Speakers from the world's largest organizations will share their needs and experiences with many world first announcements. Learn of the requirements and case studies from end users and hear all about the latest innovations from companies across the value chain. In total, hear insights from 250 speakers. Register now!
Smart Molded Structures--Technology, Applications, System Integration and Innovations
Santa Clara Convention Center, CA, USA
Grand Ballroom G
12:20 - 12:40
TactoTek Injection Molded Structural Electronics (IMSE™) integrate printed electronics (circuitry, sensors, and antennas) and discrete electronic components (LEDs, ICs, etc.) inside of 3D plastic structures. With TactoTek® IMSE™ technology brands deliver high value, differentiated user experiences with smart molded structures—form, styling, electronic functionality and total cost efficiency that drive customer value across markets.
In his talk, Dr. Antti Keränen explains IMSE technology and real-life applications. Special emphasis is given to opportunities and solutions for integrating intelligence within IMSE designs and connecting IMSE parts to digital communication buses.
Speaker Biography (Antti Keranen)
Dr. Antti Keränen is the technology mastermind behind TactoTek structural electronics. His main responsibilities are developing and maintaining the IP portfolio, directing R&D innovation activities, and communicating the company technology vision and practical applications to the community. Antti has been a major contributor to the technology of in-mold electronics since 2005, when he joined the VTT printed electronics team. He is an Adjunct Professor of theoretical physics at the University of Oulu where he earned his PhD in 2002.
Company Profile (TactoTek Corporation)
TactoTek Injection Molded Structural Electronics (IMSE™) is a revolutionary technology that changes the way electronic parts such as HMI surfaces are designed and built. It integrates printed electronics (circuitry, sensors, and antennas) and discrete electronic components (LEDs, ICs, etc.) inside of thin 3D plastic structures. Embedding functionality such as lighting, controls, gesture sensors and antennas within 3D-shaped surface structures significantly reduces the thickness and weight of parts, delivers excellent touch and antenna performance and brings unique design opportunities for the next generation of HMIs.