Emballage avancé pour semi-conducteurs 2025-2035 : prévisions, technologies, applications
IDTechEx's "Advanced Semiconductor Packaging 2025-2035" report delves into the evolving semiconductor packaging landscape, with a focus on 2.5D and 3D packaging technologies. It examines current technology trends, industry challenges, and the advancements of key players, while also forecasting future market trends. Utilizing IDTechEx's expertise in AI, data centers, autonomous vehicles, 5G, and consumer electronics, the report provides a thorough understanding of how advanced semiconductor packaging is influencing these sectors, offering valuable insights into the industry's future trajectory.
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