Henkel
This event has been carefully organized providing opportunities for interactions between all levels of the business market.
English
10 - 11 May 2017 | Berlin, Germany
Connecting Emerging Technologies With Global Brands
The IDTechEx Show! features 9 conferences with 1 combined exhibition. Click on an event logo below to learn about that conference:
The IDTechEx Show! presents the latest emerging technologies at one event, with nine concurrent conference tracks and a single exhibition covering 3D Printing, Electric Vehicles, Energy Harvesting, Energy Storage, Graphene, Internet of Things, Printed Electronics, Sensors & Wearable Technology.
Due to the strong overlap across these topics, attendees and exhibitors are exposed to the full relevant supply chains and customer and supplier bases, saving you time and money from attending separate events. The IDTechEx Show! is devised by analysts covering these topics - bringing together the most significant developments in each of these areas.
Experience the event
1-to-1 Strategic Help
Arrange a 1-to-1 meeting with technical and business analysts in order to help you understand the topic and your opportunities.
Watch the event preview:
Highlights from exhibitors at the IDTechEx Show!
Testimonials
Cisco
I found it outstanding in terms of organization and quality of the topics.
DECATHLON
A great opportunity to network in the same day with a R&D, start-up, production and end-user company!
MACDERMID AUTOTYPE
The calibre of attendees was very high and we met a large number of decision makers from a spectrum of high tech industries.
About IDTechEx
The IDTechEx Show! is hosted by IDTechEx. Since 1999 IDTechEx has provided independent market research, business intelligence and events on emerging technology to clients in over 80 countries.
Our clients use our insights to help make strategic business decisions and grow their organizations. IDTechEx is headquartered in Cambridge, UK with additional offices in USA, Germany and Japan and associates in South Korea. Learn more here.
