15 Feb 2021
CVD Graphene for Electronic Applications: 2021 Status and Outlook
Given the exciting properties, graphene has always been linked as a revolutionary material for the electronics industry. CVD graphene is cited as the ideal solution in providing a perfect single layer produced in a low cost continuous R2R process, but the manufacturing and commercial reality have proved very different. After a long period of research, and with players regularly exiting and entering the field, we are only now starting to see this technology mature and the dawn of the commercial reality.
22 Jan 2021
Fujitsu Cashless, Contactless Retail Experience for Masked Shoppers
Fujitsu Laboratories Ltd has announced the development of a new multi-factor biometric authentication technology to deliver an innovative shopping experience for the "New Normal" era, combining non-contact biometrics that filter the verification target through facial data with identification performed via palm vein recognition.
2 Dec 2020
The Most Significant Advanced Materials News from 2020
Not a single country or industry has been unaffected by the COVID-19 pandemic, and the impact will be felt for years to come. Despite this, there have still been some notable industrial activity and commercial progression within materials science. IDTechEx provides a round-up and highlights some of these key developments.
30 Sep 2020
Nano-C produce, functionalize, and integrate SWCNTs and Fullerenes process. IDTechEx spoke with Victor Vejins (CEO) and Darren Bischoff (Business Development Director)
28 Sep 2020
The CNT Success Story Begins
False-start - stagnation - market explosion: The CNT success story begins, as IDTechEx forecasts significant growth
21 Apr 2020
Flexible Nanotube Adhesive Sheet with High Thermal Conductivity
Fujitsu Laboratories Ltd has announced the development of the world's first adhesive sheet composed of carbon nanotubes with extremely high thermal conductivity of up to 100 W/mK. Carbon nanotubes have high thermal conductivity and represent a promising candidate for heat dissipation from heat sources including semiconductor devices.