Conductive Inks: Power Electronics, EMI Shielding, In-Mold Electronics
Every year IDTechEx Research publishes an article that reflects the latest trends in the conductive ink industry. These articles are based on IDTechEx Research's report "Conductive Ink Markets 2019-2029: Forecasts, Technologies, Players", which is the result of ongoing research over the past eight years. This year IDTechEx will give an update on multiple less mature trends which offer high growth potential.
Optomec Partners with Phillips Federal
Optomec Partners with Phillips Federal to Bring Metal Additive Manufacturing Repair Solutions to U.S. Government Agencies: Optomec announced that it has signed a partnership agreement with Phillips Federal. The agreement will enable Phillips Federal to resell the Optomec Laser Engineered Net Shaping systems to US government facilities.
Optomec acquires Huffman, leader in metal additive manufacturing
Optomec announced that it has acquired Huffman. Huffman's equipment and software are in production at virtually all major manufacturers of aircraft engines and industrial gas turbines, who use its metal deposition capabilities to restore worn or damaged components at substantially lower cost than newly-made spare parts.
Competing Technologies to In Mold Electronics
In this article we will provide a high level comparison of several technologies against IME competing against in-mold electronics.
Optomec features aerosol jet HD system
Optomec today announced that the company will showcase it's Aerosol Jet HD System for today's most demanding electronics packaging challenges at the IDTechEx Printed Electronics USA show in Santa Clara, California this week.
Optomec LENS hybrid system used to manufacture dissolvable metal
Optomec, a leading global supplier of production-grade additive manufacturing systems for 3D Printed Metals unveiled details of how the University of Nebraska-Lincoln is using a LENS Hybrid Controlled Atmosphere System to develop dissolvable magnesium components that will have broad-reaching implications in the design and manufacture of next-generation medical implants.