Materiales de bajas pérdidas 2026-2036: mercados, tendencias y previsiones

Materiales de bajas pérdidas para radares automotrices 5G, 6G, digitales de alta velocidad, con evaluación del mercado, descripción general del jugador, tendencias, puntos de referencia detallados y pronósticos.

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Transmission losses become increasingly significant as communication systems move toward higher frequencies, making low-loss materials essential to preserve signal strength and integrity. These materials are critical for technologies such as 5G mmWave and future 6G telecommunications which is expected to see deployment around 2030, as well as for automotive radar systems for advanced driver assistance systems (ADAS). Similarly, data center infrastructure is shifting toward ultra-high data rates exceeding 200Gbps amplifying the need for materials that can perform reliably and maintain signal integrity under such demanding conditions. The growth of these markets presents a significant opportunity for low-loss materials, with IDTechEx's forecasts predicting a ~7-fold increase in material demand for 5G and automotive radar over the next decade, at a CAGR of 21.3%.
 
IDTechEx's report offers an independent and comprehensive analysis of market trends, examining key technologies and application areas driving demand for low-loss materials. Drawing on primary research, the report delivers insights into industry developments, analyzes leading market players, and benchmarks products across critical material performance characteristics. The report also includes 10-year demand forecasts segmented by application and material type.
 
Low-loss materials market, 5G materials trends, low-loss materials for mmWave, low-loss materials for 6G, materials for high-speed digital
The range of loss tangent (Df) values of low-loss materials and the key material properties assessed in IDTechEx's report "Low-Loss Materials for 5G/6G, Radar, and High-Speed Digital 2026-2036: Markets, Trends, and Forecasts". Source: IDTechEx
 
Low-Loss Materials for 5G and Beyond
With the future rise of mmWave 5G and eventually 6G, low-loss materials will experience rapid growth and play an increasingly important role. Low-loss materials will not only be used as a substrate for RF components or for the PCB, but also within advanced packages. One strong packaging trend is antenna in package (AiP); as telecom technology goes higher in frequency towards mmWave 5G and beyond, the size of the antenna elements will shrink such that the arrays can be fitted into the package itself. This integration will also help shorten the RF paths and thus minimize the transmission losses. AiP will need low-loss materials for the substrates, redistribution layers, electromagnetic interference (EMI) shielding, mold underfill (MUF) materials, and more. The report covers these trends and technologies in greater detail, along with providing 10-year material demand forecast by frequency (sub-6GHz and mmWave) and material type (e.g. epoxy and BT, PTFE, LTCC & ceramics, PI & MPI, etc.) for 5G smartphones, base stations, and customer premise equipment (CPE).
 
Additionally, work is well underway in preparation for 6G which IDTechEx expects to enter commercialization around 2030. Research institutions and materials suppliers are already exploring the material requirements needed to meet the next generation of telecommunication technologies. This report explores the approaches to achieve even lower Df/Dk for 6G and potential 6G applications, like reconfigurable intelligent surfaces (RIS).
 
Low-Loss Materials for Automotive Radar
As automotive autonomy advances, the number of sensors integrated into each vehicle continues to rise. Over the past decade, increasingly sophisticated ADAS capabilities have driven widespread adoption of radar technologies, with the current 76-81GHz band for long-rage radar, and ongoing development of 140GHz systems. Alongside this shift, industry trends such as greater system integration and continual cost pressures are placing increased emphasis on cost-efficient, low-loss materials capable of operating reliably at high frequencies. To meet these needs, materials must not only exhibit low and stable dielectric constant (Dk) and loss tangent (Df) across operating frequencies and temperatures, but also deliver strong thermal and moisture stability, consistent physical and electrical performance, and high manufacturing processability, all while keeping costs competitive. Detailed assessments of trends, material requirements, and 10-year forecasts for material demand (by material type) for automotive radar are available within the report.
 
Low-Loss Materials for High-Speed Digital
The demand for signal integrity continues to rise as higher frequencies and faster data transfer speeds become essential to meet the growing data needs of our increasingly connected world. Datacenter infrastructure increasingly relies on low-loss materials to maintain signal integrity and reliability for high data transfer rates, where low-loss materials are used in substrates across high performance computing servers, storage area networks, transceivers, routers, power amplifiers, high speed data channels, and more. Substrates for high-speed digital (HSD) are generally multilayered complex structures with high density of traces, thus selecting materials for HSD requires significant consideration of the mechanical and thermal properties as these need to undergo multiple thermal cycling during manufacturing. IDTechEx spoke to low-loss materials players such as Kyocera and Isola, who are increasingly focusing on these applications.
 
Benchmarks for Low-Loss Materials Covered within the Report
In this report, IDTechEx surveys the landscape of low-loss materials and benchmark the performance of over 150 products by several key factors, i.e. dielectric constant (Dk), dissipation factor/loss tangent (Df), frequency dependence of dielectric properties, thermal conductivity, coefficient of thermal expansion (CTE), glass transition temperature, moisture absorption, and more. In addition, the report also considers material cost and processability.
 
Organic materials have gained significant popularity for high frequency applications, with significant efforts to find PTFE alternatives, which has also seen the adoption of materials like PPE, LCP, hydrocarbons, and other advanced thermosets. While inorganic materials may appear to be progressing more slowly, materials like glass, LTCC, and other ceramics offer strong long-term potential owing to their excellent electrical and thermal properties.
 
The report highlights promising low-loss materials for high frequency applications. This includes:
  • Low-loss thermoset materials: thermoset materials dominate the market for 3G/4G network devices. However, the high Dk and Df restrict their use in mmWave 5G. Here, IDTechEx's report focuses on the strategies and R&D effort from key materials suppliers to reduce the Dk and Df for these materials.
  • Polytetrafluoroethylene (PTFE): one of the most common materials for high-frequency applications such as automotive radar systems, high speed/high frequency (HS/HF) board and connectors, and especially suited for high power applications. However, manufacturing challenges, high cost, and regulatory pressures are driving the popularity of alternatives.
  • Liquid crystal polymers (LCP): it has been adapted to make flexible board for smartphone antennas. The market will continue to grow and expand into other applications.
  • Polyphenylene Ether (PPE): Widely considered a low-cost alternative to PTFE, these materials continue to see growing adoption across mmWave automotive radar, high-speed digital (HSD), and 5G infrastructure.
  • Low temperature co-fired ceramic (LTCC): the low Df and wide range of Dk for LTCC has long-term potential in the market owing to their excellent electrical and thermal properties.
  • Others: A variety of other materials are seeing market growth and ongoing developments for high frequency applications, such as hydrocarbons, glass, and non-halogenated resins.
Key Aspects:
This report provides extensive information and analysis on the major materials, players, and trends for low-loss materials for high frequency applications such as 5G and 6G, automotive radar, and high-speed digital (HSD). It includes insights and analysis on:
  • benchmarking of commercial products (using IDTechEx's database of over 150 products)
  • Design considerations for low-loss materials
  • Materials covered: PTFE, LCP, PPE, hydrocarbons, LTCC and ceramics, glass, materials for 6G
  • Trends in semiconductor packaging: antenna in packaging (AiP), low-loss materials at the package and wafer levels
  • Chapters covering key trends in 5G/6G, automotive radar, and high-speed digital
The report provides 10-year granular forecasts 2025-2036:
  • Material type and frequency (sub 6-GHz and mmWave) for 5G: smartphones, base stations, and customer premises equipment
  • Material type and component for automotive radar
Report MetricsDetails
CAGRDemand for low-loss materials for 5G and automotive radar will grow at a CAGR of 21.3% between 2026-2036.
Forecast Period2026 - 2036
Forecast UnitsArea (m2)
Regions CoveredWorldwide
Segments Covered5G: Frequency (sub-6GHz, mmWave 5G), Material Type (polyimide, epoxy, PTFE, LCP, etc.), Component Type (antenna, beamforming components, etc.), Automotive radar by component (PCB, antenna, radome), by material type (PTFE, PPE, LCP, etc.).
Analyst access from IDTechEx
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Further information
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1.EXECUTIVE SUMMARY
1.1.High Frequency Communications Driving Demand for Low-Loss Materials
1.2.Key Trends and Requirements for Low-Loss Materials
1.3.Typical Dk And Df Value Requirements by Applications
1.4.Low-loss materials discussed in this report
1.5.Applications of Low-loss Materials in Semiconductor and Electronics Packaging
1.6.Evolution OF Mobile Communications Driving Demand For Low-loss Materials
1.7.Mobile Telecommunication Spectrum and Network Deployment Strategy
1.8.IDTechEx Forecasts for Low-Loss Materials For 5G: By Material Type
1.9.LTCC: Market shifts and trends
1.10.What Is 6G And Why Develop It?
1.11.IDTechEx Outlook Of Low-Loss Materials For 6G
1.12.Applications of Low-Loss Materials for High-Speed Digital
1.13.Trends in Low-Loss Materials for High-Speed Digital
1.14.Radar is a Key Enabler for Advanced Driver Assistance Systems (ADAS)
1.15.Key Trends and Requirements for PCB Materials for Automotive Radar
1.16.IDTechEx Forecasts for Low-Loss Materials for Automotive Radar PCBs and Antenna
1.17.Innovation Trends for Organic High Frequency Laminate Materials
1.18.Minimizing Transmission Loss Essential in High Frequency Communication
1.19.Summary of Low-Loss Materials Based on IDTechEx's Database of 150 Products
1.20.Benchmark - Dk Vs Df of Over 150 Low-loss Organic and Inorganic Materials
1.21.Frequency Dependency Of Dk And Df: Organic and Inorganic Materials
1.22.Other Important Factors to Consider for the Selection of Low-Loss Materials
1.23.Comparison: CTE of Low-Loss Materials
1.24.Comparison: Glass Transition Temperature of Low-Loss Materials
1.25.Summary: Moisture Absorption, Thermal Conductivity, Processability, And Cost
1.26.Player Overview of Low-Loss Materials: By Material Type
1.27.Forecasts: Low-loss Materials Area for 5G CPE, Smartphones, Infrastructure, and Automotive Radar
1.28.For more information on 6G, automotive radar, and antenna-in-package technologies and markets
1.29.Access more with an IDTechEx subscription
2.INTRODUCTION
2.1.High Frequency Communications Driving Demand for Low-Loss Materials
2.2.High frequency communication: Challenges, trends, and innovation
2.3.Low-loss materials are key to high frequency communication
2.4.Low-loss materials discussed in this report
2.5.Applications of low-loss materials in semiconductor and electronics packaging
2.6.Anatomy of a copper clad laminate
2.7.Key components of copper clad laminates
2.8.PCB core in laminates: Key aspects
2.9.Low-loss materials for 5G
2.10.Low-loss materials can also be used in radome cover or molding housing
2.11.Automotive mmWave radars: 77GHz band
2.12.Low-loss materials for semiconductor packages and high-speed digital (HSD)
2.13.Trends and developments in patent applications
3.MATERIALS & PLAYERS
3.1.1.Overview of low-loss materials for PCBs and semiconductor packages
3.1.2.Material overview: By application
3.1.3.Player overview: By material type
3.1.4.Important factors to consider for the selection of low-loss materials
3.1.5.Summary: Ceramics vs Organics
3.1.6.What about the copper foil?
3.1.7.Stability of dielectric constant is a key consideration for signal integrity
3.1.8.Rigid-flex and flexible PCBs: Applications and standards
3.1.9.Rigid-flex and flexible PCBs: Types
3.2.Low-loss Organic Laminate Overview
3.2.1.Electric properties of common polymers
3.2.2.Thermoplastics vs thermosets
3.2.3.Thermoplastics vs thermosets for 5G
3.2.4.Evolution of organic PCB materials for 5G and beyond
3.2.5.Innovation trends for organic high frequency laminate materials
3.3.Low-Loss Organics: Design Considerations
3.3.1.Strategies to achieve lower dielectric loss and trade-offs
3.3.2.Factors affecting dielectric loss: Polarizability and molar volume
3.3.3.Factors affecting dielectric loss: Curing temperature
3.3.4.Strategies to reduce Dk and Df: Low polarity functional groups
3.3.5.Strategies to reduce Dk and Df: Additives
3.3.6.Strategies to reduce Dk: Bulky structures
3.3.7.Strategies to reduce Dk: Porous structures
3.3.8.Strategies to reduce Df: Rigid structures
3.3.9.Summary: Key strategies to lower Dk and Df
3.3.10.Impact of glass-to-resin ratio
3.3.11.Effect of temperature on dielectric properties
3.3.12.Moisture effects
3.3.13.The influence of Dk and substrate choice on PCB feature size
3.3.14.The challenge of thinning the PCB-substrate for high frequency applications
3.4.Low-Loss Thermosets: Players
3.4.1.Low-loss thermoset suppliers: Ajinomoto Group's Ajinomoto Build Up Film (ABF) (1/2)
3.4.2.Ajinomoto Build Up Film: Process for manufacturing substrates with ABF
3.4.3.Low-loss thermoset suppliers: Taiyo Ink's PPE-based build-up materials
3.4.4.Low-loss thermoset suppliers: JSR's self crosslinking thermoset polyether
3.4.5.Low-loss thermoset suppliers: DuPont's Pyralux laminates
3.4.6.Low-loss thermoset suppliers: Panasonic's XPEDION series
3.4.7.Low-loss thermoset suppliers: Resonac
3.4.8.Low-loss thermoset suppliers: Mitsubishi Gas Chemical's BT laminate
3.4.9.Low-loss thermoset laminate suppliers: Isola
3.4.10.Isola's portfolio of thermoset materials
3.4.11.Low-loss thermoset laminate suppliers: Rogers
3.4.12.Low-loss thermoset adhesive: Toray's FALDA
3.4.13.Low-loss thermoset laminate suppliers: Nan Ya Plastics
3.5.Low-loss thermoplastics: Liquid crystal polymers
3.5.1.Liquid crystal polymers (LCP)
3.5.2.LCP classification
3.5.3.LCP as an alternative to PI for flexible printed circuit boards
3.5.4.LCP vs PI: Dk and Df
3.5.5.LCP vs PI: Moisture
3.5.6.LCP vs PI: Flexibility
3.5.7.LCP: Cost
3.5.8.Liquid crystal polymer supply chain
3.5.9.LCP Supplier: Sumitomo Chemical
3.5.10.LCP Suppliers: Celanese
3.5.11.Commercial LCP and LCP-FCCL products
3.6.PTFE and PFA
3.6.1.An introduction to fluoropolymers and PTFE
3.6.2.Key properties of PTFE to consider
3.6.3.Effect of crystallinity on the dielectric properties of PTFE-based laminates
3.6.4.PTFE: Dimensional instability of PTFE during processing
3.6.5.Ceramic-filled vs glass-filled PTFE laminates
3.6.6.5G application areas for ceramics/LTCC
3.6.7.Key applications of PTFE in 5G
3.6.8.Concerns of using PTFE-based laminates for high frequency 5G
3.6.9.PTFE laminate suppliers: Rogers
3.6.10.PTFE laminate suppliers: Rogers (2)
3.6.11.PTFE laminate suppliers: AMMK / AGC
3.6.12.PTFE laminate suppliers: SYTECH
3.6.13.PFA laminate suppliers: Chemours
3.7.Sustainability in low-loss materials: PTFE
3.7.1.Introduction to PFAS
3.7.2.Growing concerns about the negative impact of PFAS
3.7.3.Regulatory outlook for PFAS: EU
3.7.4.Regulatory outlook for PFAS: USA
3.7.5.Regulations on PFAS as relevant to low-loss materials
3.7.6.For more information on PFAS
3.8.Other organic materials: PPE, PPS, PBT, Hydrocarbons, etc
3.8.1.Poly(p-phenylene oxide) (PPO): Sabic
3.8.2.Poly(p-phenylene ether) (PPE): Panasonic's MEGTRON series
3.8.3.AGC's PPE range CCLs for automotive, 5G, chips, and HSD
3.8.4.Modified poly(p-phenylene ether) (mPPE): Asahi Kasei's XYRON (1)
3.8.5.Modified poly(p-phenylene ether) (mPPE): Asahi Kasei's XYRON (2)
3.8.6.Modified poly(p-phenylene ether) (mPPE): Asahi Kasei's SunForce
3.8.7.Polyphenylene sulfide (PPS): Solvay's materials for base station antennas
3.8.8.Polybutylene terephthalate (PBT): Toray
3.8.9.Hydrocarbon-based laminates
3.8.10.Polycarbonate (PC): Covestro's materials for injection-molded enclosures and covers
3.8.11.Laird's ECCOSTOCK range for radomes, antenna spacers, PCBs and other components
3.8.12.Aerogel suppliers: Blueshift's AeroZero for polyimide aerogel laminates
3.9.Low-temperature co-fired ceramics (LTCC) and ceramics
3.9.1.Introduction to ceramic materials, HTTC, and LTTC
3.9.2.LTCC substate manufacturing process
3.9.3.Dk and Df of different commercially available LTCC substrates
3.9.4.LTCC: Player overview
3.9.5.LTCC supplier: Celanese
3.9.6.LTCC Supplier: Nippon Electric Glass (NEG)
3.9.7.LTCC Supplier: GC Core by Nippon Electric Glass (NEG)
3.9.8.LTCC supplier: Kyocera
3.9.9.LTCC suppliers: Kyocera's LTCC-based packages
3.9.10.LTCC: Advantages and Challenges
3.10.Glass
3.10.1.Glass substrate
3.10.2.Properties of glass substrates
3.10.3.Glass as reinforcements - transition towards low Dk glass and quartz
3.10.4.Glass reinforcement weaves for organics
3.10.5.Glass as reinforcements for organics - challenges with E-glass
3.10.6.SCHOTT's low-loss glass substrates
3.10.7.Fused silica
3.10.8.Nippon Sheet Glass: Glass fillers for organics
3.11.Materials for 6G
3.11.1.Technical innovation comparison between 5G and 6G
3.11.2.IDTechEx outlook of low-loss materials for 6G
3.11.3.Dk and Df of various materials at 1THz
3.11.4.Testing of polyimide materials for 6G
3.11.5.Testing of commercially available Rogers' LCP, ceramic filled PTFE materials
3.11.6.RDL materials for 6G
3.11.7.Thermoplastics for 6G: Georgia Tech
3.11.8.PTFE for 6G: Yonsei University, GIST
3.11.9.PPS for 6G: Sichuan University
3.11.10.Thermosets for 6G: ITEQ Corporation, INAOE
3.11.11.PPE for 6G: Taiyo Ink, Georgia Institute of Technology
3.11.12.Silicate materials for 6G: University of Oulu, University of Szeged
3.11.13.Silicate materials for 6G: Tokyo Institute of Technology, AGC
3.11.14.Glass for 6G: Georgia Tech
3.11.15.Glass interposers for 6G
3.11.16.Metamaterials - Overview
3.11.17.LCPs are a promising method for creating active metasurfaces
3.11.18.Alcan Systems develops transparent liquid crystal phased array antennas
3.11.19.More information about Metamaterials
4.BENCHMARKING OF COMMERCIAL LOW-LOSS MATERIALS FOR PCBS AND RF COMPONENTS
4.1.1.Typical Dk and Df values requirements by applications
4.1.2.Benchmark - Dk vs Df of over 150 low-loss organic, inorganic & composite materials
4.1.3.Frequency dependency of Dk and Df: Organic and Inorganic Materials
4.1.4.Moisture absorption of low-loss materials
4.1.5.Thermal conductivity of low-loss materials
4.1.6.CTE of low-loss materials
4.1.7.Glass transition temperature of low loss materials
4.2.Organic Materials
4.2.1.Dk vs Df of organic materials (1)
4.2.2.Dk vs Df of organic materials (2)
4.2.3.Advantages and Challenges: By Material Type
4.2.4.Organic materials: Examples and typical applications
4.2.5.Frequency dependency of Dk and Df: PPE Materials
4.2.6.Frequency dependency of Dk and Df: Other Organic Materials
4.2.7.Other relevant properties of low-loss organic materials - average values
4.2.8.Thermal conductivity by type of organic material
4.2.9.Peel strength of laminates by organic material type
4.2.10.Glass transition temperature (Tg) by organic material type
4.2.11.Coefficient of thermal expansion (CTE) - T<Tg
4.3.Inorganic Materials
4.3.1.Benchmark: Dk and Df of LTCC
4.3.2.LTCC Materials - thermal conductivity and CTE
4.3.3.Benchmark: Glass materials
4.3.4.Frequency dependency of Dk and Df: Inorganics
4.4.Composites
4.4.1.Hydrocarbon materials and composites (1)
4.4.2.Hydrocarbon materials comparison: Dk and Df
4.4.3.Hydrocarbon materials comparisons: CTE
4.4.4.Hydrocarbon materials comparisons: Thermal Conductivity and Moisture Absorption
4.4.5.PTFE materials comparisons - Dk and Df
4.4.6.PTFE materials comparisons - Thermal Conductivity and Moisture Absorption
4.5.Summary of low-loss materials
4.5.1.Status and outlook of commercial low-loss materials for 5G, 6G, and THz PCBs/ components
4.5.2.Material Comparisons
5.TRENDS IN SEMICONDUCTOR PACKAGING
5.1.1.Overview of advanced semiconductor packaging
5.1.2.Progression From 1D To 3D Semiconductor Packaging
5.1.3.Packaging trends for 5G and 6G connectivity
5.1.4.Antenna Module Design Trends for 6G
5.1.5.Trade-Off in Integration Technologies
5.2.Antenna Packaging
5.2.1.Antenna Packaging vs Operational Frequency
5.2.2.Three ways of mmWave antenna integration
5.2.3.Choice of Antenna Packaging Technology Options
5.2.4.Benchmarking Three Antenna Packaging Technologies
5.2.5.Next Generation Phased Array Targets
5.2.6.High frequency integration and packaging trend
5.2.7.Low loss materials: Key for 5G mmWave AiP
5.2.8.Organic materials: The mainstream choice for substrates in AiP
5.2.9.LTCC AiP for 5G: TDK
5.2.10.Benchmark of Substrate Technologies for AiP
5.2.11.Antenna Integration Challenges in mmWave
5.2.12.Antenna on Chip (AoC) for 6G
5.2.13.Evolution of Hardware Components from 5G to 6G
5.2.14.Packaging Challenges for Freq. >100 GHz
5.2.15.mmWave AiP ecosystem
5.2.16.AiP for 5G and 6G, 2024-2034
5.3.Low-Loss Materials at the Package Level
5.3.1.Choices of low-loss materials for 5G mmWave AiP
5.3.2.Benchmark of low loss materials for AiP
5.3.3.Two types of IC-embedded technology
5.3.4.Two types of IC-embedded technology
5.3.5.Key market players for IC-embedded technology by technology type
5.3.6.What are EMC and MUFs?
5.3.7.Epoxy Molding Compound (EMC)
5.3.8.Key parameters for EMCs and EMC fillers
5.3.9.Experimental and commercial EMC products with low dielectric constant
5.3.10.Epoxy resin: Parameters of different resins and hardener systems
5.3.11.Supply chain for EMC materials
5.3.12.EMC innovation trends for high frequency applications
5.3.13.Molded underfill (MUF)
5.3.14.Liquid molding compound (LMC)
5.4.Low-Loss Materials at the Wafer-Level
5.4.1.Redistribution layer (RDL)
5.4.2.Key parameters for organic RDL materials for next generation 2.5D fan-out packaging
5.4.3.Industry players of organic RDL
5.4.4.Importance of low-loss RDL materials for different packaging technologies
5.4.5.Low-loss RDL materials for mmWave: TSMC's InFO AiP
5.4.6.Summary: Organic RDL technology development trend
5.4.7.For more information on materials for advanced semiconductor packaging
6.5G/6G COMMUNICATIONS
6.1.1.The Evolution of Mobile Communications
6.1.2.Spectrum Characteristics From 2G to 6G
6.1.3.Mobile Telecommunication Spectrum and Network Deployment Strategy
6.1.4.Evolving mobile communication focus
6.1.5.5G Rollout Continues at Pace
6.1.6.Lessons From 5G Rollout
6.1.7.What is 6G and why develop it?
6.1.8.IMT-2030 Enhanced Performance Requirements
6.1.9.6G spectrum - which bands are considered?
6.1.10.6G - Key Applications Overview
6.1.11.6G Rollout Timeline
6.1.12.6G Industry Update - Vendors
6.2.Technology
6.2.1.Antenna Size Shrinks With Increasing Frequency
6.2.2.The main technique innovations in 5G
6.2.3.5G base station types: Macro cells and small cells
6.2.4.Massive MIMO (mMIMO)
6.2.5.Structure of massive MIMO (mMIMO) system
6.2.6.Evolution of MIMO in Wireless Communications
6.2.7.Why Cell-Free MIMO
6.2.8.Filter technologies compatible with mmWave 5G
6.2.9.Benchmark of selected filter technologies for mmWave 5G applications
6.2.10.Overview of transmission lines filters for 5G mmWave
6.2.11.Materials for transmission-line filters
6.2.12.Evolution of smartphone antennas from 2G to mmWave 5G
6.2.13.RIS - Overview
6.2.14.Operational Frequency for RIS
6.2.15.For more information on the 6G market
7.AUTOMOTIVE RADAR
7.1.1.Introduction to Automotive Radar
7.1.2.Autonomous Vehicles Will Drive Radar Growth
7.1.3.Radar is a Key Part of Modern ADAS Features
7.1.4.Packaging and Integration Trends
7.1.5.Which Way is Frequency Going?
7.1.6.Applications of Different Frequencies
7.1.7.Applications of Different Frequencies (2)
7.1.8.Automotive Radar Frequency Trends
7.1.9.Adoption Path of High Frequency Radars
7.1.10.Packaging Benefits
7.2.Components and Materials
7.2.1.Radar Anatomy
7.2.2.Primary Radar Components - The Antenna
7.2.3.Ideal Radome Properties
7.2.4.Preperm
7.2.5.Laird - Side Lobe Reduction Skirt Material
7.2.6.Other material considerations
7.2.7.Key trends in automotive radar
7.2.8.Key requirements for PCB materials for automotive radar
7.2.9.Low-loss material supplier landscape for automotive radar
7.2.10.Commercially available low-loss substrates for automotive radar substrates
7.2.11.For more information on the automotive radar market
8.HIGH SPEED DIGITAL
8.1.1.Applications of PCBs for high speed digital
8.1.2.Data centers are a key driver in demand for HSD materials
8.1.3.Data Center Equipment - Top Level Overview
8.1.4.Data Center Server Rack and Server Structure
8.1.5.Waveforms: HSD vs RF and material requirements
8.1.6.Roadmap for bandwidth and frequency requirements for data center and AI
8.1.7.Trends in Dk and Df requirements for HSD
8.1.8.AGC's low-loss materials for HSD substrates
8.1.9.Other commercially available low-loss substrates HSD substrates
8.1.10.Roadmap for high speed substrates (1/3)
8.1.11.Roadmap for high speed substrates (2/3)
8.1.12.Roadmap for high speed substrates (2/3)
9.FORECASTS
9.1.1.Forecasts: Low-loss materials area for 5G CPE, smartphones, infrastructure, and automotive radar
9.2.Low-loss material forecasts for 5G
9.2.1.Forecast methodology and scope: 5G
9.2.2.Low-loss materials area for 5G: By market segments
9.2.3.Low-loss materials for 5G: By material type and frequency
9.3.Low-loss material forecasts for 5G infrastructure
9.3.1.Low-loss materials for 5G base stations segmented by frequency
9.3.2.Low-loss materials for 5G base stations segmented by material type
9.3.3.Low-loss materials for 5G base stations segmented by component types
9.4.Low-loss material forecasts for 5G smartphones
9.4.1.Low-loss materials for 5G smartphones by frequency
9.4.2.Low-loss materials for 5G smartphones by material type
9.5.Low-loss material forecasts for 5G customer premises equipment (CPEs)
9.5.1.Low-loss materials for 5G CPEs by frequency
9.5.2.Low-loss materials for 5G CPEs by material type
9.6.Low-loss material forecasts for automotive radar
9.6.1.Forecast methodology and scope: Automotive radar
9.6.2.Low-loss materials for automotive radar by component
9.6.3.Low-Loss Material Market Forecast for Automotive Radar: By material type
9.6.4.Comparison with previous forecast: 2024 version vs 2026 version for 5G
10.COMPANY PROFILES
10.1.Access to company profiles through the IDTechEx portal
 

About IDTechEx reports

What are the qualifications of the people conducting IDTechEx research?

Content produced by IDTechEx is researched and written by our technical analysts, each with a PhD or master's degree in their specialist field, and all of whom are employees. All our analysts are well-connected in their fields, intensively covering their sectors, revealing hard-to-find information you can trust.

How does IDTechEx gather data for its reports?

By directly interviewing and profiling companies across the supply chain. IDTechEx analysts interview companies by engaging directly with senior management and technology development executives across the supply chain, leading to revealing insights that may otherwise be inaccessible.
 
Further, as a global team, we travel extensively to industry events and companies to conduct in-depth, face-to-face interviews. We also engage with industry associations and follow public company filings as secondary sources. We conduct patent analysis and track regulatory changes and incentives. We consistently build on our decades-long research of emerging technologies.
 
We assess emerging technologies against existing solutions, evaluate market demand and provide data-driven forecasts based on our models. This provides a clear, unbiased outlook on the future of each technology or industry that we cover.

What is your forecast methodology?

We take into account the following information and data points where relevant to create our forecasts:
  • Historic data, based on our own databases of products, companies' sales data, information from associations, company reports and validation of our prior market figures with companies in the industry.
  • Current and announced manufacturing capacities
  • Company production targets
  • Direct input from companies as we interview them as to their growth expectations, moderated by our analysts
  • Planned or active government incentives and regulations
  • Assessment of the capabilities and price of the technology based on our benchmarking over the forecast period, versus that of competitive solutions
  • Teardown data (e.g. to assess volume of materials used)
  • From a top-down view: the total addressable market
  • Forecasts can be based on an s-curve methodology where appropriate, taking into account the above factors
  • Key assumptions and discussion of what can impact the forecast are covered in the report.

How can I be confident about the quality of work in IDTechEx reports?

Based on our technical analysts and their research methodology, for over 25 years our work has regularly received superb feedback from our global clients. Our research business has grown year-on-year.
 
Recent customer feedback includes:
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What differentiates IDTechEx reports?

Our team of in-house technical analysts immerse themselves in industries over many years, building deep expertise and engaging directly with key industry players to uncover hard-to-find insights. We appraise technologies in the landscape of competitive solutions and then assess their market demand based on voice-of-the-customer feedback, all from an impartial point of view. This approach delivers exceptional value to our customers—providing high-quality independent content while saving customers time, resources, and money.

Why should we pick IDTechEx research over AI research?

A crucial value of IDTechEx research is that it provides information, assessments and forecasts based on interviews with key people in the industry, assessed by technical experts. AI is trained only on content publicly available on the web, which may not be reliable, in depth, nor contain the latest insights based on the experience of those actively involved in a technology or industry, despite the confident prose.

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Consider the cost of the IDTechEx report versus the time and resources required to gather the same quality of insights yourself. IDTechEx analysts have built up an extensive contact network over many years; we invest in attending key events and interviewing companies around the world; and our analysts are trained in appraising technologies and markets.
 
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A subscription from IDTechEx can include more reports, access to an online information platform with continuously updated information from our analysts, and access to analysts directly.

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About IDTechEx

Who are IDTechEx's customers?

IDTechEx has served over 35,000 customers globally. These range from large corporations to ambitious start-ups, and from Governments to research centers. Our customers use our work to make informed decisions and save time and resources.

Where is IDTechEx established?

IDTechEx was established in 1999, and is headquartered in Cambridge, UK. Since then, the company has significantly expanded and operates globally, having served customers in over 80 countries. Subsidiary companies are based in the USA, Germany and Japan.

Questions about purchasing a report

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In most locations reports can be purchased by credit card, or else by direct bank payment.

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When paying successfully by credit card, reports can be accessed immediately. For new customers, when paying by bank transfer, reports will usually be released when the payment is received. Report access will be notified by email.

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Materiales de bajas pérdidas 2026-2036: mercados, tendencias y previsiones

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La demanda de materiales de baja pérdida crecerá a una tasa compuesta anual del 21,3% para radares automotrices y 5G

Report Statistics

Slides 357
Forecasts to 2036
Published Nov 2025
 

Preview Content

pdf Document Sample pages
 

Customer Testimonial

quote graphic
"The resources produced by IDTechEx are a valuable tool... Their insights and analyses provide a strong foundation for making informed, evidence-based decisions. By using their expertise, we are better positioned to align our strategies with emerging opportunities."
Director of Market Strategy
Centre for Process Innovation (CPI)
 
 
 
ISBN: 9781835701577

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