Thermal Management Reports and Subscriptions

This report provides a comprehensive overview of thermal challenges in advanced semiconductor packaging (ASP), covering power delivery evaluation for 2.5D and 3D ICs, identification of key thermal bottlenecks, assessment of emerging thermal interface materials, and analysis of advanced cooling technologies for next-generation packaging technologies. Coverage across different emerging TIM1 and TIM1.5 for ASP, historic market size data from 2021 to 2025 and a market forecast for TIM1 and TIM1.5 from 2026 to 2036 are all included, along with the market forecast for liquid and microfluidic cooling.

This report characterizes the thermal protection system technology landscape for spacecraft. Past and future TPS materials and designs are assessed, and emerging opportunities in space logistics evaluated to present a market outlook up to 2035.

Despite a lower fire occurrence rate than combustion vehicles, fire safety is critical for electric vehicles and presents several material opportunities. This report considers the regulation and battery design trends and how this will impact fire protection materials such as ceramics, mica, aerogels, coatings, encapsulants, foams, compression pads, phase change materials, polymers, and more. Market forecasts are given in yearly mass demand and market value segmented by material and vehicle segment.

This report analyzes air cooling, single and two-phase cold plate/direct-to-chip cooling, immersion cooling, as well as the associated coolant distribution units (CDUs), coolants, thermal interface materials (TIMs), and pumps used in data centers. It evaluates the advantages and disadvantages of each cooling method, presents a roadmap illustrating the market adoption of these technologies by data center server rack capacity and applications, such as AI, based on insights from industry leaders. The report conducts a cost analysis on the supply chain and evaluates the potential supply chain consolidation opportunities, as well as outlines crucial factors that companies need to consider when supplying components to the data center cooling industry.

This report analyses thermal management approaches for electric vehicle batteries, motors, power electronics, and the vehicle as a whole. A deep dive is taken into OEM strategies, materials, fluids, and technologies. 10 year granular market forecasts are included, segmented by technology.

This report provides an in-depth technical analysis of thermal interface materials for EV batteries, power electronics, data centers, EMI shielding, 5G, ADAS, and consumer electronics. 10-year granular area (m2), mass (kg), revenue (US$), and TIM unit price (US$) forecasts are given by application. The report covers recent developments in TIM fillers, high-performance TIMs, successful commercial uses, and historic TIM player acquisitions and partnerships. The report also identifies future TIM trends.

The report delves into the thermal management strategies employed in electric vehicle (EV) power electronics. It encompasses various aspects such as the thermal architecture within EV power semiconductor packaging, the materials (e.g., solder, silver sinter, copper sinter, etc.) utilized for die and substrate attachment, thermal interface materials, as well as cooling methods involving air, water, and oil. A thorough technological examination of die attach, substrate attach, and thermal interface materials (TIMs) utilized in SiC MOSFETs, Si IGBTs, and GaN technologies. It also provides market forecasts for TIMs in the EV power industry categorized by technology (Si, SiC, GaN) and component (Inverter, Onboard Charger, and DC-DC Converter). A number of commercial use cases are included in the report. With historical market data spanning from 2021 to 2023 and future projections extending from 2024 to 2034, this study offers a comprehensive understanding of thermal management in the EV power electronics sector. It underscores significant growth prospects, with the total market value of TIMs anticipated to surpass US$900 million by 2034.