Cisco

Co-Packaged Optics (CPO): Evaluating Different Packaging Technologies

The rise of co-packaged optics is transforming modern data centers and high-performance networks by addressing critical challenges such as bandwidth density, energy efficiency, and scalability. CPO enhances interconnect bandwidth and energy efficiency by integrating optics and electronics within a single package, significantly shortening electrical link lengths.

Co-Packaged Optics (CPO) Market Outlook & Packaging Technology Trends

Over the past decade, the capacity of data center Ethernet switches has surged from 0.64 Tbps to 25.6 Tbps, driven by the adoption of 64x400 Gbps or 32x800 Gbps pluggable optical transceiver modules. However, these high-speed modules, within their current form factors, pose significant challenges. Issues include the required densities of electrical and optical connectors, as well as escalating power consumption.

PIC-Based Transceivers Roadmap

Innovation map for photonic integrated circuits-based (PIC-based) transceivers.

nu quantum

nu quantum is a spin-out from the University of Cambridge 'building the entanglement fabric essential to scaling quantum computers'.

Quside

Quside has developed photonic chip-based technology for quantum random number generation. Tess Skyrme, Senior Technology Analyst at IDTechEx, interviewed Chief Revenue Officer Steve Takhar.

Jungo Connectivity

Jungo Connectivity Ltd. provides in-cabin sensing artificial intelligence software. The company creates software designed to oversee in-vehicle cameras and develops algorithms to analyze the driver's state, offering communication-based solutions.

GlobalFoundries

GlobalFoundries is a leading semiconductor foundry, producing typically 300 mm wafers across six platforms, one of which is silicon photonics. IDTechEx spoke with Anthony Yu (VP, Silicon Photonics Product Management) and Vikas Gupta (Senior Director, Product Management & Marketing).

Battery-on-Circuit Technology for Smart Labels

CPI today announced the successful completion of POETICS, a collaborative project aiming to develop low-cost Battery-on-Circuit technology for printed smart labels used to track assets. The outcomes of this project could help lower production costs and drive industrial growth within the printed electronics industry.

DSP Group

IDTechEx interviewed Ofer Elaykim and Tali Chen, CEO and CMO respectively of DSP Group. In this profile we give an overview of the company as well as details about their more recent focus on hearables and the related acquisition of SoundChip.

CPI Announces Smart-Labelling Using Battery-on-Circuit Technology

CPI announced a new collaborative project with Reelables to demonstrate a novel technology for printing smart Battery-on-Circuit labels, used to track shared objects in workspaces. This low-cost power source will eliminate the need for expensive and bulky external batteries for printed electronics, overcoming a key barrier to their widening application, mass production and industry growth.