1. | EXECUTIVE SUMMARY |
1.1. | Key Current & Future Photonic Integrated Circuits Applications |
1.2. | What are Photonic Integrated Circuits (PICs)? |
1.3. | Electronic and Photonic Integrated Circuits Compared |
1.4. | Advantages and Challenges of Photonic Integrated Circuits |
1.5. | Integration schemes of PICs |
1.6. | Integrated Photonic Transceivers |
1.7. | Datacom PIC-based Transceiver Market Key Players |
1.8. | Roadmap for PIC-based Transceivers (chart) |
1.9. | Operational Frequency Windows of Optical Materials |
1.10. | Silicon and Silicon-on-insulator (SOI) |
1.11. | Silicon Nitride (SiN) |
1.12. | Indium Phosphide |
1.13. | Organic Polymer on Silicon |
1.14. | Thin Film Lithium Niobate |
1.15. | Barium Titanite and Rare Earth metals |
1.16. | IDTechEx Platform Score (Materials Benchmarked) |
1.17. | PIC Material Platforms Benchmarked (Visualized) |
1.18. | Photonic Integrated Circuit Market (Materials) |
1.19. | Forecasting the PIC Transceiver Market: Changes From the 2024 Edition |
1.20. | PIC Transceivers for AI Units Forecast |
1.21. | Forecasting PIC Transceiver Pricing |
1.22. | PIC Datacom Transceiver Market Forecast |
1.23. | PIC-based Transceivers for 5G Forecast (Units and Market) |
1.24. | Quantum PIC Market Forecast |
1.25. | PIC-based Sensor Market Forecast |
1.26. | PIC-based LiDAR Market Forecast |
1.27. | Total PIC Market Data |
1.28. | Company Profiles and Articles included with this report |
2. | INTRODUCTION AND KEY CONCEPTS |
2.1. | Introduction |
2.1.1. | Silicon Photonics Definitions |
2.1.2. | What is the difference between PICs and Silicon Photonics? |
2.2. | Technology Background |
2.2.1. | What is an Integrated Circuit (IC)? |
2.2.2. | What are Photonic Integrated Circuits (PICs)? |
2.2.3. | Photonics versus Electronics |
2.2.4. | Electronic and Photonic Integrated Circuits Compared |
2.2.5. | Advantages and Challenges of Photonic Integrated Circuits |
2.2.6. | Silicon and Photonic Integrated Circuits |
2.2.7. | Key benefits of PICs |
2.3. | Photonic Integrated Circuit Key Concepts |
2.3.1. | Optical IO, Coupling and Couplers |
2.3.2. | Emission and Photon Sources/Lasers |
2.3.3. | Detection and Photodetectors |
2.3.4. | Compound Semiconductor Lasers and Photodetectors (III-V) |
2.3.5. | Modulation, Modulators, and Mach-Zehnder Interferometers |
2.3.6. | Light Propagation and Waveguides |
2.3.7. | Optical Component Density |
2.3.8. | Basic Optical Data Transmission |
2.3.9. | PIC Architecture |
3. | MATERIALS AND MANUFACTURING |
3.1. | Introduction |
3.1.1. | Wafers |
3.1.2. | Wafer sizes by platform |
3.1.3. | Integration schemes |
3.1.4. | Heterogenous Integration Techniques Compared |
3.1.5. | Micro-Transfer Printing for Heterogenous Integration of InP and Silicon Photonics |
3.1.6. | Operational Frequency Windows of Optical Materials |
3.1.7. | Important Wavelengths/Frequencies Summarized |
3.1.8. | Changing the Way Materials Behave in PICs |
3.1.9. | Research Institutions and PIC-only Foundries developing PICs (1) |
3.1.10. | Research Institutions and PIC-only Foundries developing PICs (2) |
3.1.11. | Research Institutions and PIC-only Foundries developing PICs (3) |
3.1.12. | Silicon and Silicon-on-insulator (SOI) |
3.1.13. | SOI and Silicon PIC Players |
3.1.14. | Silicon Semiconductor foundry in-house technologies |
3.1.15. | TSMC's entry to the silicon photonics market |
3.1.16. | CEA-Leti's and imec's Latest SOI PIC developments |
3.1.17. | SOI Benchmarked |
3.1.18. | Silicon Nitride (SiN) |
3.1.19. | SiN PIC Players |
3.1.20. | SiN Key Foundries |
3.1.21. | Case Study: AEPONYX SiN PICs |
3.1.22. | SiN Benchmarked |
3.1.23. | Silicon (SOI and SiN) device heterogenous integration |
3.1.24. | Indium Phosphide |
3.1.25. | InP PIC Players |
3.1.26. | InP Manufacturing |
3.1.27. | Indium Phosphide Incumbent Integration Technologies (1) |
3.1.28. | Indium Phosphide Incumbent Integration Technologies (2) |
3.1.29. | InP Benchmarked |
3.1.30. | Organic Polymer on Silicon |
3.1.31. | Case Study: How is Organic Polymer PICs are Manufactured (Lightwave Logic) |
3.1.32. | Polymer on Insulator Benchmarked |
3.1.33. | Thin Film Lithium Niobate |
3.1.34. | How is TFLN Manufactured |
3.1.35. | TFLN Integration and Modulator Geometry |
3.1.36. | TFLN Benchmarked |
3.1.37. | Barium Titanite and Rare Earth metals |
3.1.38. | Case Study: Lumiphase BTO-enhanced PICs |
3.1.39. | Case Study: How BTO PICs are Manufactured (Lumiphase) |
3.1.40. | BTO Benchmarked |
3.2. | Materials Benchmarked |
3.2.1. | IDTechEx Platform Score (Materials Benchmarked) |
3.2.2. | PIC Material Platforms Benchmarked (Visualized) |
3.2.3. | The PIC Design Cycle: Multi-Project Wafers |
3.2.4. | Case Study: Infinera Vertically Integrated PICs |
3.2.5. | Case Study: Coherent (II-VI) |
4. | APPLICATIONS |
4.1. | Future Applications for Photonic Integrated Circuits |
4.2. | The Semiconductor Energy Crisis |
4.2.1. | Semiconductor related-energy consumption growing rapidly |
4.2.2. | Imec: CO2 emissions per logic technology node are doubling every 10 years |
4.2.3. | PICs to improve compute efficiency beyond Moore's law |
4.3. | Photonic Integrated Circuits for High-Performance Transceivers for Data Centers |
4.3.1. | How an Optical Transceiver Works |
4.3.2. | PICs for data communication |
4.3.3. | Integrated Photonic Transceivers |
4.3.4. | Which Transceivers are using PICs? |
4.3.5. | PICs for 400G+ |
4.3.6. | Pluggable optics |
4.3.7. | 400G+ Pluggable Optic Form Factors |
4.3.8. | Pluggable Optical Line System (POLS) |
4.3.9. | Communication components - TROSA |
4.3.10. | Why do AI models need high-performance transceivers? |
4.3.11. | Datacom PIC-based Transceiver Market Key Players |
4.3.12. | Key Player Latest Datacom Transceivers Benchmarked |
4.3.13. | Interconnect families |
4.3.14. | Lanes in interconnect |
4.3.15. | Comparing roadmaps |
4.3.16. | Linear Drive and Linear Pluggable Optics (LPO) |
4.3.17. | Roadmap for PIC-based Transceivers (chart) |
4.4. | Photonic Integrated Circuits for On-Device Interconnects |
4.4.1. | Interconnects |
4.4.2. | Development trend for optical transceivers in high-end data centers |
4.4.3. | Overcoming the von Neumann bottleneck |
4.4.4. | Electrical Interconnects Case Study: Nvidia Grace Hopper for AI |
4.4.5. | Why improve on-device interconnects? |
4.4.6. | Improved Interconnects for Switches |
4.4.7. | Case Study: Ayer Labs TeraPHY |
4.4.8. | Case Study: Lightmatter's 'Passage' PIC-based Interconnect |
4.5. | Advanced Packaging and Co-Packaged Optics |
4.5.1. | Evolution roadmap of semiconductor packaging |
4.5.2. | Semiconductor packaging - an overview of technology |
4.5.3. | Key metrics for advanced semiconductor packaging performance |
4.5.4. | Four key factors of advanced semiconductor packaging |
4.5.5. | Overview of interconnection technique in semiconductor packaging |
4.5.6. | 2.5D advanced semiconductor packaging technology portfolio |
4.5.7. | Roles of glass in semiconductor packaging |
4.6. | Hybrid integration: Co-Packaged Optics |
4.6.1. | The emergence of co-packaged optics (CPO) |
4.6.2. | Co-packaged optics for network switch |
4.6.3. | Pluggable optics vs CPO - 1 |
4.6.4. | Pluggable optics vs CPO - 2 |
4.6.5. | Optical dies integration for compute silicon |
4.6.6. | Future challenges in CPO |
4.6.7. | Co-packaging vs Co-packaged optics (CPO) |
4.6.8. | Co-packaged optics - package structure |
4.6.9. | Value proposition of CPO |
4.6.10. | Co-Packaged Optics (CPO), key for advancing switching and AI networks |
4.6.11. | Key technology building blocks for CPO |
4.6.12. | Key packaging components for CPO |
4.6.13. | Broadcom's CPO development timeline |
4.6.14. | Broadcom's CPO portfolio |
4.6.15. | Fan-Out Embedded Bridge (FOEB) Structure for Co-Packaged Optics |
4.6.16. | Glass-based Co-packaged optics - vision |
4.6.17. | Glass-based Co-packaged optics - Packaging structure |
4.6.18. | Glass-based Co-packaged optics - process development |
4.6.19. | Corning's 102.4 Tb/s test vehicle |
4.6.20. | Turn-Key solution required for CPO |
4.7. | Photonic Engines and Accelerators for AI and Neuromorphic Compute |
4.7.1. | Photonic Processors - Overview |
4.7.2. | Photonic Processing for AI |
4.7.3. | Programmable Photonics, Software-Defined Photonics, & Photonic FPGAs |
4.7.4. | Case Study: iPronics' Programmable PIC |
4.8. | Photonic Integrated Circuits for Quantum Computing |
4.8.1. | Introduction to Quantum Computing |
4.8.2. | Quantum computing - photonics |
4.8.3. | Overview of photonic platform quantum computing |
4.8.4. | Comparing key players in photonic quantum computing |
4.8.5. | PICs for Quantum |
4.8.6. | Trends for Quantum PICs at SPIE Photonics West 2024 |
4.8.7. | Photonic Integrated Circuits versus Optical Tables and Fixed Optics |
4.8.8. | Advantages of Photonic Integrated Circuits versus Optical Tables and Fixed Optics |
4.8.9. | Disadvantages of Photonic Integrated Circuits versus Optical Tables and Fixed Optics |
4.8.10. | CEA Leti's Goals for Quantum PICS |
4.8.11. | Quantum Photonic Building Blocks (imec) |
4.8.12. | Initialization, manipulation, and readout of photonic platform quantum computers |
4.8.13. | Which platform for quantum PICs? |
4.8.14. | Future PIC Requirements of the Quantum Industry |
4.8.15. | Roadmap for photonic quantum hardware (chart) |
4.8.16. | SWOT Analysis: Photonic Quantum Computers |
4.9. | Photonic Integrated Circuit-based Sensors |
4.9.1. | Opportunities for PIC Sensors: Biomedical |
4.9.2. | Market players developing PIC Biosensors |
4.9.3. | Rockley Photonics: IP sale and likely end of PIC involvement |
4.9.4. | Opportunities for PIC Sensors: Gas Sensors |
4.9.5. | Market players developing PIC-based Gas Sensors |
4.9.6. | Opportunities for PIC Sensors: Structural Health Sensors |
4.9.7. | Market players developing Spectroscopic PICs |
4.10. | Photonic Integrated Circuit-based LiDAR |
4.10.1. | LiDAR in automotive applications |
4.10.2. | Opportunities for PIC Sensors: LiDAR Sensors |
4.10.3. | Core Aspects of LiDAR |
4.10.4. | Market players developing PIC-based LiDAR (1) |
4.10.5. | Market players developing PIC-based LiDAR (2) |
4.10.6. | LiDAR Wavelength and Material Trends |
4.10.7. | Major challenges of PIC-based FMCW lidars |
4.10.8. | E-Noses for Automotive |
5. | FORECASTS |
5.1. | Forecasting the PIC Transceiver Market: Changes From the 2024 Edition |
5.2. | Forecasting Growth in GPUs and Other Accelerators |
5.3. | Forecasts with table: Server boards, CPUs and GPUs/Accelerators |
5.4. | Optical Transceivers per AI Accelerator (Methodology) |
5.5. | Methodology - Transceiver Market Share by Speed |
5.6. | PIC Transceivers for AI Units Forecast |
5.7. | PIC Transceivers for AI Units Forecast |
5.8. | Forecasting PIC Transceiver Pricing |
5.9. | Forecasting PIC Transceiver Pricing: Tables |
5.10. | PIC Datacom Transceiver Market Forecast |
5.11. | PIC Datacom Transceiver Revenue Forecast with Table |
5.12. | PIC-based Transceivers for 5G Forecast (Units and Market) |
5.13. | Quantum PIC Market Forecast |
5.14. | Quantum PIC Market Forecast with Table |
5.15. | PIC-based Sensor Market Forecast |
5.16. | PIC-based LiDAR Market Forecast |
5.17. | Photonic Integrated Circuit Market (Materials) |
5.18. | Photonic Integrated Circuit Market by Material with Table |
5.19. | Total PIC Market Data |
6. | COMPANY PROFILES |
6.1. | Profiles |
6.1.1. | ACCRETECH (Grinding Tool) |
6.1.2. | AEPONYX |
6.1.3. | Amkor — Advanced Semiconductor Packaging |
6.1.4. | ASE — Advanced Semiconductor Packaging |
6.1.5. | Ayar Labs: AI Accelerator Interconnect |
6.1.6. | CEA-Leti (Advanced Semiconductor Packaging) |
6.1.7. | Ciena |
6.1.8. | Coherent: Photonic Integrated Circuit-Based Transceivers |
6.1.9. | EFFECT Photonics |
6.1.10. | EVG (D Hybrid Bonding Tool) |
6.1.11. | GlobalFoundries |
6.1.12. | HD Microsystems |
6.1.13. | Henkel (Semiconductor packaging, Adhesive Technologies division) |
6.1.14. | iPronics: Programmable Photonic Integrated Circuits |
6.1.15. | JCET Group |
6.1.16. | JSR Corporation |
6.1.17. | Lightelligence |
6.1.18. | Lightmatter |
6.1.19. | LioniX |
6.1.20. | LIPAC |
6.1.21. | LPKF |
6.1.22. | Lumiphase |
6.1.23. | Lumiphase - Company Profile - IDTechEx Portal |
6.1.24. | Mitsui Mining & Smelting (Advanced Semiconductor Packaging) |
6.1.25. | QuiX Quantum |
6.1.26. | NanoWired |
6.1.27. | QuiX Quantum (Update) |
6.1.28. | Resonac (RDL Insulation Layer) |
6.1.29. | Scintil Photonics |
6.1.30. | TOK |
6.1.31. | TSMC (Advanced Semiconductor Packaging) |
6.1.32. | Vitron (Through-Glass Via Manufacturing) — A LPKF Trademark |
6.2. | Articles |
6.2.1. | SPIE Photonics West 2024: Integrated Photonics for Quantum Systems - Article: Topic overview |
6.2.2. | SPIE Photonics West 2024: Photonic Integrated Circuit Manufacturing - Article: Event summary |
6.2.3. | Event Summary: SPIE Photonex 2024 |