Taiwan Semiconductor Manufacturing Company, Ltd.

Advantest

Advantest is the leading producer of automatic test equipment (ATE) in the semiconductor industry and one of the top large suppliers of chip-making equipment. It supplies ATE for system on chip (SoC), memory, and power devices.

Chiplet Technology: Unlocking New Potential in Semiconductor Industry

Chiplet technology is poised to revolutionize the semiconductor industry by offering a flexible, cost-effective solution that enhances performance while addressing supply chain challenges. As outlined in the IDTechEx report "Chiplet Technology 2025-2035: Technology, Opportunities, Applications," this technology will continue to create opportunities for innovation across various sectors, driving growth and fostering collaboration among industry players.

SureCore

SureCore develops low-power static random access memory (SRAM) technologies, offering solutions that reduce dynamic power consumption by up to 50% and leakage power by up to 20%. Its silicon-proven IP targets energy-efficient applications in IoT, edge computing, wearable devices, and quantum computing, with specialized products like CryoMem™ designed for cryogenic environments.

Imec

Imec is a Belgian research institute, founded in 1984. It works on state-of-the-art semiconductor and nanoelectronics manufacturing. This profile explores the Sustainable Semiconductor Technologies & Systems (SSTS) program.

Artilux Inc

Artilux are a germanium-on-silicon (GeSi) technology platform company, developing and manufacturing GeSi photonics for a range of sensing, imaging, computing, and communications applications.

Comet Yxlon

Comet Yxlon is a division of Comet and develops X-ray and CT systems for non-destructive testing and metrology instruments for the semiconductor/electronics, automotive, and aerospace industries.

Advanced Semiconductor Packaging: Driving Next-Gen HPC Performance

Advanced semiconductor packaging is experiencing significant growth due to the interplay of technological, economic, and market forces. As silicon scaling approaches its limits, advanced packaging offers a viable alternative for boosting chip performance, particularly for high-performance computing (HPC) applications like AI and data centers, which demand increased computational power and bandwidth.

Emerging Trends and Key Markets in 2.5D and 3D Semiconductor Packaging

Emerging advanced semiconductor packaging technologies, such as 2.5D and 3D hybrid bonding, are crucial for enhancing system performance across various applications such as AI and high-performance computing. This article explores the technology development trends in 2.5D and 3D packaging technologies and the key market growth drivers.

US Chips Act Set to Reshape Helium Demand in the US

Given helium's critical role in semiconductor production, onshoring chip manufacturing will have a significant knock-on impact on the helium demand for semiconductor manufacturing.

2.5D and 3D - IDTechEx Explores Advanced Semiconductor Packaging

High-performance computing, 6G communication, autonomous vehicle chips, and consumer electronics are all key markets that benefit from advancing semiconductor packaging. IDTechEx's report, "Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications", goes into detail about emerging technologies, including 2.5D and 3D packaging.

Co-Packaged Optics (CPO): Evaluating Different Packaging Technologies

The rise of co-packaged optics is transforming modern data centers and high-performance networks by addressing critical challenges such as bandwidth density, energy efficiency, and scalability. CPO enhances interconnect bandwidth and energy efficiency by integrating optics and electronics within a single package, significantly shortening electrical link lengths.

IDTechEx Explores Emerging Materials for PICs

Photonic Integrated Circuits are photonic circuits formed on a semiconductor material that allows light to pass through it, such as silicon dioxide, also known as Silica (or Glass). These photonic circuits contain components for manipulating light passing through the circuit, enabling functionalities such as data transmission, sensing, and processing within a compact form factor. PICs are fundamentally altering how we manage and utilize optical signals, paving the way for advancements across multiple industries.

Ayar Labs: AI Accelerator Interconnect

Ayar Labs is a San Jose-based startup working on an optical I/O connectivity solution that offers high bandwidth, low-power, low-latency connections, using photonic integrated circuits (PICs) and electrical integrated circuits (EICs) on a monolithic chiplet. IDTechEx Technology Analyst James Falkiner spoke with Terry Thorn, Vice President of Commercial Operations at Ayar Labs, discussing Ayar Labs' current and future solutions for high-speed in-package optical communications.

Role of 3D Cu-Cu Hybrid Bonding in Powering Future HPC & AI Products

Semiconductor packaging has evolved from traditional 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving interconnecting pitches as small as single micrometers and over 1000 GB/s bandwidth. Key parameters, including Power, Performance, Area, and Cost, are crucial considerations. Power efficiency is enhanced through innovative packaging techniques, while Performance benefits from shorter interconnection pitches. Area requirements vary for high-performance chips and 3D integration's smaller z-form factor.

JSR Corporation

JSR Corporation is a Japanese company that specializes in materials innovation for various industries, such as digital solutions, life sciences, and plastics. IDTechEx spoke with JSR at Semicon Europe 2023

TOK

Tokyo Ohka Kogyo Co., Ltd. (TOK) is a Japan-based company that supplies photoresist material for the semiconductor industry. IDTechEx spoke with TOK at Semicon Europe 2023 to discuss its product offerings, specifically focused on those for advanced semiconductor packaging

Camtek

FormFactor FRT (acquired by Camtek), headquartered in Bergisch Gladbach, Germany, is a supplier of high-precision metrology solutions for the advanced packaging and silicon carbide markets. IDTechEx spoke with FRT/Camtek at Semicon Europe 2023.

Advanced Semiconductor Packaging Trends in AI and HPC

Advanced semiconductor packaging technologies like 2.5D and 3D hybrid bonding, along with emerging solutions like silicon photonics, are critical in optimizing system performance and fostering the next wave of AI and HPC chip innovation.

Hailo: AI Acceleration in Automotive SoCs

Hailo started with AI accelerator chips in the automotive industry but has recently launched its system on chip. IDTechEx spoke to Hailo at CES 2024.

The Age of Artificial Intelligence: AI Chips to 2034

Artificial Intelligence is transforming the world as we know it; from the success of DeepMind over Go world champion Lee Sedol in 2016 to the robust predictive abilities of OpenAI's ChatGPT, the complexity of AI training algorithms is growing at a startlingly fast pace, where the amount of compute necessary to run newly-developed training algorithms appears to be doubling roughly every four months.