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1. | EXECUTIVE SUMMARY |
1.1. | 2018-2028 market forecasts segmented by 10 technologies (value) |
1.2. | 2018-2028 market forecasts segmented by technology (area) |
1.3. | 2018-2028 market forecasts segmented by 21 applications (value) |
1.4. | 2018-2028 market forecasts segmented by major market groups (value) |
1.5. | 2018-2028 ITO film forecasts segmented by 21 applications (value) |
1.6. | 2018-2028 ITO glass forecasts segmented by 21 applications (value) |
1.7. | 2018-2028 silver nanowire forecasts segmented by application (value) |
1.8. | 2018-2028 metal mesh (etched) forecasts segmented by application (value) |
1.9. | 2018-2028 metal mesh (embossed/hybrid) forecasts segmented by application (value) |
1.10. | 2018-2028 metal mesh (directly printed) forecasts segmented by application (value) |
1.11. | 2018-2028 all metal mesh forecasts segmented by application (value) |
1.12. | 2018-2028 PEDOT forecasts segmented by application (value) |
1.13. | 2018-2028 graphene forecasts segmented by application (value) |
2. | TECHNOLOGY ASSESSMENT |
2.1. | ITO film and glass |
2.1.1. | ITO glass assessment: performance, manufacture & limitations |
2.1.2. | ITO glass in LCD displays |
2.1.3. | ITO film assessment: performance, manufacture and market trends |
2.1.4. | The Boom and Bust Cycle |
2.1.5. | ITO film shortcomings: flexibility |
2.1.6. | ITO film shortcomings: limited sheet conductivity |
2.1.7. | ITO film shortcomings: limited sheet resistance |
2.1.8. | ITO film shortcomings: index matching |
2.1.9. | ITO film shortcomings: thinness |
2.1.10. | ITO film shortcomings: price falls and commoditization |
2.1.11. | ITO films: current prices (2018) |
2.1.12. | Indium's single supply risk: real or exaggerated? |
2.1.13. | Recycling comes to the rescue? |
2.1.14. | Indium: price fluctuations drive innovation |
2.1.15. | Indium-free metal oxides win in high temperature applications |
2.2. | Silver nanowires |
2.2.1. | Silver nanowire transparent conductive films: principles |
2.2.2. | Silver nanowire transparent conductive films: growth and deposition |
2.2.3. | Silver nanowire transparent conductive films: performance levels and value proposition |
2.2.4. | Silver nanowire transparent conductive films: flexibility |
2.2.5. | Silver nanowire transparent conductive films: haze, migration, and single supplier risk |
2.2.6. | Comparing manufacturing cost of Ag NW and ITO |
2.2.7. | Silver nanowire transparent conductive films: target markets |
2.2.8. | Silver nanowire transparent conductive films: existing commercial applications on the market |
2.2.9. | Cambrios: rebirth possible under TPK? |
2.2.10. | C3Nano: low haze technology, high funding and strong investors |
2.2.11. | BASF: Silver nanowire transparent conductive films |
2.2.12. | N&B silver nanowire TCFs (Korea) |
2.2.13. | Nuovo Film: Chinese Ag NW supplier/coater making rapid progress? |
2.2.14. | Duksan Hi-Metal: success in transparent heaters for automotive? |
2.2.15. | Silver nanowire transparent conductive films: other companies (Dowa and Showa Denko) |
2.2.16. | Silver nanowire transparent conductive films: other companies (Huake and Seiko PMC Corp) |
2.2.17. | Silver nanowire transparent conductive films: other companies (Nanogap and NanoCnet) |
2.2.18. | Updates on others active or inactive (InnovaDynamics, Sinovia, Bluenano, Seahshell, Carestream, Noritake, Henkel etc.) |
2.2.19. | Hitachi Chemical's TCTF |
2.3. | Metal mesh |
2.3.1. | Metal mesh transparent conductive films: operating principles |
2.3.2. | Photopatterning for metal mesh production: leading production process but will it scale beyond depreciated assets? |
2.3.3. | Metal mesh: photolithography followed by etching |
2.3.4. | Fujifilm's photo-patterned metal mesh TCF |
2.3.5. | Mitsubishi Paper Mills Limited: Silver halide based metal mesh TCF |
2.3.6. | Early success of silver halide based metal mesh TCFs |
2.3.7. | Toppan Printing's copper mesh transparent conductive films |
2.3.8. | Dai Nippon Printing's transparent conductive film technology |
2.3.9. | DNP focusing on EMI shield and transparent antenna? |
2.3.10. | 3M's photo-patterned metal mesh TCF |
2.3.11. | Elotech metal mesh |
2.3.12. | Tanaka Metal's metal mesh technology |
2.3.13. | Rolith's novel photo patterning technique |
2.3.14. | Panasonic's Large Area Metal Mesh |
2.3.15. | Sharp(Foxconn): large-area metal mesh films |
2.3.16. | GiS (integrator): Large area metal mesh displays |
2.3.17. | Improving invisibility of metal mesh |
2.3.18. | SWOT analysis on photo patterned metal mesh TCFs |
2.3.19. | Embossing followed by printing/filling to create imbedded ultrafine metal mesh? |
2.3.20. | Embossing/Imprinting metal mesh TCFs |
2.3.21. | Uni-Pixel's metal mesh performance (no longer active) |
2.3.22. | Unipixel's limited example of commercial products (no longer active) |
2.3.23. | Yield issues caused UniPixel to ultimately fail and never deliver? |
2.3.24. | Ateml offloads assets to UniPixel (no longer active) |
2.3.25. | Conductive Inkjet Technology's photo-patterned metal mesh TCF (no longer active?) |
2.3.26. | O-Film's metal mesh TCF technology: the basics |
2.3.27. | Will O-Film rejuvenate its metal mesh business after disappointing sales? |
2.3.28. | MNTech's metal mesh TCF technology (the incident) |
2.3.29. | J-Touch: substantial metal mesh capacity |
2.3.30. | Nanoimprinting metal mesh with 5um linewidth |
2.3.31. | Metal mesh TCF is flexible |
2.3.32. | Cost breakdown of metal mesh and yield |
2.3.33. | SWOT analysis on embossed metal mesh TCFs |
2.3.34. | Key players |
2.3.35. | Direct printing: finally making a comeback in metal mesh TCF as a viable ultrafine technology? |
2.3.36. | Direct printed metal mesh transparent conductive films: performance |
2.3.37. | Direct printed metal mesh transparent conductive films: major shortcomings |
2.3.38. | Komura Tech: improvement in gravure offset printed fine pattern (<5um) metal mesh TCF ? |
2.3.39. | Shashin Kagaku: offset printed metal mesh TCF |
2.3.40. | Komori: gravure offset all-printed metal mesh film? |
2.3.41. | Asahi Kasei: taking steps to commercialize its R2R ultrafine printing process |
2.3.42. | How is the ultrafine feature R2R mold fabricated? |
2.3.43. | Konica Minolta: inkjet printing large area fine pitch metal mesh TCFs with <10um linewidth? |
2.3.44. | Gunze: S2S screen printing finds a market fit? |
2.3.45. | Toray's photocurable screen printed paste for fine line metal mesh |
2.3.46. | Ishihara Chemical's gravure printed photo-sintered Cu paste |
2.3.47. | Toppan Forms: Ag salt inks to achieve 4um printed metal mesh? |
2.3.48. | Key players (Komori, LG Chem, Pchem, Goss, etc.) |
2.3.49. | Key players |
2.3.50. | Print and Plate |
2.3.51. | Eastman Kodak: Transparent ultra low-resistivity RF antenna using printed Cu metal mesh technology |
2.3.52. | Kuroki/ITRI: printed seed layer and plate Cu metal mesh? |
2.3.53. | Replacing photolithography with photoresist printing for ultra fine metal mesh |
2.3.54. | LCY gravure printing photoresist then etching |
2.3.55. | Screen Holding: gravure printing photoresist then etching |
2.3.56. | Consistent Materials' photoresist for metal mesh |
2.3.57. | Other |
2.3.58. | Nippon Glass: Cu metal mesh TCF on flexible glass |
2.3.59. | Metal mesh on glass for automotive industry (Micro) |
2.4. | Carbon nanotubes |
2.4.1. | Introduction to Carbon Nanotubes (CNT) |
2.4.2. | CNTs: ideal vs reality |
2.4.3. | Not all CNTs are equal |
2.4.4. | Different production processes (laser ablation and arc discharge) |
2.4.5. | Different production processes (catalytic CVD) |
2.4.6. | Benchmarking of different CNT production processes |
2.4.7. | Price position of CNTs (from SWCNT to FWCNT to MWCNT) |
2.4.8. | Production capacity globally |
2.4.9. | Carbon nanotube transparent conductive films: performance |
2.4.10. | Carbon nanotube transparent conductive films: performance of commercial films on the market |
2.4.11. | Carbon nanotube transparent conductive films: matched index |
2.4.12. | Carbon nanotube transparent conductive films: mechanical flexibility |
2.4.13. | Carbon nanotube transparent conductive films: stretchability as a key differentiator for in-mould electronics |
2.4.14. | Example of 3D touch-sensing surface with CNTs |
2.4.15. | Example of wearable device using CNT |
2.4.16. | Key players |
2.5. | Graphene |
2.5.1. | Graphene: background |
2.5.2. | Numerous ways of making graphene |
2.5.3. | Quantitative mapping of graphene morphologies on the market |
2.5.4. | Graphene platelet-type: pricing trends and strategies |
2.5.5. | CVD Graphene |
2.5.6. | Growth process of CVD graphene |
2.5.7. | The key role of oxygen in CVD graphene growth |
2.5.8. | R2R Growth? |
2.5.9. | The transfer challenge |
2.5.10. | Roll-to-roll transfer of CVD graphene |
2.5.11. | Novel methods for transferring CVD graphene |
2.5.12. | Sony's approach to transfer of CVD process |
2.5.13. | Wuxi Graphene Film Co's CVD graphene progress |
2.5.14. | LG Electronics: R2R CVD graphene targeting TCFs? |
2.5.15. | Ningbo Soft Carbon Electronics: R2R CVD graphene growth and transfer |
2.5.16. | 2D Carbon (Changzhou)Ltd: Moving away from CVD type graphene film? |
2.5.17. | Direct CVD graphene growth on an insulating substrate? |
2.5.18. | Graphene transparent conductive film: performance levels |
2.5.19. | Doping as a strategy for improving graphene TCF performance |
2.5.20. | Be wary of extraordinary results for graphene |
2.5.21. | Graphene transparent conducting films: flexibility |
2.5.22. | Graphene transparent conducting films: thinness and barrier layers |
2.5.23. | SWOT analysis on graphene TCFs |
2.5.24. | Key players |
2.6. | PEDOT |
2.6.1. | PEDOT:PSS |
2.6.2. | Patterning PEDOT:PSS |
2.6.3. | Performance of PEDOT:PSS has drastically improved |
2.6.4. | PEDOT:PSS is now on a par with ITO-on-PET |
2.6.5. | PEDOT:PSS is mechanically flexible |
2.6.6. | PEDOT:PSS is stretchable and can be thermoformed |
2.6.7. | Stability and spatial uniformity of PEDOT:PSS |
2.6.8. | Nippon Chemi-Con's polymeric transparent conductive film |
2.6.9. | Commercial product using PEDOT:PSS |
2.6.10. | Use case examples of PEDOT:PSS TCFs |
2.6.11. | Force Foundation: PEDOT used in solution coated smart windows |
2.6.12. | Use case examples of PEDOT:PSS TCFs |
2.6.13. | Key players |
2.7. | Other |
2.7.1. | Fine wire TCF technology |
2.7.2. | UC Nano: Microwire and metal mesh for large area touch? |
2.7.3. | Displax: large area multi-touch capacitive touch |
2.7.4. | Performance of fine wire large-sized touch displays on the market |
2.7.5. | SWOT analysis on micro wire TCFs |
2.7.6. | CimaTech's self-assembled nanoparticle technology (no longer active) |
2.7.7. | Examples of Cima Nanotech's technology (no longer active) |
2.7.8. | ClearJet's inkjet printed nanoparticle-based TCFs: a failure? |
2.7.9. | E-Fly Corporation's sputtered silver film: an alternative to metal mesh for large area touch? |
2.7.10. | Young Fast/Nitto Denko: ITO-metal alloy as an alternative to metal mesh for large area touch? |
2.7.11. | Quantitative benchmarking of different TCF technologies |
2.7.12. | Technology comparison |
2.7.13. | Stretchable and in-mold transparent conductive film |
2.7.14. | In-mold electronics: processes and requirements |
2.7.15. | Stretchable conductive inks for in-mold electronics |
2.7.16. | Target applications for in-mould electronics |
2.7.17. | Product examples using in-mold conductive inks |
2.7.18. | Stretchable carbon nanotube transparent conducting films |
2.7.19. | Product examples of carbon nanotube in-mold transparent conductive films |
2.7.20. | PEDOT transparent conductive films |
2.7.21. | Product examples of in-mold and stretchable PEDOT:PSS transparent conductive films |
2.7.22. | In-mold and stretchable metal mesh transparent conductive films |
2.7.23. | Stretchable silver nanowire transparent conductive films |
2.7.24. | Other in-mold transparent conductive film technologies |
3. | APPLICATIONS: |
3.1. | Consumer electronics (small phones, tablets, AiO, Notebooks, Smart Watches etc) |
3.1.1. | Consumer electronic device shipment forecasts |
3.1.2. | Smart phones have been growing in size |
3.1.3. | Chinese brands are stealing market share in China |
3.1.4. | Smart phone market is highly diverse and fragmented |
3.1.5. | Different capacitive add-on touch architectures |
3.1.6. | Different capacitive embedded touch architectures |
3.1.7. | Transition from add-on to embedded touch |
3.2. | Ultra large area touch screens |
3.2.1. | Optical touch systems for large area touch displays |
3.2.2. | Assessing different optical touch technologies |
3.2.3. | Metal mesh in large area capacitive touch |
3.2.4. | Metal mesh in large area capacitive touch screens |
3.2.5. | Non metal mesh large area capacitive displays |
3.2.6. | Finewire larger area capacitive large-sized displays |
3.3. | Transparent LED |
3.3.1. | Transparent LEDs: need for low resistance flexible TCF |
3.4. | OLED lighting: solid-state, efficient, cold, surface emission, flexible......? |
3.4.1. | Performance challenge for R2R OLED lighting |
3.4.2. | Price targets as set by LED and other lighting sources |
3.4.3. | Current state of sheet-to-sheet |
3.4.4. | Current status with R2R OLED lighting |
3.4.5. | OLED lighting market |
3.4.6. | Transparent Electrodes for OLED Lighting |
3.4.7. | Requirements for Conductivity of Transparent Anode |
3.4.8. | Analysis for Square Single Stack Panels by Cambrios |
3.4.9. | Calculations showing the stringent sheet resistance requirements for TCF in OLED lighting |
3.4.10. | Silver nanowires for OLED lighting |
3.5. | Organic photovoltaics |
3.5.1. | Organic photovoltaics (OPV): the dream and the reality (so far)? |
3.5.2. | Basics of OPV operation |
3.5.3. | Typical OPV device architectures (single vs multi-junction) |
3.5.4. | Film morphology control (bulk heterojunction) is critical |
3.5.5. | Solution vs evaporation |
3.5.6. | Progress in solution processing so far (2010 TO NOW) |
3.5.7. | Progress in tandem cell evaporation so far (2007 to NOW) |
3.5.8. | OPV products and prototypes |
3.5.9. | OPV installations |
3.5.10. | Current status of commercial players and outlook |
3.5.11. | Market Forecast for Organic photovoltaics |
3.6. | Flexible displays |
3.6.1. | The early years of flexible displays |
3.6.2. | Flexible EPD suppliers in 2017 |
3.6.3. | Flexible LCD |
3.6.4. | First step towards flexible: OLED on plastic substrate |
3.6.5. | The rise of plastic and flexible AMOLED |
3.6.6. | Plastic displays in mass production |
3.6.7. | But fully flexible displays are finally coming? |
3.6.8. | Large flexible displays demonstrated by LG |
3.6.9. | From rigid OLED, to flexible and foldable OLED |
3.6.10. | Changes in touch technology for flexible displays |
3.6.11. | Market forecasts for rigid, plastic and flexible OLED displays |
3.7. | Automotive |
3.7.1. | Printed rear window de-foggers |
3.7.2. | Printing on polycarbonate car windows? |
3.7.3. | Metal mesh in window and mirror defrosters |
3.7.4. | Automotive touch market in sqm (2018 to 2028) |
4. | MARKET FORECASTS |
4.1. | TCF film prices used in our projections |
4.2. | 2018-2028 market forecasts segmented by 10 technologies (value) |
4.3. | 2018-2028 market forecasts segmented by technology (area) |
4.4. | 2018-2028 market forecasts segmented by 21 applications (value) |
4.5. | 2018-2028 market forecasts segmented by major market groups (value) |
4.6. | 2018-2028 ITO film forecasts segmented by 21 applications (value) |
4.7. | 2018-2028 ITO glass forecasts segmented by 21 applications (value) |
4.8. | 2018-2028 silver nanowire forecasts segmented by application (value) |
4.9. | 2018-2028 metal mesh (etched) forecasts segmented by application (value) |
4.10. | 2018-2028 metal mesh (embossed/hybrid) forecasts segmented by application (value) |
4.11. | 2018-2028 metal mesh (directly printed) forecasts segmented by application (value) |
4.12. | 2018-2028 all metal mesh forecasts segmented by application (value) |
4.13. | 2018-2028 PEDOT forecasts segmented by application (value) |
4.14. | 2018-2028 graphene forecasts segmented by application (value) |
5. | COMPANY INSIGHTS, BACKGROUNDS AND/OR PROFILES BASED ON PRIMARY INFORMATION |
5.1.1. | 2D Carbon (Changzhou) |
5.1.2. | 3M |
5.1.3. | Agfa |
5.1.4. | Arkema |
5.1.5. | Asahi Kasei |
5.1.6. | Atmel |
5.1.7. | BASFT |
5.1.8. | Bluenano* |
5.1.9. | Bluestone Global Tech |
5.1.10. | C3Nano |
5.1.11. | Cambrios |
5.1.12. | Canatu |
5.1.13. | Carestream |
5.1.14. | Charmtron |
5.1.15. | Chimei Innolux |
5.1.16. | CimaNanotech |
5.1.17. | ClearJet |
5.1.18. | Conductive Inkjet Technologies |
5.1.19. | Consistent Materials |
5.1.20. | Dai Nippon Printing |
5.1.21. | Displax |
5.1.22. | Dontech |
5.1.23. | Duskan Hi Metal |
5.1.24. | Eastman Kodak |
5.1.25. | E-Fly Corp |
5.1.26. | Eikos |
5.1.27. | Elotech |
5.1.28. | Epigem |
5.1.29. | Evonik |
5.1.30. | Force Foundation |
5.1.31. | Fujifilm |
5.1.32. | Fujitsu |
5.1.33. | GiS |
5.1.34. | Goss International |
5.1.35. | Graphene Frontier |
5.1.36. | Graphene Square |
5.1.37. | Gunze |
5.1.38. | Henkel |
5.1.39. | Heraeus |
5.1.40. | Hitachi Chemical |
5.1.41. | Holst Centre |
5.1.42. | Huake |
5.1.43. | Ishihara Chemical |
5.1.44. | ITRI |
5.1.45. | J-Touch |
5.1.46. | Kodak |
5.1.47. | Komori |
5.1.48. | Komoro |
5.1.49. | KomuraTech |
5.1.50. | Konica Minolta |
5.1.51. | Kuroku |
5.1.52. | LG Electronics |
5.1.53. | LG Chem |
5.1.54. | LYC Chemical |
5.1.55. | Micro |
5.1.56. | MicroContinium |
5.1.57. | Mitsubishi Paper Mills |
5.1.58. | MNTech |
5.1.59. | Multitaction |
5.1.60. | N&B |
5.1.61. | Nagase |
5.1.62. | NanoCnet |
5.1.63. | Nanogap |
5.1.64. | Nanomade |
5.1.65. | Nanopyxis |
5.1.66. | Neonode |
5.1.67. | Ningbo Soft Carbon |
5.1.68. | Nippon Chemicon |
5.1.69. | Nippon Glass |
5.1.70. | Nitto Denko |
5.1.71. | Noritake |
5.1.72. | Nuovo Film |
5.1.73. | Ocsial |
5.1.74. | O-Film |
5.1.75. | OLED Works |
5.1.76. | Panasonic |
5.1.77. | Perceptive Pixel |
5.1.78. | PolyIC |
5.1.79. | PolyInk |
5.1.80. | Raymore/NanoIntegris |
5.1.81. | Rolith |
5.1.82. | Samsung |
5.1.83. | Screen Holding |
5.1.84. | Seashell |
5.1.85. | Seiko PMC |
5.1.86. | Sharp (Foxconn) |
5.1.87. | Shashin Kagaku |
5.1.88. | Showa Denko |
5.1.89. | Sinovia |
5.1.90. | Sony |
5.1.91. | SWenT/Chasm |
5.1.92. | TactoTek |
5.1.93. | Tanaka Metal |
5.1.94. | Toda Kogya |
5.1.95. | Toppan Forms |
5.1.96. | Toppan Printing |
5.1.97. | Toray |
5.1.98. | TPK |
5.1.99. | UCNano |
5.1.100. | Unidym |
5.1.101. | Uni-Pixel |
5.1.102. | Visual Planet |
5.1.103. | WuxiGraphene |
5.1.104. | XiNano |
5.1.105. | YoungFast |
5.1.106. | Zytronic |
* We have also included companies that may no longer be active for the sake of completeness. These companies often played a role in the earlier days of the growth of ITO alternative industry |