New IDTechEx Research Report: Radars 2020-2030
Radars evolve towards 4D imaging with improved resolution and object detection AIs, surpassing $15Bn as forecast by IDTechEx Research in their latest report on the topic, covering ADAS and autonomous driving, 4D imaging radars, semiconductor technology, low insertion loss materials, advanced packaging, deep learning, object detection/ classification/ tracking.
Die Attach Materials for Power Electronics in Electric Vehicles
New IDTechEx Research report investigates the market for various die and substrate attach materials used in power electronics in various electric vehicles. It provides a comprehensive view of the industry trends, looking at the trends driving the adoption of higher performance die-attach materials.
Sense Photonics offer lidar modules and operated in stealth mode until June 2019. IDTechEx interviewed Mr Russell Kanjorski in April 2019. Kanjorski is Co-Founder and CCO of Sense Photonics, and he is based in USA.
Quanergy offer lidar modules and lidar signal processing software. IDTechEx interviewed Dr Louay Eldada from Quanergy in April 2019. Eldada is the CEO and Co-Founder of Quanergy, and he is based in USA.
Electric Vehicle Research at Advanced Materials Osaka July 2019
Here we give the abstracts relevant to electric vehicles from BIT Advanced Materials Conference Osaka Japan July 2019. The organisers failed to provide slides but we have photographs of some of these if you are interested. The selected abstracts are divided into energy storage, wide bandgap semiconductors, energy harvesting and other.
Infineon Technologies are developing a MEMS lidar module.
Review of current power modules in electric vehicles (HEV, PHEV, BEV)
This part IV of our article series. In this part, we provide an overview of various power modules used in hybrid and pure electric vehicles today.
Technology evolution for the die and substrate attach paste
This is part III of our series on metal sintering in power electronics (PE). In the last two parts, we considered (1) the key trends shaping the power electronic technology, and (2) the key existing and emerging approach seeking to replace Al wire bonding to boost thermal reliability in PE packages. In this article, we examine how and why metal sintering is emerging as an alternative to, or as the next generation of, die attach technology, seeking to replace solder in demanding applications.
Eagleyard are a laser diode manufacturer.
Bringing blockchain into the car
The goal of the collaboration is to test possible applications and develop suitable ones to market maturity. A first demonstrator shows how access rights, e.g. for car sharing, can be granted decentrally with a smartphone app.