NAMICS Corporation

NAMICS Corporation

HQ Country
Japan
Profile
NAMICS Corporation is a leading source for underfills, encapsulants, adhesives, and insulating and conductive materials used by producers of semiconductor devices, passive components and solar cells. Headquartered in Niigata, Japan with subsidiaries in the USA, Europe, Singapore, Korea, Taiwan and China, NAMICS serves its worldwide customers with enabling products for leading edge applications.
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2020
13 Nov 2020

Materials for Printed/Flexible Electronics 2021-2031: Technologies, Applications, Market Forecasts

IDTechEx Report: Dr Matthew Dyson, Raghu Das and Dr Richard Collins
12 Aug 2020

3D Electronics 2020-2030: Technologies, Forecasts, Players

IDTechEx Report: Dr Matthew Dyson and Dr Richard Collins
7 Jul 2020

Namics

This is a low-temperature die-attach conductive paste for metalorganic nano Ag inks. The innovation is mostly around lowering the sintering temperature.
19 Jun 2020

Thermal Management for 5G

IDTechEx Report: Dr James Edmondson and Dr Luyun Jiang
9 Apr 2020

Conductive Ink Markets 2020-2030: Forecasts, Technologies, Players

IDTechEx Report: Dr Matthew Dyson and Yasuo Yamamoto
3 Apr 2020

Flexible Electronics in Healthcare 2020-2030

IDTechEx Report: Dr Nadia Tsao, James Hayward and Raghu Das
13 Mar 2020

In-Mold Electronics 2020-2030: Technology, Market Forecasts, Players

IDTechEx Report: Dr Richard Collins
2019
20 Nov 2019

Next Generation Stretchable Materials

NAMICS Technologies, Inc, United States
29 Oct 2019

Smart Materials Opportunities in Structural Electronics and Electrics 2020-2030

IDTechEx Report: Dr Peter Harrop and Raghu Das
22 Oct 2019

Spotlight on NAMICS

NAMICS will be showcasing their innovative stretchable materials designed for interconnects, heating and bonding on in-mold electronics (IME), flexible hybrid electronics (FHE) and e-textiles applications at the IDTechEx Show! November 20-21 2019, Santa Clara, CA.
16 Oct 2019

Die Attach Materials for Power Electronics in Electric Vehicles

New IDTechEx Research report investigates the market for various die and substrate attach materials used in power electronics in various electric vehicles. It provides a comprehensive view of the industry trends, looking at the trends driving the adoption of higher performance die-attach materials.
1 Oct 2019

Die Attach Materials for Power Electronics in Electric Vehicles 2020-2030

IDTechEx Report:
29 Jul 2019

Metal sintering die attach materials, processes, and suppliers

This is part V of our article series.
2018
31 Oct 2018

Spotlight on NAMICS

NAMICS will be showcasing the latest generation of their stretchable materials for interconnects, heating and bonding on flexible substrates at Wearable USA 2018.
2 Oct 2018

Stretchable and Conformal Electronics 2019-2029

IDTechEx Report: James Hayward and Dr Xiaoxi He
2017
13 Dec 2017

Report on IDTechEx Show! USA 2017

The following article summarises some of the key observations made by IDTechEx analysts during the IDTechEx Show! It contains details of many of the companies demonstrating products during the exhibition, notable presentations given and summaries of relevant conversations and recent updates.
16 Nov 2017

Next Generation Stretchable Materials

NAMICS Technologies, Inc, United States