Full profile interview: SWOT
26 Jul 2021

MacDermid Alpha
business in over 50 countries.
Background
7 Jul 2020

Namics
This is a low-temperature die-attach conductive paste for metalorganic nano Ag inks. The innovation is mostly around lowering the sintering temperature.
22 Oct 2019

Spotlight on NAMICS
NAMICS will be showcasing their innovative stretchable materials designed for interconnects, heating and bonding on in-mold electronics (IME), flexible hybrid electronics (FHE) and e-textiles applications at the IDTechEx Show! November 20-21 2019, Santa Clara, CA.
16 Oct 2019

Die Attach Materials for Power Electronics in Electric Vehicles
New IDTechEx Research report investigates the market for various die and substrate attach materials used in power electronics in various electric vehicles. It provides a comprehensive view of the industry trends, looking at the trends driving the adoption of higher performance die-attach materials.
29 Jul 2019

Metal sintering die attach materials, processes, and suppliers
This is part V of our article series.
31 Oct 2018

Spotlight on NAMICS
NAMICS will be showcasing the latest generation of their stretchable materials for interconnects, heating and bonding on flexible substrates at Wearable USA 2018.
Event summary
13 Dec 2017

Report on IDTechEx Show! USA 2017
The following article summarises some of the key observations made by IDTechEx analysts during the IDTechEx Show! It contains details of many of the companies demonstrating products during the exhibition, notable presentations given and summaries of relevant conversations and recent updates.