11 Dec 2020
Flexible Hybrid Electronics Requires New Component Attachment Material
Despite the promise of and the commercial interest in FHE, some technological challenges remain. One of the most important is developing the ability to robustly attach mounted components to flexible substrates, given the substantial difference in mechanical and thermal properties.
19 Nov 2020
Printed Electronic Materials Market Forecast to Reach $6.9Bn by 2031
In total, IDTechEx Research forecast that the market for specialized solution processable materials for printed/flexible electronics will reach $6.9Bn by 2031.
28 Aug 2020
Harting is a German company that manufactures a wide range of electrical, electronic and mechanical components, including connectors and 3D-MID devices. This profile focuses on their activities in 3D-MID, more specifically laser direct structuring (LDS).
18 Aug 2020
Nopion are a Korean company that specializes in metallic nanoparticles. Along with applications such as EMI shielding, thesenanoparticles are employed in a self-assembling anisotropic conductive adhesives that enables component attachment at lower pressures than the incumbent technology.
12 Aug 2020
CondAlign has developed a technology for making anisotropic conductive films, in which electrically and/or thermally conductive particles are aligned by applying an electric field during film manufacture.
17 Jun 2020
Flexible Hybrid Electronics: Strategies to Enable Cheaper Substrates
Picture a flexible circuit board (FPCB) and you will almost inevitably visualise a sheet of orange/brown plastic, probably with a few copper traces and maybe some soldered components on it. This plastic is PI (polyimide/Kapton), and its ubiquity is primarily due to its temperature resistance and general durability.
6 May 2020
Flexible Hybrid Electronics: Future of Flexible Printed Circuit Boards
Flexible hybrid electronics (FHE) is a novel approach to electronic circuit manufacturing that aims to combine the best of printed and conventional electronics.
4 May 2020
Component Carrier Now Replacing Flexible PCBs
Flexible circuit boards offer numerous advantages. However, the mechanical fixation of these circuit boards is highly complex. HARTING has developed a new solution based on 3D-MID technology that is capable of replacing flexible circuit boards. Thanks to component carriers, cost savings of up to two-thirds can be achieved.
1 May 2020
Palomar provides automated die attach, wire bonding and vacuum reflow equipment. With the advent of 5G, Palomar foresee a rise in the use of Ag sintering for RF GaN devices in 5G infrastructure.
13 Apr 2020
Routes to 3D Electronics: Assessment of Technologies and Applications
Metallization of 3D surfaces is a growing field with diverse applications. In this article, we briefly discuss some techniques and applications thereof. More specifically, we discuss and critically benchmark laser direct structuring, aerosol, 3D printed electronics, two-shot molding and In-Mold Electronics.
8 Apr 2020
Quantum Dots: Progress, Challenges And Future In LED Lighting
In this article, we discuss the challenges and prospects faced by QDs in the general lighting market. This article draws from the report "Quantum Dot Materials and Technologies 2020-2030: Trends, Markets, Players".
9 Mar 2020
ITN Energy Systems
ITN Energy Systems presented at Flex2020 a thin film battery that served as a substrate for power control circuits and sensors, all within a thin film format.
20 Feb 2020
Indium Corporation offers a range of electronic assembly materials, such as solder, thermal interface materials, In this profile we focus primarily on the aspects of their range relevant to printed electronics, particularly low temperature solder and ITO.
19 Feb 2020
PrintCB are an Israeli start-up offering conductive copper ink, with a view to enabling circuit boards to be printed rather than etched. In contrast to other conductive inks, their ink is based on micron sized copper particles and is highly metallic.
11 Feb 2020
SAFI-Tech are an early stage company that has developed a revolutionary approach to low temperature soldering. This involves confining super-cooled liquid solder within a primarily oxide shell, which enables it to flow at ambient temperature when the shell is broken. This has especially useful in attaching components to lightweight flexible substrates.
10 Feb 2020
Panasonic (Electronic Materials Business Division)
Panasonic Electronic Materials Business Division focuses primarily on high performance PCBs. However, this profile focuses on their recently developed stretchable, temperature resistant flexible substrate that provides a platform for 'stretchable hybrid electronics', and is particularly applicable to wearable devices.
31 Jan 2020
NovaCentrix has developed photonic curing/sintering, which enables conductive inks and solder to be heated without damaging the substrate. This facilitates printing conductive inks and soldering components onto cheap flexible substrates such as PET rather than requiring expensive temperature-resistant substrates.
31 Jan 2020
Alpha is the market leader in providing surface mount technology (SMT) solutions, which includes solder in various forms along with conductive adhesives. This profile primarily focuses on a new product that is highly relevant for printed/flexible electronics, specifically low temperature solder. This should facilitate attaching components to low-cost, flexible, transparent substrates such as PET.
24 Jan 2020
Pacific Light Technology (Osram)
Pacific Light Technology (PLT) was established in 2011 in Oregon.
13 Nov 2019
NovaCentrix Continues to Revolutionize Next-Gen Applications
The pace of innovation is only accelerating, and NovaCentrix remains at the forefront of tools, materials, and processes for advancement in flexible hybrid electronics. NovaCentrix are a Platinum sponsor of the IDTechEx Show! November 20-21 2019, Santa Clara, CA.