25 Feb 2026

Why Consumer Electronics Will Continue to Lead the Edge AI Chip Market
Latency, energy, privacy. By shifting AI computation from the cloud to the edge, these issues can be alleviated. 2025 was a breakout year for many AI applications, with consumer electronics leading the way in revenue due to the trend to towards AI smartphones and PCs, and rising costs of chips manufactured on leading process nodes.
Background
28 Jan 2026

Fourier Robotics
IDTechEx spoke to Fourier Robotics on its humanoid robot technology developments at CES 2026.
Full profile interview
22 Jan 2026

Blueqat
Blueqat is a Japanese developer of quantum hardware and software solutions, currently developing a silicon-spin qubit quantum computer.
Update interview
22 Jan 2026

National Institute of Advanced Industrial Science and Technology AIST
Japan's National Institute of Advanced Industrial Science and Technology (AIST) is a Japanese research facility headquartered in Tokyo and operating under the Ministry of Economy, Trade and Industry (METI). This profile will focus on their work in developing quantum computing hardware and international collaborations.
28 Nov 2025

New IDTechEx Report: Co-Packaged Optics (CPO) 2026-2036
IDTechEx's report titled "Co-Packaged Optics (CPO) 2026 to 2036: Technologies, Market, and Forecasts" reviews recent advances in CPO technology, tracks emerging packaging approaches, assesses the strategies of leading companies, and provides long term market forecasts. The report highlights how CPO adoption is set to reshape data center infrastructure in the coming decade.
Full profile interview
25 Nov 2025

Mobileye
Mobileye is a global leader in advanced driver assistance systems and autonomous driving technologies.
Appears in IDTechEx Report

24 Nov 2025
Sensor Market 2026-2036: Technologies, Trends, Players, Forecasts
IDTechEx Report: Dr Tess Skyrme, Mika Takahashi, Dr Conor O'Brien, Noah El Alami, Daniel Parr, Shihao Fu, Dr Yu-Han Chang and Dr Xiaoxi He
12 Nov 2025

Low-Loss Glass for RF & Photonics: From Ka Band to Co-Packaged Optics
As radio frequency front ends extend into Ka band (about 26.5-40 GHz) and data center networks advance toward co packaged optics, engineered low loss glass substrates valued for high resistivity, dimensional stability, and compatibility with through glass via interconnects are emerging as an integration platform for antenna in package modules and optical electrical co design alike.
8 Oct 2025

Glass Interposers and Substrates in Advanced Packaging
Glass interposers and glass core substrates are being pursued intensively by leading device makers, materials suppliers, and equipment vendors for advanced packaging applications, as discussed in IDTechEx's brand new report "Glass in Semiconductors 2026-2036: Applications, Emerging Technologies, and Market Insights".
2 Sep 2025

Glass in Semiconductors: The Next Inflection in Semiconductors
IDTechEx has released a brand-new market report, "Glass in Semiconductors 2026-2036: Applications, Emerging Technologies, and Market Insights", providing end-to-end market intelligence for seven distinct glass product segments, with technology deep-dives, benchmarking, supply chain mapping, adoption drivers, risk analysis, and unit and revenue forecasts 2025-2036.