Video: Thinning a Silicon Chip Could Make it More Durable
American Semiconductor (ASI) has installed the world's first ultra-thin wafer-level Chip Scale Packaging operation and assembly service in Boise, ID in 2019. ASI is the industry leader in flexible integrated circuits as well as a services provider for Flexible-Hybrid-Electronic (FHE) system design and prototype assembly. Standard and custom Semiconductor-on-Polymer (SoP) ICs are available ranging from OPAMPS to complex system-on-chip (SoC) to NFC and BLE.
Video: Moulded Polycarbonate Film
Our company has challenged innovative technological development as a chemical manufacturer and developed high value-added products including DOTITE, electrically conductive paste, since its foundation. We produce many products that are frontrunners in the market, and establish strong confidential relationships with customers based on our long track record and accumulated know-how.
IDTechEx Show! Interview with Phi-Power
Dr Michael Lamperth, CEO and Founder of Phi-Power AG interviewed by Chairman of IDTechEx, Dr Peter Harrop about his talk on Axial Flux Motors - Application, Design And Manufacturing.
Screen Printed Circuit Emulsion
Kissel + Wolf GmbH (KIWO) is a leading manufacturer of stencil making consumables used in close tolerance screen printing applications such as printed electronics, including photovoltaic, RFID, EL and membrane switch, and label, nameplate and graphic overlay. KIWO manufactures premium quality photopolymer liquid direct emulsions and capillary films, screen printable adhesives and chemical sundries for screen cleaning. KIWO's global scope is impressive with over 110 distributors worldwide.
E-Skin Camera-less Motion Capture System
Xenoma develops the next-generation smart apparel 'e-skin' to provide well-being and happiness in your daily life. As it can be worn comfortably, the e-skin is one of the most ideal interfaces to monitor the user's activity and vital information unobtrusively. Founded in November 2015 as a spin-out from the University of Tokyo and collaborating with Japanese apparel manufacturing and trading companies, Xenoma works across many industries and sectors to achieve "Health Promotion and Disease Prevention Through Entertainment".
Hybrid CNT Could Aid Flexible Format Phones
CHASM Advanced Materials is revolutionizing design and fabrication of printed electronics and energy storage devices through exclusive development and manufacture of CNT hybrid transparent conductive films and CNT hybrid electrode materials. The company's line of AgeNT transparent conductive films is flexible and formable with low pattering costs and low sheet resistance at high transparency. Leading companies across multiple industries have successfully launched next generation innovations using transparent circuits, heaters, antennas, and films as well as advanced CNT inks and carbon nanotubes (CNTs) only available from CHASM. Visit us at booth #I07 to see demonstration of materials and applications.
The Graphene Industry is Reaching a Tipping Point
Largest Dedicated Commercial Conference & Exhibition on Graphene & 2D Materials
13 - 14 May 2020 | Estrel Convention Center, Berlin, Germany
Printed CPU Allows for More Flexible Applications
Founded in 1995, it is a professional supply platform for smart card chips and RFID products.
SNS brings his longterm production experiences in contactless card and smart label into Printed Electronics,
able to use Flexographic, Screen and Inkjet printing in Printed Electronics on various low-temperature
substrates like Paper, PET etc. In house Pick and Place process for components with ACP brings
Printed Electronic products into a higher level of product integrity.
Water-Clear Conductive Metal Inks
Liquid X Printed Metals® (Liquid X®), headquartered in Pittsburgh, Pennsylvania, is an advanced material manufacturer of functional metallic inks that takes an application from prototype to production.
900mHz Radio Built on a Sheet of Paper
NovaCentrix is focused on technologies and materials to enable manufacturing in Printed Electronics. The PulseForge® photonic curing tools process high-temperature materials on low-temperature substrates. Applications include drying, sintering, annealing, or reacting metallic, non-metallic, and semiconductor inks, without damaging temperature-sensitive substrates such as foils and plastics.