
3.9.22. | Kyocera: multi-layer 28GHz LTCC filter |
3.9.23. | Kyocera mmWave embedded filter under development |
3.9.24. | Sunway communication: LTCC based phased array antenna for mmWave 5G mobile |
3.9.25. | Tecdia: thin film substrate and ceramic capacitors |
3.9.26. | Minicircuits: multilayer LTCC filter |
3.9.27. | TDK: LTCC AiP for 5G |
3.10. | Ferro: LTCC with wide range of Dk |
3.10.1. | Glass |
3.10.2. | Benchmark of various glass substrates |
3.10.3. | Use the HF-F for low transmission loss laminate |
3.10.4. | Glass integrated passive devices (IPD) filter for 5G by advanced semiconductor engineering |
3.10.5. | Glass substrate from Hitachi Chemical |
3.10.6. | Glass: an excellent filter substrate? |
3.10.7. | Glass-based single-layer transmission-line filters |
3.11. | Summary |
3.11.1. | Substrate properties and process options |
3.11.2. | Benchmark of different substrates |
3.11.3. | Substrates options for mmWave filters |
4. | LOW-LOSS MATERIALS FOR ADVANCED PACKAGE |
4.1. | Introduction |
4.1.1. | Roadmap of Df/Dk across all packaging materials as we transition from 4G to sub-6GHz 5G to mmwave 5G |
4.1.2. | Overview of high density package materials |
4.1.3. | Low-loss polymer materials for coating in packages |
4.1.4. | Possible low-loss substrates for mmWave 5G advanced packages |
4.1.5. | Flexible substrate has became a trend |
4.1.6. | Low-loss substrate materials as for package |
4.2. | Overview of advanced packaging |
4.2.1. | Top players in the electronic packaging business by revenue |
4.2.2. | Electronic packaging: the rise of China |
4.2.3. | IC sales and global GDP |
4.2.4. | Split of advanced electronic packaging market by packaging type |
4.2.5. | From simple to complex electronic packages: technology evolution |
4.3. | SiP (system-in-package) introduction |
4.3.1. | What is SiP or System-in-Package |
4.3.2. | SiP vs SoC vs SoB |
4.3.3. | SiP and different packaging techniques |
4.3.4. | The SiP Tool box |
4.3.5. | A rising trend towards more SiP content |
4.4. | General trends in size and feature of boards and packages |
4.4.1. | Classification of packages by power level |
4.4.2. | Resolution and layer thickness going from wafer to RDL to substrate to board |
4.4.3. | Increasing resolution and complexity and reducing thickness of PCBs/SLP |
4.4.4. | Trends in laser technology and pattern formation techniques for HDI PCB, SLP, and package |
4.5. | Towards AiP (antenna in a package) |
4.5.1. | 2G to mmwave 5G: from body or case integrated to flex PCB integrated to antenna in package |
4.5.2. | Is antenna on a chip possible? |
4.5.3. | Antenna on a package (AoP) with metal stamping |
4.5.4. | Antenna on a package (AoP) with laser direct structuring |
4.5.5. | Qualcomm: Antenna in package design (antenna on a substrate with flip chipped ICs) |
4.5.6. | Georgia Tech: SiP with antenna on a glass-core substrate |
4.5.7. | Intel: SiP with dual-polarized patch array antenna |
4.5.8. | JCET: PoP or antenna substrate on WLP approach |
4.5.9. | ASE: SiP with AiP based on FOWLP and using through-mold via |
4.5.10. | AiP FCBGA vs AiP FOWLP |
4.5.11. | eWLP vs flip chip and BGA in terms of insertion loss |
4.5.12. | TSMC: InFO AiP showing low-loss for mmWave |
4.5.13. | Amkor: a multitude of AiP approaches including WLP, SWIFT, PoP, etc |
4.5.14. | Towards ever lower low tan and higher surface smoothness |
4.5.15. | TDK: AiP based on LTCC |
4.5.16. | Wideband low-profile antennas for 5G AiP application by IMECAS |
4.6. | EMC/MUF |
4.6.1. | What are EMC and MUFs? |
4.6.2. | Epoxy Molding Compound (EMC) |
4.6.3. | Key parameters to compare EMC materials |
4.6.4. | Dielectric constant is another important factor for 5G applications |
4.6.5. | Innovation for low dielectric constant and dissipation factor epoxy resin |
4.6.6. | Some commercial EMC with low dielectric constant |
4.6.7. | Epoxy resin: parameters of different resins and hardener systems |
4.6.8. | Epoxy resin: price and market |
4.6.9. | Fillers |
4.6.10. | EMC is important for warpage management |
4.6.11. | Molded underfill (MUF) |
4.6.12. | MUF is a key material for flip clip molding technology |
4.6.13. | Liquid molding compound for compression molding |
4.6.14. | Supply chain for EMC materials |
4.6.15. | EMC innovations trends for 5G applications |
4.6.16. | High warpage control EMC are needed for FO-WLP |
4.6.17. | Possible solutions for warpage and die shift |
4.6.18. | Sumitomo Bakelite |
4.6.19. | Kyocera: Epoxy Molding Compounds for semiconductors |
4.6.20. | Summary of EMC provided by Kyocera |
4.6.21. | Samsung SDI |
4.6.22. | Hitachi Chemical |
4.6.23. | Packaging materials product line up in Hitachi Chemical |
4.6.24. | A sulfur-free EMC by Hitachi Chemical |
4.6.25. | KCC |
4.7. | Ink based EMI shielding |
4.7.1. | What is electromagnetic interference shielding and why it matters to 5G |
4.7.2. | Challenges and key trends for EMI shielding for 5G devices |
4.7.3. | Package-level EMI shielding |
4.7.4. | Conformal coating: increasingly popular |
4.7.5. | Has package-level shielding been adopted? |
4.7.6. | Examples of package-level shielding in smartphones |
4.7.7. | Which suppliers and elements have used EMI shielding? |
4.7.8. | Overview of conformal shielding process |
4.7.9. | What is the incumbent process for PVD sputtering? |
4.7.10. | Screen printed EMI shielding: process and merits |
4.7.11. | Spray-on EMI shielding: process and merits |
4.7.12. | Suppliers targeting ink-based conformal EMI shielding |
4.7.13. | Henkel: performance of EMI ink |
4.7.14. | Duksan: performance of EMI ink |
4.7.15. | Ntrium: performance of EMI ink |
4.7.16. | Clariant: performance of EMI ink |
4.7.17. | Fujikura Kasei: performance of EMI ink |
4.7.18. | Spray machines used in conformal EMI shielding |
4.7.19. | Particle size and morphology choice |
4.7.20. | Ink formulation challenges: thickness and Ag content |
4.7.21. | Ink formulation challenges: sedimentation prevention |
4.7.22. | EMI shielding: inkjet printed particle-free Ag inks |
4.7.23. | Agfa: EMI shielding prototype |
4.7.24. | Has there been commercial adoption of ink-based solutions? |
4.7.25. | Compartmentalization of complex packages is a key trend |
4.7.26. | The challenge of magnetic shielding at low frequencies |
4.7.27. | Value proposition for magnetic shielding using printed inks |
5. | FORECAST 2021-2030 |
5.1. | Low-loss materials areas forecast in 5G by frequency |
5.2. | Low-loss materials areas forecast in 5G by market segments |
5.3. | Low-loss materials areas forecast in 5G by types of materials |
5.4. | Low-loss materials forecast in 5G by revenue |
5.5. | 5G base station installation forecast by frequency |
5.6. | 5G base station instalment number forecast by type of cell (macro, micro, pico/femto) |
5.7. | Low-loss materials areas forecast in 5G base station by frequency |
5.8. | Low-loss materials areas forecast in 5G base station by components |
5.9. | Low-loss materials areas forecast in 5G base station by materials types |
5.10. | 5G mobile shipment units |
5.11. | Low-loss materials areas forecast in 5G smartphone by unit number and area |
5.12. | Low-loss materials areas forecast in 5G smartphones by material types |
5.13. | Shipment of customer promised equipment and hotspots by units |
5.14. | Low-loss materials areas forecast in 5G CPE and hotspots by frequency |
5.15. | Low-loss materials areas forecast in 5G CPE and hotspots by material types |