CHASM

The CNT Success Story Begins

False-start - stagnation - market explosion: The CNT success story begins, as IDTechEx forecasts significant growth

CHASM Advanced Materials and Henkel Adhesive Technologies Partner

CHASM Advanced Materials announced a strategic partnership with Henkel Adhesive Technologies. Henkel has certified and will carry one of CHASM's Signis line of patented CNT inks under their LOCTITE brand.

Henkel Functional Material Solutions for Printed Electronics

The digital transformation poses a variety of challenges to all industries. One of them is surely the pressure to leverage the potential of new technologies to enhance performance.

Hybrid CNT Could Aid Flexible Format Phones

CHASM Advanced Materials is revolutionizing design and fabrication of printed electronics and energy storage devices through exclusive development and manufacture of CNT hybrid transparent conductive films and CNT hybrid electrode materials. The company's line of AgeNT transparent conductive films is flexible and formable with low pattering costs and low sheet resistance at high transparency. Leading companies across multiple industries have successfully launched next generation innovations using transparent circuits, heaters, antennas, and films as well as advanced CNT inks and carbon nanotubes (CNTs) only available from CHASM. Visit us at booth #I07 to see demonstration of materials and applications.

SP Technology

SPTechnology, a division of Speciality Printing, provides materials and printed components. IDTechEx met them at CES 2020. Products include RFID, medical sensors, force sensors, heating, capacitive touch and security tags.

CHASM Advanced Materials Partners with Screentec

CHASM Advanced Materials announced that it has entered into a partnership with Screentec, a leader in the printed electronics field. This partnership agreement via CHASM's Preferred Integration Partner Program will draw on the strengths of Screentec's skilled team of printed electronics experts and CHASM's boundary pushing CNT Hybrid platform, AgeNT.

Barrier films and thin film encapsulation: key technology, trends

Flexible and foldable high-performance barrier or encapsulation technology had long represented a technology challenge. The industry spent a decade and a half optimizing the approaches and the processes to achieve large-area production-grade results. The development however has not ended. Indeed, the commercial journey towards flexible and foldable devices is only just beginning. As such, the development of flexible barrier technologies still has far to travel.

CHASM Advanced Materials launches partner program

CHASM Advanced Materials, developer and manufacturer of carbon nanotube hybrid transparent conductive films, announced the launch of The CHASM Preferred Integration Partner (PIP) Program to assemble an exclusive network of the most prolific design, integration, and manufacturing organizations in the printed electronics industry.