Printed & Flexible Electronics Reports and Subscriptions

This report examines sustainable electronics innovations, throughout the PCB and semiconductor industries. It covers key manufacturing processes and materials, including granular market forecasts from 2025-2035 and featuring profiles of green electronics players, this report provides indispensable insight into innovations in the electronics industry. Energy and water usage in the semiconductor industry are set to grow at a CAGR of 12% and 8% respectively, with efficient management strategies critical.

This report covers the entire perovskite photovoltaics market, including detailed assessment of the major technology types, key and emerging market players and data driven benchmarking. There is coverage across the whole solar power market, outlining the main applications for perovskite PV technology. Historic market data from 2010-2023, alongside in-depth company interviews and cost analysis, helps to formulate granular ten year market forecasts for the perovskite PV market, detailing a significant market growth to almost US$12 billion by 2035.

In-Mold Electronics (IME) 2025-2035 assesses the technology and market opportunities associated with this emerging manufacturing methodology. Drawing on over 25 company profiles, this report evaluates the technical processes, material requirements, applications, and competing methodologies associated with IME such as functional film bonding. It includes 10-year market forecasts by application sector, expressed as both revenue and IME panel area. This IDTechEx report, the fourth edition in six years, is based on interviews with companies which are conducted by technical IDTechEx analysts. This gives real insight and clarity into what is actually happening in the sector.

This report characterizes the flexible batteries markets, technologies, and players. With coverage across 13 application markets and 6 core battery technologies, and market forecasts from 2025 to 2035, it is the most comprehensive study compiled for this product area. It reveals increasing development and opportunities, with the flexible battery market to grow to over US$500 million by 2035.

The report assesses the market for eight different conductive ink types across 15 applications. Based on primary research and interviews with over 30 companies, it outlines technical developments and benchmarks ink properties across flake-based silver, nanoparticle-based silver, copper, stretchable/thermoformable, particle-free conductive inks and more. Application opportunities are evaluated, and their associated conductive ink requirements, including photovoltaics, multiple types of printed sensors, hybrid and in-mold electronics, and RFID/smart packaging.

This IDTechEx report assesses the competing technologies that will enable PCBs to be replaced with integrated electronics. It covers technologies, materials and applications of electronics added to 3D surfaces (LDS, aerosol, valve jet/dispensing, LIFT and emerging techniques), in-mold electronics (IME), and fully printed 3D electronics. Also included are 29 market forecasts lines, over 40 company profiles, readiness level assessments, and identification of technological challenges/opportunities, thus providing a clear picture of the emerging 3D / additive electronics landscape.

This report characterizes the markets, technologies, and players in printed and flexible sensors. Exploring the latest technical innovations across eight printed sensor technology areas with numerous application case studies for each technology. Both established and emerging markets are evaluated, including ten-year printed sensor market forecasts from 2024 to 2034. It reveals significant opportunity, with the printed and flexible sensor market forecast to grow to over US$960M by 2034.

'Flexible Hybrid Electronics 2024-2034' evaluates the status and prospects of this emerging manufacturing methodology, which aims to combine the best aspects of printed and conventional electronics. Often described as 'print what you can, place what you can't', flexible hybrid electronics (FHE) brings the benefits of digital additive electronics manufacturing without compromising on the processing capabilities of integrated circuits. Drawing on years of following the printed electronics industry and 40 interviews, the report outlines trends and innovations in the materials, components, and manufacturing methods required to produce FHE circuits.

Smart packaging promises the integration of electronic functionality into everyday products, enabling condition monitoring, asset tracking, consumer engagement, and more. IDTechEx's report provides an in-depth technology and market evaluation of this emerging industry, drawing on over 20 interviews with industry players including fast-moving consumer goods (FMCG) players. Based on impartial analysis, IDTechEx concludes that the global demand for electronic smart packaging will reach a value of US$2.6 billion in 2033 based on the value of the electronics hardware in packaging - much more if the infrastructure, software, and services are also included.

Manufacturing Printed Electronics 2023-2033 explores the developments, transitions, and technological innovations within the printed electronics equipment market. Drawing on interviews and interactions with over 30 companies, we assess the attributes, readiness level, use cases and market demand for 20 analogue/digital printing and component attachment technologies applicable to printed electronics, ranging from conventional screen printing to laser induced forward transfer and photonic soldering.

This report characterizes the electronic skin patches markets, technologies, and players. Coverage across 13 electronic skin patch application areas, historic market data from 2010-2022 and market forecasts from 2023 to 2033, it is the most comprehensive study compiled for this product area. It reveals significant opportunity, with the electronic skin patch market forecast to grow to over $27bn by 2033.