Universal Instruments is a global leader in the design and manufacture of advanced automation and assembly equipment solutions for the electronics manufacturing industry. With a lineage of more than 50 years, Universal is the longest-standing company in the electronics assembly space.
Today, Universal's core products include comprehensive surface mount platforms; leading-edge advanced semiconductor packaging solutions; a through-hole lineup that is the industry standard for productivity and reliability; flexible automation cells for odd-form or light mechanical and back-end assembly; line software to manage manufacturing activities and deliver true control over manufacturing profitability; and industry-leading support and services worldwide.
Universal Instruments Advanced Process Laboratory (APL) has run the Advanced Research in Electronics Assembly (AREA_ Consortium since 1993 focusing on academic level research into device attachment and reliability. The research has provided an understanding of emerging technologies in materials, design, assembly process and reliability. We have focused on precompetitive technologies and as a result we have had the opportunity to study and influence the techniques, designs and materials utilized in all the major packaging advancements in the past 25 years. This research provides the APL a strong background for undertaking emerging and disruptive technology development to enable the future of electronics and mechatronic manufacturing.