13 Apr 2022
The intelliFLEX Innovation Alliance Present CPES2022, May 17-18 2022
The intelliFLEX Innovation Alliance is proud to present CPES2022, May 17-18, 2022. The Canadian Printed and flexible Electronics Symposium will focus on the most relevant, state of the art technical topics, global networking and sustainability.
24 Mar 2021
intelliFLEX Innovation Alliance Virtual CPES2021 a Big Success
This 6th international Symposium of Canada's premier conference and trade show exhibition for flexible and hybrid electronics (FHE) took place virtually this week. More than 180 colleagues from over 80 organizations in 15 countries around the World connected, contributed and learned.
10 Mar 2021
intelliFLEX to present Virtual CPES2021, March 17-19, 2021
The intelliFLEX Innovation Alliance is proud to present the Virtual CPES2021, March 17-19, 2021. The Canadian Printed and flexible Electronics Symposium will focus on the most relevant, state of the art technical topics and global networking.
7 Feb 2019
Mark Majewski named new intelliFLEX CEO
The intelliFLEX Innovation Alliance announced that Mark Majewski, a 30-year veteran of the Canadian technology industry and former geographic director at a major semiconductor company, has succeeded Peter Kallai as CEO.
19 Jun 2018
Varitron joins intelliFLEX
The intelliFLEX Innovation Alliance announced that Varitron Technologies is joining its eco-system and making a substantial investment to develop its capabilities in flexible and hybrid electronics.
16 Oct 2017
Myant commits $100M to the Advanced Manufacturing Supercluster
Myant is a key partner in the advanced manufacturing supercluster in the Toronto-Waterloo Innovation Corridor, which includes companies, universities, health agencies, and not-for-profit organizations.
30 May 2017
Highlights from CPES 2017
On May 24-25th 2017, James Hayward from IDTechEx attended CPES 2017. The event brought together an excellent group of both Canadian and international speakers to discuss several key areas in the printed and flexible electronics space. This article will address each area in turn, including smart packaging, IoT, structural and 3D electronics and textile/wearable electronics.