16 Oct 2019
Die Attach Materials for Power Electronics in Electric Vehicles
New IDTechEx Research report investigates the market for various die and substrate attach materials used in power electronics in various electric vehicles. It provides a comprehensive view of the industry trends, looking at the trends driving the adoption of higher performance die-attach materials.
24 Jul 2019
Technology evolution for the die and substrate attach paste
This is part III of our series on metal sintering in power electronics (PE). In the last two parts, we considered (1) the key trends shaping the power electronic technology, and (2) the key existing and emerging approach seeking to replace Al wire bonding to boost thermal reliability in PE packages. In this article, we examine how and why metal sintering is emerging as an alternative to, or as the next generation of, die attach technology, seeking to replace solder in demanding applications.
13 Nov 2012
Microsemi ultra low power sub-GHz radio in compact chip scale package
Microsemi Corporation has announced the availability of a new ultra low power (ULP) radio frequency (RF) transceiver for short-range wireless applications where power consumption is of utmost importance.
19 Apr 2012
Wireless Sensor Networks: What's next for WSN at WSN & RTLS Europe
Starting with more humble killer applications such as meter reading in buildings, WSN will grow rapidly from $0.58 billion in 2012 to $2.4 billion in 2022 according to IDTechEx research.
6 Mar 2012
Eco Wave Power finalizing medium-scale wave energy generation system
Eco Wave Power is in final construction phases of its' medium scale wave energy generation system.
24 Feb 2012
Interview with Microsemi
Dr Harry Zervos recently interviewed Mr Mauricio Peres, product marketing director with Microsemi, an $840 Million company specializing in high performance, high quality analog devices, ICs, all the way to complete subsystems for a variety of industry sectors.