Dr Denis Cormier, Professor
Rochester Institute of Technology
Rochester Institute of Technology (Dr Denis Cormier) - Presentation*
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Hybrid processes that integrate electronics onto or within 3D printed (3DP) parts can present challenges when the materials involved have significantly different sintering or curing temperatures. This talk will first describe methods by which nanoink features have been deposited on polymer 3D printed parts using inkjet, Aerosol Jet, and microextrusion. Approaches for printing conformal electronics on non-planar surfaces will also be described. The suitability of using pulsed photonic curing (Novacentrix) to fuse the printed features will then be discussed. Properties such as adhesion, electrical conductivity, and cure depth have been studied as a function of photonic curing conditions as well as color of the underlying polymer 3DP material. Conclusions regarding the suitability of pulsed photonic curing for integration of electronics within 3D printed parts will be presented.
講演者の経歴 (Denis R. Cormier)
Denis Cormier is the Earl W. Brinkman Professor of Industrial and Systems Engineering at RIT. He has nearly 20 years of experience with metal, ceramic, and polymer based 3D printing processes. He is on the organizing committee for SME's RAPID conference, and he is a founding member of the ASTM F-42 committee that forms standards pertaining to 3D printing and additive manufacturing
会社紹介 (Rochester Institute of Technology)
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While additive manufacturing (AM) and 3D Printing (3DP) technologies have justifiably generated a great deal of excitement, they are only scratching the surface of what's possible. This is because AM and 3DP technologies have typically been used to fabricate purely mechanical parts. But what about parts that require electrical functionality? Or thermal, optical, magnetic, biological, or chemical functionality? RIT's Additive Manufacturing and Multifunctional Printing (AMPrint) Center is among the first research centers in the world to specifically focus on Multifunctional 3D Printing.