Speakers from the world's largest organisations will share their needs & experiences with many world first announcements. Learn of the requirements and case studies from end users and hear all about the latest innovations from companies across the value chain. In total, hear insights from 250 speakers.
Alternative Assembly Technologies & Materials Evolution To Support Hybrid Electronics Packaging
Estrel Convention Center, Berlin, Germany
Exhibition Theatre Talks: Day 1
13:40 - 14:00
The electronics design, packaging and assembly industries are being challenged to adapt to the needs of the fast changing market segments such as wearables, IoT, Automotive and other markets resulting in an evolution of new materials and alternative assembly processes that will enable manufacturers to bring novel devices to the market.
Company Profile (Universal Instruments Corporation)
Universal's core products include a comprehensive surface mount platform portfolio; leading-edge advanced semiconductor packaging solutions for a fast-evolving technology landscape; a through-hole lineup that is the industry standard for productivity and reliability; flexible automation cells for odd-form or light mechanical and back-end assembly; line software to manage manufacturing activities; an advanced process lab and industry-leading consortium.