1. | EXECUTIVE SUMMARY |
1.1. | The issue with conventional electronics manufacturing |
1.2. | The issue with conventional semiconductor manufacturing |
1.3. | Growth in the semiconductor and electronics industry exacerbates sustainability issues |
1.4. | Advancing technology creates sustainability challenges for semiconductor manufacturing |
1.5. | Sustainability driver: Legislation in Europe |
1.6. | Sustainability driver: Global legislation focuses on emissions and restriction of hazardous substances |
1.7. | Sustainability driver: onshoring gives opportunities for new sustainable manufacturing processes |
1.8. | Sustainability driver: Global funding for electronics provides opportunities for sustainability |
1.9. | Challenges for sustainable electronics |
1.10. | Key technical opportunities for sustainable electronics manufacturing |
1.11. | Renewable energy adoption for sustainable electronics manufacturing |
1.12. | Opportunities for sustainability within semiconductor manufacturing |
1.13. | Sustainability index benchmarking |
1.14. | Semiconductor manufacturing: Silicon substrate alternatives |
1.15. | Semiconductor manufacturing: Gallium Nitride is the most important sustainable silicon alternative, with applications in power electronics |
1.16. | Semiconductor manufacturing: sustainable patterning through solvent use reduction and reuse |
1.17. | Semiconductor manufacturing: comparing the sustainability of etching and photolithography techniques |
1.18. | Semiconductor manufacturing: unsustainably high-water usage |
1.19. | Semiconductor manufacturing: Sustainable water usage through reuse |
1.20. | Semiconductor manufacturing: Other water management techniques |
1.21. | Semiconductor manufacturing: PFAS reduction |
1.22. | Opportunities for sustainability within PCB manufacturing |
1.23. | PCB manufacturing: sustainable substrate alternatives analysis |
1.24. | PCB manufacturing: sustainable substrate alternatives benchmarking |
1.25. | PCB manufacturing: Sustainable patterning techniques |
1.26. | PCB manufacturing: Sustainable patterning through etchant regeneration |
1.27. | PCB manufacturing: Sustainable component attachment materials |
1.28. | PCB manufacturing: Alternatives to thermal processing for component attachment |
1.29. | The issues of electronics waste |
1.30. | Techniques to reduce electronic waste |
1.31. | Key takeaways (I) |
1.32. | Key takeaways (II) |
1.33. | Key takeaways (III) |
2. | INTRODUCTION |
2.1. | The electronics industry today |
2.2. | Sustainability in the electronics industry |
2.3. | Conventional electronics manufacturing poses obstacles to sustainability challenge |
2.4. | Increasing numbers of electronic devices |
2.5. | Manufacturing strategies to increase speed and reduce embedded energy |
2.6. | Ecodesign for Sustainable Products Regulation |
2.7. | Global impacts for electronics |
2.8. | Anti-Greenwashing |
2.9. | Other global electronics regulations (I) |
2.10. | Other global electronics regulations (II) |
2.11. | Global electronics funding |
2.12. | Onshoring |
2.13. | Sustainability promotes opportunities in the electronics industry |
2.14. | Renewable energy adoption |
2.15. | Carbon price drives renewable energy adoption |
2.16. | Smart manufacturing |
2.17. | Recycling and reuse initiatives for electronics |
2.18. | Report structure |
2.19. | Sustainability index benchmarking |
3. | SUSTAINABLE ELECTRONICS MARKET FORECASTS |
3.1. | Forecasting data sources |
3.2. | Methodology- substrate production and manufacturing method forecasts |
3.3. | Methodology- energy and water usage forecasts |
3.4. | PCB production by substrate |
3.5. | PCB revenue by substrate |
3.6. | Rigid PCBs patterning and metallization methods |
3.7. | Flexible PCBs patterning and metallization methods |
3.8. | Rigid PCB component attachment materials |
3.9. | Flexible PCB component attachment materials |
3.10. | IC production by substrate |
3.11. | IC manufacturing energy usage |
3.12. | IC manufacturing water usage |
3.13. | Global e-waste generation |
3.14. | Summary- PCB manufacturing |
3.15. | Summary- IC manufacturing |
4. | INTEGRATED CIRCUIT MANUFACTURING |
4.1. | Introduction |
4.1.1. | IC manufacturing: Chapter structure |
4.1.2. | Conventional integrated circuit manufacturing |
4.1.3. | Key areas for sustainability within IC manufacturing |
4.2. | Wafer preparation and materials |
4.2.1. | Introduction to wafer production for ICs |
4.2.2. | Conventional silicon wafer production |
4.2.3. | Si wafer energy and material loss |
4.2.4. | Silicon wafer production improvements |
4.2.5. | Gallium nitride benefits |
4.2.6. | Gallium nitride manufacturing |
4.2.7. | Silicon carbide comparison |
4.2.8. | SWOT analysis: Gallium nitride ICs |
4.2.9. | PragmatIC flexible ICs |
4.2.10. | SWOT analysis: PragmatIC's flexible ICs |
4.2.11. | Printed organic ICs |
4.2.12. | Sustainability index: Wafer material |
4.2.13. | Key takeaways: Wafer preparation |
4.3. | Oxidation |
4.3.1. | Introduction to oxidation |
4.3.2. | Pre-oxidation cleaning replacements |
4.3.3. | Recycling acid etchants |
4.3.4. | Substrate oxidation |
4.3.5. | Wet and dry thermal oxidation |
4.3.6. | MOSFET transistors |
4.3.7. | Transistor gate oxide improvements |
4.3.8. | Solution-based manufacture of gate oxides |
4.3.9. | Solution-based hafnium oxide |
4.3.10. | Sustainable gate oxides research (I) |
4.3.11. | Sustainable gate oxides research (II) |
4.3.12. | Silicon on Insulator (SOI) |
4.3.13. | SOI Manufacture |
4.3.14. | Status and market potential of gate oxides |
4.3.15. | Gate oxides: Key SWOT for major technologies |
4.3.16. | Sustainability index: Oxidation |
4.3.17. | Key takeaways: Oxidation |
4.4. | Patterning and surface doping |
4.4.1. | Introduction: Patterning and surface doping |
4.4.2. | Conventional photolithography (I) |
4.4.3. | Conventional photolithography (II) |
4.4.4. | Chemical usage and environmental impact for photolithography |
4.4.5. | EUV and other photolithography advancements |
4.4.6. | Semiconductor foundry node roadmap |
4.4.7. | EUV sustainability |
4.4.8. | Conventional etching |
4.4.9. | Dry vs wet etching |
4.4.10. | Plasma etching challenges |
4.4.11. | Dry etching chemicals |
4.4.12. | Solvent use reduction and reuse |
4.4.13. | Chemical reduction |
4.4.14. | Green solvents and materials |
4.4.15. | Green materials research |
4.4.16. | PFAS in semiconductor manufacturing |
4.4.17. | PFAS reduction and replacement (I) |
4.4.18. | PFAS reduction and replacement (II) |
4.4.19. | Photolithography hydrogen use |
4.4.20. | Conventional deposition and doping |
4.4.21. | Sustainable innovations for deposition and doping |
4.4.22. | Energy usage optimization |
4.4.23. | Nano OPS' 'fab in a tool' |
4.4.24. | Patterning methods: Key SWOT |
4.4.25. | Sustainability index: Patterning |
4.4.26. | Key takeaways: Patterning and doping |
4.5. | Metallization and packaging |
4.5.1. | Introduction: Metallization |
4.5.2. | Conventional metallization |
4.5.3. | Metal gate material price |
4.5.4. | EU Due diligence restrictions on tantalum sourcing |
4.5.5. | Electroplating and physical vapour deposition |
4.5.6. | Electroplating sustainable advancements |
4.5.7. | Printed metal gates for organic thin film transistors |
4.5.8. | Sustainability index: Metallization |
4.5.9. | Key takeaways: Metallization |
4.6. | Packaging |
4.6.1. | Introduction: Packaging |
4.6.2. | Conventional packaging |
4.6.3. | 3D packaging transition |
4.6.4. | Interconnection technique - Wire Bond |
4.6.5. | Interconnection technique - Flip Chip |
4.6.6. | Sustainability index: Interconnection techniques |
4.6.7. | Glass interposer packaging implementation |
4.6.8. | Organic substrates comparison |
4.6.9. | Interposer technologies: Key SWOT |
4.6.10. | PFAS reduction in packaging |
4.6.11. | Circular economy through semiconductor packaging |
4.6.12. | Key takeaways: Packaging |
4.7. | Water management |
4.7.1. | Introduction: Water management |
4.7.2. | The role of water in semiconductor manufacturing |
4.7.3. | Global water scarcity |
4.7.4. | The importance of water sustainability in semiconductor manufacture |
4.7.5. | Case study: Taiwan |
4.8. | Ultra pure water in semiconductor manufacturing |
4.8.1. | Ultra pure water use in manufacturing |
4.8.2. | UPW specifications and monitoring methods |
4.8.3. | The importance of UPW specifications |
4.8.4. | Ultra pure water production |
4.8.5. | UPW contamination difficulties |
4.9. | Water treatment technique advancement |
4.9.1. | UPW technology advancements (I) |
4.9.2. | UPW technology advancements (II) |
4.9.3. | Polyfluoroalkyl substances (PFAS) |
4.9.4. | Technology readiness level (TRL) |
4.10. | Water management strategies |
4.10.1. | Water usage increasing with advancing technology |
4.10.2. | Water management efficiency |
4.10.3. | Water management motivations |
4.10.4. | Water management techniques (I) |
4.10.5. | Water management techniques (II) |
4.10.6. | Water reuse |
4.10.7. | Wet processing equipment suppliers incorporating water management |
4.10.8. | Water management player strategies |
4.10.9. | Cost benefit analysis of UPW upgrades and reuse |
4.10.10. | Key takeaways: Water management |
5. | PRINTED CIRCUIT BOARD MANUFACTURING |
5.1. | Introduction |
5.1.1. | PCB manufacturing: Chapter structure |
5.1.2. | Introduction: History of traditional PCBs |
5.1.3. | Conventional PCB manufacturing |
5.1.4. | Manufacturing of PCBs concentrated in APAC |
5.1.5. | Key areas for sustainability within PCBs |
5.1.6. | Sustainable materials for PCB manufacturing |
5.2. | Design options |
5.2.1. | Introduction: Design options for PCBs |
5.2.2. | Ecodesign regulation |
5.2.3. | Eco-design |
5.2.4. | Double-sided and multi-layered PCBs allow extra complexity and reduce board size |
5.2.5. | Flexible PCBs |
5.2.6. | Moving away from rigid PCBs will enable new applications |
5.2.7. | In-mold electronics |
5.2.8. | IME manufacturing process flow |
5.2.9. | Motivation and challenges for IME |
5.2.10. | How sustainable is IME? |
5.2.11. | IME can reduce plastic usage by more than 50% |
5.2.12. | Investment in In-Mold Electronics |
5.2.13. | TactoTek |
5.2.14. | IME vs reference component: Cradle to gate automotive life cycle assessment |
5.2.15. | Key takeaways: PCB design options |
5.3. | Substrate choices |
5.3.1. | Introduction: Substrate choices |
5.3.2. | Disadvantages of FR4 |
5.4. | Rigid PCB alternative substrates |
5.4.1. | Legislation on halogenated substances |
5.4.2. | Halogen-free FR4 advantages |
5.4.3. | Household name halogen-free FR4 adoption |
5.4.4. | Halogen-free PCB suppliers for high-frequency applications |
5.4.5. | SWOT analysis: Halogen-free FR4 |
5.4.6. | Glass substrates (I) |
5.4.7. | Glass core substrates (II) |
5.4.8. | Ceramic substrates |
5.4.9. | Ceramic substrate property comparison |
5.4.10. | Vitrimer PCBs |
5.4.11. | SYTECH Recyclable PCB |
5.4.12. | Low-energy epoxy resins |
5.4.13. | Rigid PCB substrates: Key SWOT |
5.5. | Flexible PCB substrates |
5.5.1. | Introduction to flexible PCB substrates |
5.5.2. | Polyimide comparison to FR4 and new opportunities |
5.5.3. | Application areas for flexible PCBs |
5.5.4. | Polyimide alternatives |
5.5.5. | Recyclable polyimide substrate development |
5.5.6. | Stretchable electronics |
5.5.7. | Flexible PCB substrates: Key SWOT |
5.6. | Bio-based and biodegradable substrates |
5.6.1. | Introduction to bio-based PCBs |
5.6.2. | Switching to bio-based PCBs involves new optimization |
5.6.3. | Bioplastics for PCBs |
5.6.4. | Bioplastics: Current research and use |
5.6.5. | Polylactic acid |
5.6.6. | Biodegradable PCBs- JIVA |
5.6.7. | JIVA Partnerships could accelerate uptake |
5.6.8. | Dell's Concept Luna laptop using Soluboard® |
5.6.9. | Project HyPELignum |
5.6.10. | Cellulose research and development |
5.6.11. | 'Papertronics' research |
5.6.12. | SWOT Analysis: Bio-based materials |
5.7. | Key takeaways |
5.7.1. | Sustainability index: PCB substrates |
5.7.2. | Key takeaways |
5.8. | Patterning and metallization |
5.8.1. | Introduction: Patterning and metallisation |
5.8.2. | Conventional metallization is wasteful and harmful |
5.8.3. | Common etchants pose environmental hazards |
5.8.4. | Etchant regeneration makes wet etching more sustainable |
5.8.5. | Additive manufacturing benefits |
5.8.6. | Dry phase patterning |
5.8.7. | Print-and-plate |
5.8.8. | Sustainability benefits of print-and-plate |
5.8.9. | Formaldehyde alternative for green electroless plating |
5.8.10. | Laser induced forward transfer (LIFT) |
5.8.11. | Operating mechanism of LIFT |
5.8.12. | Target applications for laser induced forward transfer |
5.8.13. | Copper inks |
5.8.14. | Copper ink: Copprint |
5.8.15. | Copper inks driven by price |
5.8.16. | SWOT analysis: Copper inks |
5.8.17. | Carbon based inks |
5.8.18. | Barriers in printed electronics |
5.8.19. | Nano Dimension 3D printing |
5.8.20. | Sustainability index: Patterning and Metallization Processes |
5.8.21. | Sustainability index: Patterning and Metallization Materials |
5.8.22. | Key takeaways: Patterning and metallization |
5.9. | Component attachment - Materials |
5.9.1. | Introduction: Component attachment materials |
5.9.2. | Component attachment materials |
5.9.3. | Comparing component attachment types |
5.9.4. | Introduction: Limitations of conventional lead-free solder |
5.9.5. | Wide range of solder alloys available |
5.9.6. | Second-life tin |
5.9.7. | Low-temperature soldering and adhesives sustainability advantages |
5.9.8. | Low temperature solder alloys |
5.9.9. | Low temperature solder enables thermally fragile flexible substrates |
5.9.10. | Low temperature solder could perform as well as conventional solder |
5.9.11. | Low temperature alloy price comparison |
5.9.12. | SAFI-Tech's innovative supercooled liquid solder |
5.9.13. | SWOT Analysis: Low temperature solder |
5.9.14. | Electrically conductive adhesive's introduction |
5.9.15. | Non-conductive resin materials in ECAs |
5.9.16. | Key ECA innovations |
5.9.17. | ECAs in in-mold electronics (IME) |
5.9.18. | Low temperature curing ECAs |
5.9.19. | SWOT Analysis: ECAs |
5.9.20. | Status and market potential of SAC solder alternatives |
5.9.21. | ECAs vs low temperature solder |
5.9.22. | Sustainability index: Component attachment materials |
5.9.23. | Key takeaways: Component attachment materials |
5.10. | Component Attachment - Processes |
5.10.1. | Introduction: Component attachment processes |
5.10.2. | Thermal processing can be slow and time consuming |
5.10.3. | UV curing of ECAs could lower heat |
5.10.4. | UV curing equipment widely available |
5.10.5. | Photonic sintering and curing advantages |
5.10.6. | Photonic sintering |
5.10.7. | Near-infrared radiation can dry in seconds |
5.10.8. | Status and market potential of component attachment processes |
5.10.9. | Sustainability index: Component attachment processes |
5.10.10. | Key takeaways: Component attachment processes |
6. | END OF LIFE |
6.1. | Introduction |
6.1.1. | Introduction: End of life |
6.1.2. | E-waste is rapidly accumulating but recycling struggles to keep up |
6.1.3. | Increasing legislation for e-waste |
6.1.4. | Largest emissions from electronics are produced by ICs |
6.1.5. | Increasing renewable energy can result in substantial emissions reductions |
6.1.6. | Early testing minimizes waste |
6.1.7. | Etchant produces largest amount of hazardous waste |
6.2. | Recycling, recovery and reuse |
6.2.1. | Recovery of copper oxide from wastewater slurry |
6.2.2. | PCB recycling |
6.2.3. | PCB previous metal recovery |
6.2.4. | Critical semiconductor materials: Applications and recycling rates |
6.2.5. | Semiconductor hydrofluoric acid waste |
6.2.6. | Recyclable PCBs |
6.2.7. | Biodegradable substrates |
6.2.8. | Excess stock |
6.2.9. | Global take-back schemes |
6.2.10. | Reuse of equipment |
6.3. | Key takeaways |
6.3.1. | Summary of techniques to reduce waste |
6.3.2. | Key takeaways: End of life |
7. | COMPANY PROFILES |
7.1. | Links to company profiles on IDTechEx website |