Advanced Semiconductor Packaging: Materials, Technology, Market Outlook

The slowing of Moore's law and the rising development and manufacturing cost of monolithic Si IC are the two primary reasons why developing advanced semiconductor packaging technologies is crucial right now. In comparison to conventional packaging technologies, advanced semiconductor packaging technologies, such as 2.5D and 3D, promise high bandwidth and low signal latency interconnect, enabling the IC vendor to continue to supply high-performance chips at a reasonable price.
Currently, several high-end commercial products have already used 2.5D and 3D advanced semiconductor packaging technologies. Nevertheless, numerous development initiatives are currently underway to further improve the performance of such devices and expand the package size to accommodate additional components. Ultimately, the goal is to have a completely 3D integration where many logic ICs and memory are physically placed on top of one another. However, the road is by no means simple. Thermal management and manufacturing face several problems that have yet to be overcome.
In this webinar, Dr. Yu-Han Chang, a Senior Technology Analyst, will present IDTechEx's latest data and prospects for the advanced semiconductor packaging industry, which will include research from IDTechEx's advanced semiconductor packaging market research portfolio.
This webinar will provide an overview of the current state of the advanced semiconductor packaging industry, and the content include:
  • Advanced semiconductor packaging markets and their mid-long-term opportunity
  • Player analysis - the dynamics of advanced semiconductor packaging battleground
  • Industry barriers: Manufacturing challenges and material requirements
  • Research direction for Advanced Semiconductor Packaging