Speakers from the world's largest organizations will share their needs and experiences with many world first announcements. Learn of the requirements and case studies from end users and hear all about the latest innovations from companies across the value chain. In total, hear insights from 250 speakers. Register now!
Topics covered include:
5G & LPWAN
Smart Home/Smart Buildings
Industrial IoT / Predictive Maintanance / Digital Manufacturing
Supercooled Liquid Metal Particles separate the use of solder from the heat needed to melt it. The particles are micro-sized capsules comprised of liquid metal solder inside a thin flexible shell. These capsules allows the metal solder to stay liquid at room temperature and below, far cooler than the point where it normally should be solid. Unlike current industry manufacturing practices that require significant heat in order to use metal solder or cure adhesives, NO heat is needed. Breaking the capsule shell allows the liquid metal inside to flow out, which then solidifies in a few seconds to create a full metallic interconnect. Using significantly lower temperatures in electronics manufacturing greatly broadens the design and materials available to unlock the door to many new opportunities. The result: smaller and more innovative devices with next generation features for sectors such as defense, automotive, consumer, aerospace, and health.
Speaker Biography (Ian Tevis)
Dr. Ian Tevis is the CTO and Co-founder of SAFI-Tech. He is Materials Chemist with a PhD from Northwestern University. Ian became very familiar with the challenges heat can give in electronics processing during his PhD thesis work on self-assembling small molecule based solar cells. Before starting SAFI-Tech, Ian was a research scientist at NanoIntegris Technologies working on process and product development of carbon nanotube inks. Ian has been working on supercooled liquid metal particle technology for two and a half years, first as a postdoc at Iowa State University and now as the CTO at SAFI-Tech.
Company Profile (SAFI-Tech)
SAFI-Tech's supercooled metal inks enable flexible electronics manufacturers to form interconnects or conductive traces without thermal damage. The technology consists of water-balloon-like microparticles of liquid metal solders in a metastable supercooled state. These particles can be mechanically broken or chemically triggered to release the liquid metal, which then rapidly solidifies. SAFI-Tech's vision is to provide supercooled metal technology to electronics manufacturers to solve issues caused by high temperature processes . SAFI-Tech was award the Technical Development Materials Award at the 2016 IDTechEx Show.