La demande mondiale d'emballages électroniques intelligents atteindra 2,6 milliards de dollars américains en 2033

Emballage intelligent 2023-2033

Emballage électronique, intelligent et intelligent pour le suivi des actifs, la surveillance de l'état, l'éclairage, l'engagement client, la conformité pharmaceutique, l'identification des matériaux.


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Smart packaging promises the integration of electronic functionality into everyday products, enabling condition monitoring, asset tracking, consumer engagement, and more. IDTechEx's report provides an in-depth technology and market evaluation of this emerging industry, drawing on over 20 interviews with industry players including fast-moving consumer goods (FMCG) players. Based on impartial analysis, IDTechEx concludes that the global demand for electronic smart packaging will reach a value of US$2.6 billion in 2033 based on the value of the electronics hardware in packaging - much more if the infrastructure, software, and services are also included.
 
The large addressable market ensures continued commercial interest in smart packaging, but aside from RFID tags and QR codes adoption at scale has thus far largely proved challenging. Utilizing multiple case studies, this report explores how needs of end users can be met and how adoption barriers can be overcome.
 
Drivers and applications
There are several prominent drivers for smart packaging. Continuous growth in e-commerce over the last two decades has raised packaging demand and changing design priorities, with a greater emphasis on sustainability and delivery optimization. With stores increasingly serving fulfilment centre functions, the need for streamlined inventory management is driving the adoption of item-level smart labelling. Additionally, using printed digital watermarks to facilitate packaging separation for recycling is being explored.
 
COVID-19 accelerated the adoption of wireless ID including the use of QR codes for track and trace schemes and NFC for wireless payment. Adoption of these technologies by consumers has triggered many brand-owners to investigate these technologies. The result has been a significant drive towards the connected experience, with brands interacting with consumers on landing sites accessed by QR codes or NFC.
 
Smart packaging can also play a significant role in the healthcare sector, where improving patient experience without increasing costs is vital in catering to the needs of an ageing population. In case studies discussed in the IDTechEx report, poor medicine compliance can be addressed by using smart blister packaging that wirelessly communicates when medicines are taken.
 
Technological development
Many current and emerging technologies are being developed for the smart packaging segment, often with very different purposes. These include:
  • RFID for wireless item identification (usually invisible to the consumer), as well as other identification technologies including QR codes and capacitive ink approaches
  • Electronic Articles Surveillance (EAS) for anti-theft (usually invisible to the consumer)
  • QR codes for identification
  • Data loggers for temperature, shock, vibration, and time/location monitoring
  • Interactive smart packaging with functionalities including illumination and use-monitoring (e.g. smart blister packs)
  • Chemical indicators, including temperature, frozen chemical visual indicators, and active packaging for produce and pharmaceutical monitoring
 
Electronic smart packaging employs a range of technologies to take packaging beyond its basic functions.
 
Questions answered in the report
  • What are the growth drivers for smart packaging, and the associated challenges?
  • What are the needs of brand-owners and fast-moving consumer goods companies that smart packaging can solve?
  • How does smart packaging add value across many applications?
  • What are the novel technologies being used in smart packaging, and what are their pros and cons?
  • Who are the players involved in smart packaging and how are they delivering unique value?
  • How can smart packaging be used sustainably, or to contribute towards sustainability?
 
Global assessment of smart packaging market and technologies
This IDTechEx report covers the underling technologies, opportunities and challenges associated with smart and intelligent packaging. Drawing on 24 company profiles, including interviews with FMCG players, it provides technology insights and independent analysis of relevant players. Applications and business models that enable smart packaging to capture value are evaluated using 15 case studies within the report, with the opportunities quantified via 7 forecasts segmented by smart packaging technology.
This report provides critical market intelligence about the smart packaging industry. This includes:
 
A review of the drivers, challenges, and analysis of opportunity in smart packaging:
  • A definition of smart packaging and its value proposition
  • End-user needs and feedback
  • Opportunity quantification in a 10-year forecast of the smart packaging industry
 
Technologies for smart packaging:
  • Review of the technologies used in smart packaging including RFID, light-up displays, printed and flexible electronics, and active and chemical sensors
  • Discussion of key players and their technology development progress
 
Deep dive into applications and instructive case studies of smart packaging 2023:
  • Applications for RFID smart packaging
  • Case studies for electronic smart packaging including electronic smart blister packaging
  • Smart packaging in sustainability
Report MetricsDetails
CAGRGlobal market for electronic smart packaging will reach a value of US$2.6 billion in 2033, this represents a CAGR of 15.4% from 2023.
Forecast Period2023 - 2033
Forecast UnitsRevenue (US$ millions)
Regions CoveredWorldwide
Segments CoveredRAIN (UHF RFID) smart packaging, NFC (HF RFID) smart packaging, capacitive identification and QR codes smart packaging, illumination-based electronic smart packaging, electronic shelf labels, electronic smart blister packaging, chemical sensors smart packaging, printed and flexible batteries, printed and flexible sensors, electronic article surveillance.
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Table of Contents
1.EXECUTIVE SUMMARY AND CONCLUSIONS
1.1.What is Smart Packaging?
1.2.Why Smart Packaging - Logistical and Safety Reasons
1.3.Why Smart Packaging - Increasing Sales and Better Merchandising
1.4.Smart Packaging: Status
1.5.Global trends are creating more opportunities for smart packaging to add value
1.6.Smart packaging industry overview
1.7.QR Codes and the connected experience
1.8.Key points for chemical time temperature indicators
1.9.Chemical sensors total revenue forecast 2023-2033
1.10.Key points for smart packaging light-up labels
1.11.Illumination-Based Electronic Smart Packaging Total Revenue Forecast 2023-2033
1.12.Key points for Electronic Shelf Labels (ESLs)
1.13.Electronic Shelf Label Total Annual Revenue Forecast 2023-2033
1.14.Audio in smart packaging today competes with smartphones
1.15.Key points for smart blister packs
1.16.Electronic Smart Blister Pack Total Revenue Forecast 2023-2033
1.17.Using smart packaging to address sustainability challenges
1.18.Chipless RFID or Flexible/Printed IC Passive tags
1.19.Key points for unique identification technologies without silicon chips
1.20.RAIN (UHF RFID) Smart Packaging
1.21.RAIN (UHF RFID) tags in packaging volume forecast 2023-2033
1.22.NFC (HF RFID) Smart Packaging
1.23.NFC (HF RFID) tags in packaging volume forecast 2023-2033
1.24.Smart packaging total market revenue forecast 2023-2033 (US$ millions)
1.25.Smart Packaging total market volume forecast 2023-2033
1.26.Smart Packaging average selling prices forecast 2023-2033
1.27.Smart packaging total market revenue forecast 2023-2033 (US$ millions)
1.28.Challenges and Opportunities
1.29.Company profiles
2.SMART PACKAGING DRIVERS
2.1.The need for smart packaging
2.2.Global trends are creating more opportunities for smart packaging to add value
2.3.Effect of global rise in e-commerce on the smart packaging landscape
2.4.Problems in the retail industry
2.5.Problems in healthcare
2.6.Using more of the human senses and in a better way
3.END-USER FEEDBACK
3.1.End User Needs: Drivers for Smart Packaging
3.2.End User Feedback on Smart Packaging - Application Needs
3.3.End User Views on Smart Packaging - Technical Needs
4.RFID: NFC AND RAIN FOR SMART PACKAGING
4.1.RFID
4.2.RFID Technologies: The Big Picture
4.3.Passive RFID
4.4.Favourite RFID frequencies
4.5.Passive RFID Systems
4.6.Battery Assisted Passive /Semi Active tags
4.7.Examples of Battery Assisted Passive (BAP) RFID sensors
4.8.Active RFID
4.9.Real Time Locating Systems (RTLS)
4.10.Change in active RFID systems due to BLE and LPWAN
4.11.Chipless/printed RFID
4.12.Passive RFID: Technologies by Operating Frequency
4.13.Anatomy of passive HF and UHF tags
4.14.Challenges in contacting HF/NFC coils
4.15.Threats to passive RFID: machine vision?
4.16.Might Packaging Become Irrelevant with Online Retailing?
5.PRINTED, FLEXIBLE AND ORGANIC ELECTRONICS
5.1.Introduction
5.1.1.Description and analysis of the main technology components of printed, flexible and organic electronics
5.1.2.Go to Market Strategies: Pros and Cons
5.1.3.The value chain is unbalanced
5.1.4.But many have shifted to provide complete solutions
5.1.5.Many enabling printed electronic technologies are an enabler but not an obvious product
5.1.6.Creating successful new products is hard
5.1.7.Cost reduction has been more commercially successful...
5.1.8....but if it is the only differentiator suppliers can struggle
5.1.9.Competing on more than cost has been the most successful
5.1.10.Keep It Simple, Stupid
5.2.Hybrid electronics
5.2.1.Smart packaging needs flexible hybrid electronics
5.2.2.Hyprint: Hybrid electronics for smart packaging
6.DISPLAYS
6.1.Electrophoretic displays
6.1.1.Electronic paper
6.1.2.Electronic shelf displays
6.1.3.Electronic shelf labels drivers and trends
6.2.Electrochromic displays
6.2.1.Electrochromic displays
6.2.2.Ynvisible Electrochromic Displays
6.2.3.Electrochromic display in packaging
6.2.4.Ynvisible, Evonik and Epishine collaborated on smart packaging and shelf level marketing
6.3.AC Electroluminescent displays
6.3.1.AC Electroluminescent displays
6.3.2.Electroluminescent technology
6.3.3.AC electroluminescent displays
6.4.Thermochromic displays
6.4.1.Thermochromic Displays
7.PRINTED LIGHTING
7.1.Printed LED lighting
7.1.1.NthDegree: printed inorganic LEDs targeting smart packaging
7.1.2.Nth Degree - Printed LEDs
7.2.Printed OLED Lighting
7.2.1.OLED Mechanism
7.2.2.Printed OLED for smart packaging
7.2.3.Inuru
7.2.4.Smart packaging displays summary
8.PRINTED, FLEXIBLE BATTERIES
8.1.Introduction to batteries
8.2.Thin, flexible and printed batteries are describing different aspects of battery features
8.3.Energy harvesting from EM spectrum (Wiliot)
8.4.Comparison of Power Options
8.5.Applications
8.6.Applications of printed batteries
9.PRINTED/FLEXIBLE SENSORS
9.1.Types of sensors that can be printed
9.2.Sensors: Technology Readiness
9.3.Piezoresistive (pressure) sensors
9.4.Printed temperature sensors
9.5.Emerging gas sensor technologies
9.6.Electronic nose for gas sensing
9.7.Low-cost biodegradable gas sensors for food packaging (FedTech)
9.8.Capacitive pressure/force sensor
9.9.Fluid level sensor
9.10.Capacitive depth sensing
9.11.Tracking liquid depth and automatic reordering?
9.12.Readiness level assessment of printed sensors
10.LOGIC
10.1.Types of Flexible or Printed Transistor Circuits
10.2.Why print transistors
10.3.Semiconductor choices compared
10.4.Semiconductor choices
10.5.Chipless RFID or Flexible/Printed IC Passive tags
10.6.Fully printed ICs have struggled to compete with silicon
10.7.Current approaches to printed logic
10.8.Flexible metal oxide ICs
10.9.Benefits of flexible/printed logic
10.10.Save on IC attach cost?
10.11.PragmatIC: FlexICs and technology roadmap
10.12.PragmatIC: Towards ubiquitous flexible sensor electronics
10.13.Arm: Ubiquitous electronics via collaboration
10.14.Investment into metal oxide ICs continues
10.15.SWOT analysis: Evaporated metal oxide ICs on flexible substrates
10.16.Smart tags with a flexible silicon IC
10.17.Flexible or printed transistors for logic, creating smart systems
10.18.Mediocre TFTs can do many functions
10.19.Lessons from the Silicon Chip: need for modularity
10.20.Printed electronics components
10.21.PragmatIC's wine temperature sensing label
11.QR CODES
11.1.QR Codes, initial failure and pandemic-related rise
11.2.QR Codes: where next?
11.3.Will NFC or RAIN Impact QR Codes?
12.ELECTRONIC ARTICLE SURVEILLANCE
12.1.Overview of EAS technologies
12.2.Market Overview and Structure
12.3.EAS company positioning in a flooded market
12.4.EAS pricing and materials
12.5.Strengths and weaknesses of EAS technologies
12.6.Main fields of use by technology type
12.7.EAS technology developments
12.8.EAS Future
13.CAPACITIVE / INK STRIPE IDENTIFICATION
13.1.Capacitive/ink stripe identification versus QR codes and RFID
13.2.Ink stripe ID using touchscreens: Touchcode
13.3.Touchcode Progress
13.4.Prismade Labs
13.5.Lessons from technologies that failed to commercialize
14.RFID SENSORS
14.1.RFID Sensors: main choices
14.2.AMS
14.3.Avery Dennison
14.4.Axzon
14.5.Blulog
14.6.CAEN RFID
14.7.Convergence Systems Limited (CSL)
14.8.Emerson
14.9.Farsens
14.10.IDENTIV
14.11.Impinj
14.12.Infratab
14.13.NXP
14.14.Phase IV Engineering
14.15.Powercast
14.16.TAG Sensors
14.17.BioSensors on conventional RFID labels
14.18.Chemical powerless RFID sensor tag
14.19.Lessons from Failures
14.20.RFID ICs with Large Area Printed Sensors: Hybrid Electronics
15.CHEMICAL SMART PACKAGING TECHNOLOGIES
15.1.Food degradation
15.2.Four mechanisms of food deterioration
15.3.Determining Shelf Life
15.4.Food Degradation
15.5.Validating cool cargo in pharmaceuticals
15.6.Time Temperature Indicators (TTIs)
15.7.Chemical Time Temperature Indicators
15.8.Case Study: Monoprix France
15.9.Examples of Chemical Time Temperature Indicators (TTIs)
15.10.Freshness Indicators
15.11.Ripeness Indicators
15.12.Time Indicators
16.SMART PACKAGING APPLICATIONS - CONVENTIONAL RFID
16.1.Lessons from pallet/case tagging
16.2.Retail apparel, item level
16.3.Retail Apparel Payback
16.4.RFID for anti-counterfeiting - it's the law!
16.5.METI, Japan, target 100 billion tags/year by 2025
16.6.IDTechEx view on the METI announcement
16.7.EU's digital product passport
16.8.RFID provides more consumer engagement and use data
16.9.Coca-Cola Freestyle Machine
16.10.RFID provides more consumer engagement and use data
17.SMART BLISTER PACKS
17.1.The Problem: Medication Non-Compliance
17.2.The Problem: Medication Non-Compliance - Statistics
17.3.The Current Solution
17.4.The Printed Electronics / RFID Solutions
17.5.Smart Blister Packs
17.6.Smart Blister Packs - Not a Major Success
17.7.Smart Blister Pack Progress
17.8.NXP: IC for smart blister packs
17.9.Players in smart blister packs
17.10.Smart Blister Packs: Outlook
18.SUSTAINABLE SMART PACKAGING
18.1.Using smart packaging to solve sustainability challenges
18.2.Approaches to improve secondary mechanical recycling
18.3.Invisible barcodes to improve plastic recycling
18.4.HolyGrail 2.0: the EU's digital watermark for recycling initiative
18.5.NEXTLOOPP: recycled food-grade polypropylene
18.6.Magnomer: magnetized ink to improve recycling
18.7.Making electronic smart packaging more sustainable
18.8.Improving manufacturing sustainability for electronics
18.9.One third of emissions from the electronics industry are produced by integrated circuits
18.10.Paper-based substrates and alternative fuel cells
18.11.Other alternatives to electronics
19.SMART PACKAGING CASE STUDIES
19.1.Batteries with integral battery tester
19.2.Beer packaging
19.3.Light up Packaging: Bombay Sapphire, KENT Gold, Copoya Rum
19.4.Light up packaging: Coca-Cola
19.5.TempTime sensors used in COVID-19 vaccine logistics
19.6.Desert Farms uses time temperature indicators for freshness monitoring
19.7.DHL Case study
19.8.Theft detection - Swedish Postal Service and Deutsche Post
19.9.Indicators for unauthorized retail
19.10.NFC for product registration and authentication
19.11.SharpEnd using NFC for connected experiences
19.12.Adidas Infinite Play with atma.io by Avery Dennison
19.13.COVID-19 catalyzed QR code and NFC adoption
19.14.Touchcode partner with International Paper: OHMEGA
19.15.Audio in smart packaging uses QR codes
20.FORECASTS: ELECTRONIC SMART PACKAGING
20.1.RAIN (UHF RFID) Smart Packaging
20.2.The impact on UHF RFID market from Walmart's mandate
20.3.RAIN (UHF RFID) tags in packaging volume forecast 2023-2033
20.4.RAIN (UHF RFID) tags average sales price forecast 2023-2033 (US$ cents)
20.5.RAIN (UHF RFID) tags market value forecast 2023-2033 (US$ millions)
20.6.NFC (HF RFID) Smart Packaging
20.7.NFC (HF RFID) tags in packaging volume forecast 2023-2033
20.8.NFC (HF RFID) tags 2023-2033 average selling price forecast (US$ cents)
20.9.NFC (HF RFID) tags market value forecast 2023-2033 (US$ millions)
20.10.NFC (HF RFID) Smart Packaging Forecast Reasoning
20.11.Illumination-Based Electronic Smart Packaging
20.12.Illumination-Based Electronic Smart Packaging Total Revenue Forecast 2023-2033
20.13.Electronic Shelf Label Total Annual Revenue Forecast 2023-2033
20.14.Electronic Smart Blister Pack Total Revenue Forecast 2023-2033
20.15.Chemical sensors total revenue forecast 2023-2033
20.16.Smart packaging total market revenue forecast 2023-2033 (US$ millions)
20.17.Smart Packaging total market volume forecast 2023-2033
20.18.Smart Packaging average selling prices forecast 2023-2033
20.19.Smart packaging total market revenue forecast 2023-2033 (US$ millions)
20.20.Challenges and Opportunities
21.COMPANY PROFILES
21.1.Asahi Kasei
21.2.Avery Dennison
21.3.Avery Dennison (atma.io)
21.4.BeFC
21.5.C2Sense
21.6.CPI
21.7.CuePath Innovation
21.8.Digimarc
21.9.HyPrint
21.10.Information Mediary Corporation
21.11.International Paper
21.12.Inuru
21.13.NthDegree
21.14.PodGroup
21.15.PragmatIC
21.16.Pricer
21.17.Schreiner Medipharm
21.18.SES-imagotag
21.19.SharpEnd
21.20.Touchcode
21.21.Wiliot
21.22.Ynvisible
21.23.Ynvisible/Evonik/Epishine
21.24.Zebra
22.APPENDIX: GLOSSARY
 

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Report Statistics

Slides 287
Companies 24
Forecasts to 2033
ISBN 9781915514608
 

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