This report is no longer available. Click here to view our current reports or contact us to discuss a custom report.
If you have previously purchased this report then please use the download links on the right to download the files.
EXECUTIVE SUMMARY AND CONCLUSIONS | |
1. | INTRODUCTION |
1.1. | Importance of printed and potentially printed electronics |
1.1. | Envisaged benefits of TFTCs in RFID and other low-cost applications when compared with envisaged silicon chips |
1.1. | Growth in sales of silicon chips by value compared with growth in sales of printed and thin film electronic components. |
1.1.2. | Awesome new capability creates new markets |
1.1.3. | This is the new printing before it is the new electronics |
1.1.4. | Importance of flexibility, light weight and low cost |
1.1.5. | Creating radically new products |
1.1.6. | Improving existing products |
1.2. | How printed electronics is being applied |
1.2. | Typical carrier mobility in different potential TFTC semiconductors (actual and envisaged) |
1.2. | Examples of the radically new capabilities of printed electronics. |
1.3. | Types of early win and longer term project involving printed electronics 1995-2025 |
1.3. | Properties of the Polyera/ BASF n type printing ink for organic field effect transistors consisting of N,N Dioctyl-dicyanoperylene-3,4:9,10-bis(dicarboxyamide), PD18-CN2 |
1.3. | Importance of printed and thin film transistors and memory |
1.3.1. | Vision for the future |
1.3.2. | Benefits of thin film transistors and memory |
1.4. | Transistor basics and value chain |
1.4. | Logic circuits printed by PolyIC in Germany using a reel to reel process |
1.4.1. | How a transistor works |
1.4.2. | TFTC value chain |
1.5. | Transistor geometry and parameters |
1.5. | How printed electronics is being applied to products |
1.5.1. | Conventional geometry - horizontal transistors |
1.5.2. | New vertical geometry - vertical VFETs |
1.5.3. | New geometry - single layer transistors Plastic E Print |
1.5.4. | On off ratio and leakage current |
1.5.5. | Frequency, carrier mobility and channel length |
1.6. | Choice of materials for these transistors |
1.6. | Printed Electronics Applications |
1.6.1. | The thin film transistors on the back of today's LCD TV - a dead end? |
1.6.2. | Organic vs inorganic materials |
1.7. | Choice of semiconductor |
1.7. | Plastic film scanner |
1.7.2. | Organic semiconductors |
1.7.3. | Crystalline Silicon is a dead end? |
1.7.4. | Compound inorganic semiconductors |
1.7.5. | Breakthrough in printed inorganic performance in from Kovio |
1.7.6. | CMOS and the n type difficulty |
1.7.7. | Ambipolar semiconductors |
1.7.8. | Carbon nanotubes as thin film semiconductors |
1.7.9. | Importance of the dielectric layer |
1.7.10. | Importance of codeposition |
1.7.11. | Memory basics and value chain |
1.8. | Substrates |
1.8. | The value chain for manufacturing of printed electronics |
1.8.1. | High temperature and protective substrates vs low cost flexible |
1.8.2. | Polymers |
1.8.3. | Paper |
1.9. | Printing processes |
1.9. | Value chain for TFTCs and examples of migration of activity for players |
1.9.1. | Requirements |
1.9.2. | Ink jet vs fast reel to reel printing |
1.9.3. | Transfer printing of single crystals |
1.9.4. | 3D printed silicon transistors, Japan |
1.10. | Traditional geometry for a field effect transistor |
1.11. | Vertical organic field effect transistor VOFET showing a short channel length and a large cross section for current flow. The substrate is shown at the bottom. |
1.12. | ORFID view of the problems of the traditional horizontal transistor |
1.13. | Examples of vertical transistors |
1.14. | ORFID VOFET approach |
1.15. | The Plastic E print process |
1.16. | Structure of SSD diode and device operation |
1.17. | Principle of self aligned printing by Plastic Logic |
1.18. | Prevalence of organic vs inorganic materials in printed and thin film electronics today |
1.19. | PEDOT:PSS |
1.20. | Motorola summary of thin film FET issues concerning the dielectric layer . |
1.21. | Motorola view of available gate materials |
1.22. | The simple capacitor like structure for many printed devices including memory |
1.23. | Choices of substrate for printed electronics |
1.24. | Change in stiffness of PET vs PEN substrate material with temperature. |
1.25. | Biaxially oriented crystalline film |
1.26. | Factors influencing film choice- property set |
1.27. | Some candidate materials for flexible substrates |
1.28. | Requirements in printing thin film transistors |
1.29. | The big picture for printing transistors and memory in ever increasing numbers |
1.30. | Reel to reel printing of transistors and complete RFID labels by Poly IC |
1.31. | Options for high speed, low-cost printing of TFTCs |
1.32. | Choice of printing technology for silver RFID antennas today, where Omron and Avery Dennison use gravure despite volumes being no more than hundreds of millions. |
1.33. | Performance improvement in thermal ink jet over the years. |
1.34. | Benefits of ink jet printing of electronics |
1.35. | Thermal ink jet printed transistor evolution |
1.36. | Hybrid process improves performance |
1.37. | Transfer printed GaAs FETs on PET |
1.38. | Semprius opportunity space |
1.39. | Seiko Epson 3D printed silicon transistor |
2. | ORGANIC TRANSISTORS AND MEMORY - DEVELOPMENTS |
2.1. | History and prospective benefits |
2.1. | Printable polymer transistor dielectric PE-DI-1900 from BASF and Polyera |
2.1. | 64-bit organic transponder chip based on dual-gate thin-film-transistor technology, achieving 4.3kb/s data rate. |
2.2. | Holst Centre's 128 bit RFID transponder on plastic film. |
2.2. | RFID labels at Holst Centre |
2.3. | RFID labels from Poly IC |
2.3. | ACREO technology platform |
2.4. | Components of the ACREO low functionality approach to transistors |
2.4. | Lowest performance, lowest cost - ACREO |
2.5. | Organic dielectrics and ferroelectrics |
2.5. | ACREO electrochemical transistors |
2.6. | Electrochemical components electrical effects |
2.6. | High permittivity organic transistor gates by ionic drift |
2.7. | ACREO electrochemical transistors |
2.8. | ACREO objectives for electrochemical transistor circuits |
2.9. | ACREO electrochemical timer transistor |
2.10. | ACREO matrix addressed display. |
2.11. | Interactive games printed on paper |
2.12. | Concept demonstrator integrating printed electrochemical components and its patented "Dry Phase Patterning" of metal conductors. |
2.13. | ACREO applicational ideas |
2.14. | Transistor structure used |
2.15. | Ion modulation |
3. | INORGANIC COMPOUND TRANSISTORS - DEVELOPMENTS |
3.1. | History and summary of potential benefits |
3.1. | A summary of the promised benefits of polymer ink used in pilot production of organic transistors vs two thin film inorganic semiconductors for transistors vs nanosilicon ink |
3.1. | Early Hewlett Packard work on ink jet printing of inorganic compound semiconductors |
3.2. | Printed flexible inorganic semiconductor |
3.2. | Some properties of new thin film dielectrics |
3.2. | Semiconductors |
3.2.1. | Zinc oxide based transistor semiconductors |
3.2.2. | Amorphous InGaZnO |
3.2.3. | Progress towards p-type metal oxide semiconductors |
3.2.4. | Transfer printing silicon, GaN and GaAs on film |
3.2.5. | Tin disulphide |
3.3. | Inorganic dielectrics in devices |
3.3. | Benefits and challenges of R2R |
3.3. | Transparent transistor |
3.3.1. | Solution processed barium titanate nanocomposite |
3.3.2. | Hafnium oxide and HafSOx |
3.3.3. | Hybrid inorganic dielectrics - zirconia |
3.3.4. | Aluminium, lanthanum, tantalum and other oxides |
3.3.5. | Arizona State University's Flexible Display Center (FDC) and the University of Texas at Dallas |
3.4. | Chromium based technology |
3.4. | Imprint lithography |
3.4. | Material choices for transparent transistors |
3.4.1. | Printed oxide transistors at Oregon State University |
3.5. | Silicon nanoparticle ink |
3.5. | Amorphous thin film inorganic dielectric |
3.5.1. | Kovio |
3.6. | Printing aSi reel to reel |
3.6. | Example of ZnO based transistor circuit that is transparent. |
3.7. | Using a nanolaminate as an e-platform |
3.7. | High-Mobility Ambipolar Organic-Inorganic Hybrid Transistors |
3.8. | Do organic transistors have a future? |
3.8. | TEM images of solution processed nanolaminates |
3.9. | Cross-sectional schematic view of an amorphous oxide TFT |
3.10. | Transparent and flexible active matrix backplanes fabricated on PEN films |
3.11. | Semprius transfer printing |
3.12. | Motorola high permittivity printable OFET dielectric using a barium titanate organic nanocomposite. |
3.13. | Hybrid organic-inorganic transistor and right dual dielectric transistor |
3.14. | Motorola high permittivity printable OFET dielectric using a barium titanate organic nanocomposite. |
3.15. | Motorola results - the nanotechnology used |
3.16. | Lower operating voltage |
3.17. | NHK transistor on polycarbonate film with tantalum oxide gate. |
3.18. | Solution-based activities and capabilities |
3.19. | Printing inorganic films |
3.20. | Aqueous processing of oxides |
3.21. | Examples of the challenges |
3.22. | A typical test transistor with HafSOx dielectric |
3.23. | Performance of Kovio's ink versus others by mobility |
3.24. | Road map |
3.25. | The web rolled on the core is its own clean room |
3.26. | Basic Imprint Lithography Process |
4. | TECHNOLOGY AND SUPPLIERS - LARGE MEMORY |
4.1. | Types of memory |
4.1. | Some of the small group of contestants for large capacity printed memory |
4.1. | An all-organic permanent memory transistor |
4.2. | TFE memory compared with the much more complex DRAM in silicon |
4.2. | Big difference in making small vs large memory |
4.3. | Strategy of various developers of thin film and printed memory |
4.3. | Structure of TFE memory |
4.3.2. | Thin Film Electronics TFE memory |
4.4. | TFE priorities for commercialisation of mega memory |
5. | TECHNOLOGY AND SUPPLIERS -CONDUCTORS |
5.1. | Organic vs inorganic conductors |
5.1. | Benefits and challenges of organic vs inorganic conductors for printed and thin film transistors, memory and their interconnects. |
5.1. | InkTec soluble silver inks. Left: Transparent Electronic Ink. Right: Transparent Inkjet Inks |
5.2. | Patterning using InkTec ink |
5.2. | Conductance in ohms per square for the different printable conductive materials compared with bulk metal |
5.2. | Organic conductors |
5.3. | Inorganic conductors |
5.3. | Examples of ink suppliers progressing printed RFID antennas etc |
5.3. | Typical SEM images of CU flake C1 6000F. Copper flake |
5.3.2. | Comparison of metal options |
5.3.3. | Polymer - metal suspensions |
5.3.4. | Silver solution |
5.4. | Properties and morphology of single walled carbon nanotubes |
5.4. | Some companies progressing ink jettable conductors |
5.4. | Progress with new conductive ink chemistries and cure processes |
5.4.1. | Graphene hybrid technology |
5.5. | Nanotube shrink-wrap from Unidym |
5.5. | Carbon nanotubes |
5.5. | Comparison of metal etch (e.g. copper and aluminium) conductor choices |
5.6. | Electroless metal plate - Additive print process with weakly conductive ink (e.g. plastics or carbon) followed by wet metal plating |
5.6. | Carbon Nanotubes and printed electronics |
5.7. | Developers of Carbon Nanotubes for Printed Electronics |
5.7. | Electro metal plate - Additive print process with weakly conductive ink (e.g. plastics or carbon) followed by dry metal plating |
5.8. | Printable metallic conductors cure at LT e.g. silver based ink |
5.9. | A typical process cost comparison for RFID antennas |
5.10. | Possibilities for various new printed conductors. |
5.11. | Charge carrier mobility of carbon nanotubes compared with alternatives |
5.12. | Developers of Carbon Nanotubes for Printed Electronics |
6. | MARKETS 2010-2020 |
6.1. | Global market for printed electronics logic and memory 2010-2020 in billions of dollars, with % printed and % flexible |
6.1. | Transistors - first significant commercial product in 2010 |
6.1. | Forecasts 2010-2020 |
6.2. | Assumptions for our forecasts |
6.2. | Sales of printed and potentially printed transistors and memory by application in 2011 |
6.2. | Primary assumptions of organic electronics in full production 2007 to 2025 |
6.3. | Global electronics industry by application |
6.3. | Sales of printed and potentially printed transistors and memory by application in 2016 |
6.3. | Split between backplane, RFID and other applications to 2020 |
6.4. | Size of relevant markets that are impacted |
6.4. | Sales of printed and potentially printed transistors and memory by application in 2020 |
6.4. | End user markets relevant to printed electronics |
6.5. | Global semiconductor shipments monthly and three month average 1983 to 2005 |
6.5. | Potential, in billions yearly, for global sales of RFID labels and circuits printed directly onto products or packaging. Item level is shown in red. These are examples. |
6.5. | Potential for non-RFID electronic labels |
6.6. | Potential for RFID labels 2010-2020 |
6.6. | Market for printed and potentially printed electronic devices by chemistry of key element 2010-2020 in billions of dollars |
6.6. | Statistics for electronic labels and their potential locations |
6.7. | Number (in millions) of passive tags by application 2010-2021 |
6.7. | Printed electronics materials and other elements of device income 2010-2020 |
6.7. | Market for RFID |
6.7.2. | Ultimate potential for highest volume RFID |
6.7.3. | Penetration of chipless RFID |
6.8. | Value of passive tags by application 2010-2021 (US Dollar Millions) |
6.8. | Impact on silicon |
6.8. | Current options and challenges for backplane TFTs |
6.9. | Forecasts for materials |
6.9. | Choices of digital chipless RFID technologies |
6.10. | Chipless versus Chip RFID, in numbers of units (billions) 2010-2021 (includes passive and active RFID) |
6.10. | Backplane transistor arrays hold up AMOLED market penetration |
6.11. | Impediments to the commercialisation of printed transistors and memory |
6.11. | Market size of a variety of chipless solutions, US$ millions |
6.12. | Scope for printed TFTCs to create new markets or replace silicon chips |
6.13. | Market for printed and potentially printed electronic devices 2010-2020 in billions of dollars |
6.14. | Printed electronics materials and other elements of device income 2010-2020 in billions of dollars |
7. | COMPARISON OF ORGANISATIONS INVOLVED IN TFTCS AND THEIR MATERIALS |
7.1. | Objectives and challenges of 80 organisations developing printed and potentially printed transistor and/ or memory circuits and/or their materials |
7.1. | Semiconductor, process, geometry, targets, challenges and objectives for 80 organisations in printed and thin film transistors and/ or memory |
7.1. | Left is diode logic OR gate and the right is a bridge rectifier |
7.2. | Micrograph of an SSD array and the 110 GHz microwave measurement setup |
7.2. | Profiles of 45 organisations in printed and thin film transistors and/ or memory |
7.2. | Objectives and challenges of 23 organizations developing inks and their materials for printed and potentially printed transistors and memory |
7.2.1. | ACREO |
7.2.2. | AU Optoelectronics |
7.2.3. | BASF |
7.2.4. | Canon |
7.2.5. | CEA Liten |
7.2.6. | DaiNippon Printing |
7.2.7. | Dow Chemical |
7.2.8. | Ecole Superiure des Mines Saint Etienne |
7.2.9. | ePrint |
7.2.10. | ETRI (Electronics and Telecommunications Research Institute) |
7.2.11. | Fraunhofer Institute for Photonic Microsystems |
7.2.12. | Fraunhofer Institute for Reliability and Microintegration |
7.2.13. | Fujitsu |
7.2.14. | H.C.Starck |
7.2.15. | Hewlett Packard |
7.2.16. | Hitachi |
7.2.17. | Impika |
7.2.18. | Industrial Technology Research Institute |
7.2.19. | Institute of Microelectronics |
7.2.20. | International University of Bremen |
7.2.21. | Japan Science and Technology Agency |
7.2.22. | Korea Electronics Technology Institute |
7.2.23. | Korea Institute of Science and Technology |
7.2.24. | Kovio |
7.2.25. | Kyung Hee University |
7.2.26. | Matsushita |
7.2.27. | Merck Chemicals |
7.2.28. | NHK |
7.2.29. | Oregon State University |
7.2.30. | Palo Alto Research Center |
7.2.31. | Paru |
7.2.32. | Plastic Logic |
7.2.33. | Poly IC |
7.2.34. | Samsung Advanced Institute of Technology SAIT |
7.2.35. | Semiconductor Energy Laboratory |
7.2.36. | Sony |
7.2.37. | Sunchon National University |
7.2.38. | Thin Film Electronics |
7.2.39. | Tohoku University |
7.2.40. | Tokyo Institute of Technology |
7.2.41. | Toppan Printing |
7.2.42. | University of California Los Angeles |
7.2.43. | University of Cambridge |
7.2.44. | University of Tokyo |
7.2.45. | Xerox |
7.3. | 42 organisations that developing TFTCs and their materials and their priorities for products to be sold |
7.3. | Fujitsu "electronic paper" display |
7.4. | Researchers and users play major roles with active logistic support from JST |
7.5. | High Mobility OTFT |
7.6. | Summary and Conclusion |
7.7. | PARC have developed innovative displays |
7.8. | Materials and devices. Fully printed RFID tag in development. |
7.9. | Fully printed EAS (anti theft) tag shown on website. |
7.10. | Prototype HF tag and reader |
7.11. | Samsung OLED display |
7.12. | A circuit by Associate Professor Zhenan Bao. |
APPENDIX 1: IDTECHEX PUBLICATIONS AND CONSULTANCY | |
TABLES | |
FIGURES |
Pages | 292 |
---|---|
Tables | 45 |
Figures | 119 |
Companies | 100 |
Forecasts to | 2019 |