量子技術向け材料 2026-2046年：市場、トレンド、有力企業、予測
量子コンピューティング、量子センシング、量子通信における材料の機会の20年間予測。量子用途を対象とする超伝導体、フォトニクス、フォトニック集積回路（PIC）、ナノマテリアル、ダイヤモンドの技術、有力企業、サプライチェーンダイナミクス。
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本調査レポートでは、量子技術市場における材料の機会を分析し、超伝導体、フォトニクス（PICを含む）、ナノマテリアル、ダイヤモンドについて、量子コンピューティング、量子センシング、量子通信・ネットワークへの応用の可能性を調査しています。また、2026年から2046年までを対象とする7項目にわたる新たな詳細予測も掲載し、本レポートで取り上げている材料の量子市場は2046年までに市場全体で189億ドル規模に成長（年平均成長率は23.1%）する見通しです。本調査結果は、業界の主要企業30社以上の企業プロファイルを含む市場調査に基づいて作成されています。
「量子技術向け材料 2026-2046年」が対象とする主なコンテンツ
（詳細は目次のページでご確認ください）
■ 全体概要
■ 量子技術市場
- 市場概要：量子コンピューティング、量子センシング、量子通信
- 材料：量子コンピューティング向け、量子センシング向け、量子通信向け
「量子技術向け材料 2026-2046年」は以下の情報を提供します
量子技術の材料要件の分析：
- 量子技術の種類別材料要件の批評
- 材料イノベーションが量子技術の性能向上、ノイズ低減、大衆市場への拡大をどのように実現するかを解説
量子技術向け先進材料のトレンド：
- SQUID、SNSPD、超伝導量子ビット方式の量子コンピューティング向け超伝導量子チップの製造、パッケージング、テストの動向
- 量子用途向けフォトニクスの徹底解説（窒化ケイ素やTFLNなどのフォトニック集積回路（PIC）の基盤となる先進材料技術など）
- 量子技術での先進ナノマテリアルや先端炭素材料（グラフェン、CNT、ダイヤモンド）の機会
- 企業概要（業界の有力企業30社以上）の一次情報を基に市場調査結果を分析
20年間の市場規模予測：
- 量子技術市場での3つの主要材料基盤（超伝導チップ、PIC、ダイヤモンド）の獲得可能市場全体の規模の定量的推移
- 7項目の新たな予測（導き出した結論と詳細な予測手法も紹介）
- 量子技術業界に関するIDTechExの広範な市場調査レポートに基づく今後20年間の予測
Quantum technology is currently one of the fastest growing deep-tech markets, but their performance and scalability are often held back by challenges in materials, components, and manufacturing processes. This report analyzes the opportunities and emerging solutions in materials for quantum computing, quantum sensing, and quantum communications, with the total market opportunity for superconducting chips, PICs, and diamond for quantum technologies anticipated to reach US$3.38 billion by 2036 and US$18.9 billion by 2046 with a total CAGR of 23.1% over the full forecast period.
The quantum technology industry is diverse, with a vast range of products, business models, and a global distribution of players ranging from university spinouts to governments and international corporations. However, what IDTechEx has found is that throughout the industry there are opportunities for key material platforms to enable the scalability, and ultimately the commercial viability, of quantum technology. These material platforms are the physical basis of the quantum systems leveraged to unlock 'quantum advantage' in products: whether that is enabling the computation of classically intractable problems in quantum computing, unlocking magnitudes higher sensitivity for quantum sensors, or creating fundamentally secure cryptographic solutions in quantum communications.
Source: IDTechEx Research.
Three Quantum Markets, Three Key Material Platforms
Quantum technology is usually categorized into three core product verticals: quantum computing, quantum sensing, and quantum communications. This subdivision is typically used by government and commercial quantum strategies, and IDTechEx has published individual market research reports containing in-depth analysis of each vertical.
However, from a materials point of view, it is instead more informative to categorize quantum technologies by the physical 'platform' or quantum system they are built on. This approach highlights the intersections between different products, not by their applications, but by the materials and components common between them.
The three most important materials platforms for quantum technologies can be grouped as follows:
- Superconducting chips: Microfabricated electrical circuits of superconducting metals or compounds deposited on semiconductor wafers which exhibit quantum properties. Examples of products include SQUIDs, SNSPDs, and superconducting qubit computers.
- Photonic systems: Optics and photonic integrated circuits (PICs) are used either for the manipulation of single photons as carriers of quantum information, or to address atomic and defect-spin systems. Photonics are central to quantum networking and photonic qubit quantum computing but are also gaining traction for trapped ion and neutral atom qubits as well as various types of quantum sensors.
- Nanomaterials and diamond: Point defects in artificial diamond have been used to develop commercial quantum sensors and computers, while a range of opportunities for nanomaterials such as CNTs, quantum dots, and 2D/2.5D materials are emerging from research.
In each case, these material platforms stretch across the 3 quantum technology market verticals (computing, sensing, and communications), such that technologies and products between different areas of quantum technology can often benefit from the same material innovations, components, or foundry capabilities. This groundbreaking report assesses the material opportunities from both dimensions for a deeper analysis that highlights key intersections between the quantum and materials industries.
Source: IDTechEx Research.
Illuminating opportunities for photonics in quantum technologies
Photonics have already revolutionized classical information technology, with transceivers based on photonic integrated circuits (PICs) enabling high-speed communication within AI data centers at unprecedented scales. For quantum technologies, PICs have the potential to shrink optics that would have previously occupied an entire optical table in a lab-based setup down to the chip-scale, all while increasing manufacturing scalability and often improving performance by eliminating alignment errors.
However, the requirements of quantum PICs are very different to other applications. Due to the fragility of quantum systems, quantum PICs have a very low tolerance for losses, and to address systems such as atoms and point defects in diamond, they also need to operate at wavelengths unfamiliar to the traditional telecoms or datacoms industry.
To address these requirements, photonics innovators are exploring PIC material platforms beyond silicon, with silicon nitride (SiN), thin-film lithium niobate (TFLN), and barium titanate (BTO) as some examples of rising stars in the quantum photonics industry. Champions of these materials come from both within the quantum industry - such as PsiQuantum, QuiX Quantum, and Quantum Computing Inc (QCi) - and from external foundries and partners.
Equally exciting trends exist in the markets for superconductors, with content in this report covering the materials, fabrication processes, packaging trends, and testing of quantum chips, as well as emerging opportunities for artificial diamond and nanomaterials.
Key aspects of this report
This report aims to give a detailed examination of the material opportunities in the quantum technology industry, focusing on technical innovations, market forces, and supply chain dynamics across superconductors, photonics, and nanomaterials.
Key Aspects
This report encompasses all of the following topics:
Analysis of material requirements for quantum technologies
- Brief introduction to the quantum computing, quantum sensing, and quantum communications markets.
- Review of the material requirements for each type of quantum technology.
- Discussion of how material innovations can improve performance, reduce noise, and unlock mass-market scalability for quantum technologies.
Trends in emerging materials for quantum technologies
- Developments in the fabrication, packaging, and testing of superconducting quantum chips for SQUIDs, SNSPDs, and superconducting qubit quantum computing.
- Deep dive into photonics for quantum applications, including emerging material platforms for photonic integrated circuits (PICs) such as silicon nitride and TFLN.
- Opportunities for emerging nanomaterials and advanced carbons (graphene, CNTs, diamond) in quantum technologies.
- Analysis of market research findings supported by primary information from 35 company profiles of key players in the industry.
Granular 20-year market sizing forecasts
- Quantitative trajectories for the total size of the addressable market for three key material platforms: superconducting chips, PICs, and diamond, over the quantum technology market.
- 7 new forecast lines with conclusions drawn and detailed methodology.
- Projections for the next 2 decades are based on IDTechEx's wider portfolio of extensive market research on the quantum technology industry.
| Report Metrics | Details |
|---|---|
| Historic Data | 2024 - 2025 |
| CAGR | US$18.9 billion market opportunity for superconducting chips, PICs, and diamond for quantum technologies by 2046 with total CAGR 23.1% |
| Forecast Period | 2026 - 2046 |
| Forecast Units | Market Size (Annual Revenue in USD) |
| Regions Covered | Worldwide |
| Segments Covered | Superconducting Chips for Quantum Computing Superconducting Chips for Quantum Sensors PICs for Quantum Computing PICs for Quantum Communications PICs for Quantum Sensing Diamond for Quantum Computing Diamond for Quantum Sensing |
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詳細
この調査レポートに関してのご質問は、下記担当までご連絡ください。
アイディーテックエックス株式会社 (IDTechEx日本法人)
電話 03-3216-7209
担当: 村越美和子 m.murakoshi@idtechex.com
| 1. | EXECUTIVE SUMMARY |
| 1.1. | Analyst opinion - Materials for Quantum Technologies |
| 1.2. | Overview of the quantum technology market |
| 1.3. | Report motivation: Materials for quantum technologies |
| 1.4. | Report overview - quantum technology verticals and material platforms |
| 1.5. | Overview of the role of materials in quantum computing |
| 1.6. | Overview of materials opportunities in quantum computing |
| 1.7. | Overview of materials for quantum sensing |
| 1.8. | Roadmap for components in quantum sensing |
| 1.9. | Materials opportunities in quantum networking and communications |
| 1.10. | Superconductors in quantum technology |
| 1.11. | Critical temperature plays a key role in superconductor material choice for quantum technology |
| 1.12. | Summary of manufacturing processes for superconducting quantum chips |
| 1.13. | Fabricating superconducting chips: SQUIDs vs quantum computing chips |
| 1.14. | How have SNSPDs gained traction while KIDs and TESs remain in research? |
| 1.15. | Key takeaways for superconductors in quantum technology |
| 1.16. | Why are photonics so useful for quantum technologies? |
| 1.17. | Overview of photonics, silicon photonics and optics in quantum technology |
| 1.18. | The role of PICs in quantum technology |
| 1.19. | Surge in photonics company acquisitions by quantum technology developers |
| 1.20. | Opportunity for established silicon photonics platforms in quantum communications and networking |
| 1.21. | Trends in photonic packaging for quantum technologies - Alter Technology |
| 1.22. | Quantum PIC material platforms benchmarked |
| 1.23. | Conclusions for PICs for quantum applications |
| 1.24. | Early-stage use cases of nanomaterials and diamond for quantum applications |
| 1.25. | Overview of diamond in quantum technology |
| 1.26. | Forecast lines in this report & how they are organized |
| 1.27. | Overview of forecasting results |
| 1.28. | Market Size Forecast for Superconducting Chips for Quantum Technologies 2026-2046 |
| 1.29. | Market Size Forecast for PICs for Quantum Technologies 2026-2046 |
| 1.30. | Market Size Forecast for Diamond for Quantum Technologies 2026-2046 |
| 1.31. | Access more with an IDTechEx subscription |
| 2. | INTRODUCTION |
| 2.1. | Overview of the quantum technology market |
| 2.2. | Report motivation: Materials for quantum technologies |
| 2.3. | Material platforms for quantum technologies |
| 2.4. | Report overview - quantum technology verticals and material platforms |
| 2.5. | Report structure |
| 3. | QUANTUM TECHNOLOGY MARKETS |
| 3.1. | Quantum Computing: Market Overview |
| 3.1.1. | The quantum computing market 'at a glance' |
| 3.1.2. | Introduction to quantum computers |
| 3.1.3. | The quantum ecosystem is growing and covers a variety of approaches |
| 3.1.4. | Summarizing the promises and challenges of leading quantum hardware |
| 3.1.5. | Summarizing the promises and challenges of alternative quantum hardware |
| 3.1.6. | Quantum supremacy and qubit number |
| 3.1.7. | Comparing coherence times |
| 3.1.8. | Qubit fidelity and error rate |
| 3.1.9. | Noise effects on qubits |
| 3.1.10. | Additional Information Can Be Found in the IDTechEx Market Research Report "Quantum Computing Market 2026-2046: Technology, Trends, Players, Forecasts" |
| 3.2. | Materials for Quantum Computing |
| 3.2.1. | Overview of the role of materials in quantum computing |
| 3.2.2. | Hardware agnostic infrastructure platforms for quantum computing represent a new market for established technologies |
| 3.2.3. | Material imperfections are a leading source of noise |
| 3.2.4. | Overview of materials opportunities in quantum computing |
| 3.3. | Quantum Sensing: Market Overview |
| 3.3.1. | The quantum sensor market 'at a glance' |
| 3.3.2. | What are quantum sensors? |
| 3.3.3. | The value proposition of quantum sensors varies by hardware approach, application and competition |
| 3.3.4. | Quantum sensing technologies covered in IDTechEx market research |
| 3.3.5. | Key industries for quantum sensors |
| 3.3.6. | Key technology platforms for quantum sensing |
| 3.3.7. | Additional information can be found in the IDTechEx market research report "Quantum Sensors Market 2026-2046: Technology, Trends, Players, Forecasts" |
| 3.4. | Materials for Quantum Sensing |
| 3.4.1. | Overview of materials for quantum sensing |
| 3.4.2. | Specialized components for atomic and diamond-based quantum sensing |
| 3.4.3. | Key players in components for quantum sensing technologies |
| 3.4.4. | Roadmap for components in quantum sensing |
| 3.4.5. | Roadmap for quantum sensing components and their applications |
| 3.4.6. | Setting up "quantum foundries" is key to scaling up the manufacture of miniaturized components for chip-scale quantum sensors |
| 3.5. | Quantum Communications: Market Overview |
| 3.5.1. | The quantum communication market 'at a glance' |
| 3.5.2. | The quantum threat to data security |
| 3.5.3. | 'Hack Now Decrypt Later' (HNDL) and preparing for Q-Day/Y2Q |
| 3.5.4. | The quantum solution to data security |
| 3.5.5. | Principle of operation of optical QRNG technology |
| 3.5.6. | What is the main value proposition of QRNG compared to incumbents? |
| 3.5.7. | Key players developing QRNG products segmented by hardware approach |
| 3.5.8. | Applications of quantum random number generators (QRNG) |
| 3.5.9. | Why is QKD more secure than other key exchange mechanisms? |
| 3.5.10. | Overview of key players developing QKD technology (1) |
| 3.5.11. | Overview of key players developing QKD technology (2) |
| 3.5.12. | What is a quantum network? |
| 3.5.13. | Building quantum networks as a dual commercial strategy - Cisco |
| 3.5.14. | Additional information can be found in the IDTechEx market research report "Quantum Communication Market 2024-2034: Technology, Trends, Players, Forecasts" |
| 3.6. | Materials for Quantum Communications |
| 3.6.1. | What are the main form-factor approaches for QRNG devices? |
| 3.6.2. | The components of an optical QRNG device |
| 3.6.3. | The basic principle and components of a QKD system |
| 3.6.4. | The role of trusted nodes and trusted relays |
| 3.6.5. | Entanglement swapping and optical switches |
| 3.6.6. | Chip-Scale QKD efforts will benefit from the growth of the PIC industry |
| 3.6.7. | Materials opportunities in quantum networking and communications |
| 4. | SUPERCONDUCTORS |
| 4.1. | Superconducting Materials for Quantum Technology |
| 4.1.1. | Chapter overview: Superconductors in quantum technology |
| 4.1.2. | Applications of superconductors in quantum technology |
| 4.1.3. | Critical temperature plays a key role in superconductor material choice for quantum technology |
| 4.1.4. | Critical material supply chain considerations for superconducting materials |
| 4.1.5. | Overview of the superconductor value chain in quantum technology |
| 4.1.6. | Room temperature superconductors - and why they won't necessarily unlock the quantum technology market |
| 4.2. | Superconducting Quantum Circuits: Fabrication, Packaging, Testing |
| 4.2.1. | Introduction to superconducting qubits: Motivation and overview |
| 4.2.2. | Introduction to superconducting qubits: Anharmonic oscillators and the 'transmon' qubit |
| 4.2.3. | Transmon superconducting qubits: Structure, materials, and fabrication |
| 4.2.4. | Fabricating superconducting qubits using industrial processes |
| 4.2.5. | Defects and sources of noise for superconducting quantum circuits |
| 4.2.6. | Trade-off between quality & scalability in fabricating superconducting qubits |
| 4.2.7. | Longer coherence times of superconducting qubits are achieved by improving fabrication and packaging methods |
| 4.2.8. | Through silicon vias and flip-chip bonding for superconducting chips |
| 4.2.9. | Limitations to scalability from current circuit architecture and packaging |
| 4.2.10. | 3D packaging and chiplets to solve scalability limitations - QuantWare |
| 4.2.11. | A chiplet architecture for quantum computing - Rigetti |
| 4.2.12. | Superconducting caps for quantum circuits - Rigetti |
| 4.2.13. | Introduction to quantum chip testing |
| 4.2.14. | What needs to be tested in a quantum chip? |
| 4.2.15. | Automated quantum chip testing systems - Orange Quantum Systems |
| 4.2.16. | Summary of manufacturing processes for superconducting quantum chips |
| 4.3. | Superconducting Quantum Interference Devices (SQUIDs) |
| 4.3.1. | Operating principle of SQUIDs |
| 4.3.2. | SQUID fabrication services are offered by specialist foundries |
| 4.3.3. | Applications of SQUIDs |
| 4.3.4. | Commercial applications and market opportunities for SQUIDs |
| 4.3.5. | Fabricating superconducting chips: SQUIDs vs quantum computing chips |
| 4.3.6. | SWOT analysis: Superconducting quantum interference devices (SQUIDs) |
| 4.4. | Superconducting Nanowire Single Photon Detectors (SNSPDs) |
| 4.4.1. | Superconducting nanowire single photon detectors (SNSPDs) |
| 4.4.2. | SNSPDs as components in quantum computing and communications |
| 4.4.3. | Advancements in superconducting materials drives SNSPD development |
| 4.4.4. | SNSPDs in a photonic quantum computing chipset - PsiQuantum |
| 4.4.5. | Research in scaling SNSPD arrays beyond kilopixel - NIST |
| 4.4.6. | Fabrication of SNSPDs and SNSPD arrays |
| 4.4.7. | Comparison of commercial SNSPD players |
| 4.4.8. | SWOT analysis: Superconducting nanowire single photon detectors (SNSPDs) |
| 4.5. | Kinetic Inductance Detectors (KIDs) and Transition Edge Sensors (TESs) |
| 4.5.1. | Kinetic inductance detectors (KIDs) |
| 4.5.2. | Transition edge sensors (TES) |
| 4.5.3. | How have SNSPDs gained traction while KIDs and TESs remain in research? |
| 4.5.4. | Comparison of single photon detector technology |
| 4.6. | Chapter Summary: Superconductors in Quantum Technology |
| 4.6.1. | Uses of superconductors in quantum technology |
| 4.6.2. | Key takeaways for superconductors in quantum technology |
| 5. | PHOTONICS |
| 5.1. | Overview of photonics, silicon photonics and optics in quantum technology |
| 5.1.1. | Why are photonics so useful for quantum technologies? |
| 5.1.2. | Chapter overview: Photonics in quantum technologies |
| 5.2. | Introduction to Photonic Integrated Circuits (PICs) for Quantum Technology |
| 5.2.1. | What are photonic integrated circuits (PICs)? |
| 5.2.2. | General advantages and challenges of photonic integrated circuits |
| 5.2.3. | Integration schemes of PICs |
| 5.2.4. | The role of PICs in quantum technology |
| 5.2.5. | Photonic integrated circuits vs optical tables and fixed optics |
| 5.2.6. | Advantages of photonic integrated circuits for quantum technologies |
| 5.2.7. | Surge in photonics company acquisitions by quantum technology developers |
| 5.2.8. | Operational frequency windows of optical materials |
| 5.2.9. | Quantum PIC material platforms benchmarked |
| 5.2.10. | SiN, TFLN, and BTO foundries |
| 5.2.11. | Which material platform for quantum PICs? |
| 5.2.12. | Future PIC requirements of the quantum industry from SPIE Photonics West |
| 5.2.13. | Overview of photonic integrated circuits in quantum technologies |
| 5.3. | Photonic Integrated Circuits (PICs) for Photonic Quantum Computing |
| 5.3.1. | Overview of the photonic platform for quantum computing |
| 5.3.2. | Initialization, manipulation, and readout of photonic quantum computers |
| 5.3.3. | Commercializing SiN photonic quantum processors - QuiX Quantum |
| 5.3.4. | A photonic chipset for quantum computing - PsiQuantum |
| 5.3.5. | Single photon detectors, electro-optical materials, and alternatives to standard silicon required for photonic quantum computing - PsiQuantum |
| 5.3.6. | CEA Leti's goals for quantum PICs |
| 5.3.7. | Quantum photonic building blocks - imec |
| 5.3.8. | New TFLN foundries with potential interest for quantum PICs |
| 5.3.9. | SWOT Analysis: PICs for photonic quantum computing |
| 5.4. | Photonic Integrated Circuits (PICs) for Trapped Ion and Neutral Atom Quantum Computing |
| 5.4.1. | Introduction to trapped ion and neutral atom quantum computers |
| 5.4.2. | Initialization, manipulation, and readout for trapped ion quantum computers |
| 5.4.3. | Materials challenges for a fully integrated trapped-ion chip |
| 5.4.4. | PICs for trapped ion quantum computing |
| 5.4.5. | Trapped ion quantum computing leaders partner with Infineon |
| 5.4.6. | SiNQ: a silicon nitride PDK for 33 quantum-relevant wavelengths - Wave Photonics |
| 5.4.7. | Initialization, manipulation and readout for neutral-atom quantum computers |
| 5.4.8. | PICs for neutral atom quantum computers - Pasqal acquires AEPONYX |
| 5.4.9. | SiN waveguides with AlN piezoelectric actuators for high-speed quantum control of neutral atom qubits - QuEra |
| 5.4.10. | PICs at the center of commercializing atomic clocks, RF sensors, and quantum computers - Infleqtion (1/2) |
| 5.4.11. | Photonic materials for atomic sensing and computing - Infleqtion (2/2) |
| 5.4.12. | SWOT Analysis: PICs for trapped ion and neutral atom quantum computing |
| 5.5. | Photonics for Quantum Networks & Quantum Communications |
| 5.5.1. | Entanglement as a resource |
| 5.5.2. | Other components for quantum networks: Frequency conversion & switches |
| 5.5.3. | An opportunity for better optical fiber and quantum interconnects materials |
| 5.5.4. | Entangled photon sources for quantum networks - Lumino Technologies |
| 5.5.5. | Novel GaAs single photon sources for quantum communications - Photarix |
| 5.5.6. | Limitations in photonics for quantum communications and networking |
| 5.5.7. | Opportunity for established silicon photonics platforms in quantum communications and networking |
| 5.6. | Photonic Packaging Trends for Quantum Technologies |
| 5.6.1. | Trends in photonic packaging for quantum technologies - Alter Technology |
| 5.6.2. | Integrated photonic and semiconductor products for quantum are developing but not yet unlocking the mass market |
| 5.6.3. | Example applications of photonic packaging in quantum technologies |
| 5.6.4. | Specialized control electronics and optics packages needed to enable the high performance of quantum sensors |
| 5.6.5. | Hardware challenges for quantum to integrate into established photonics |
| 5.7. | VCSELs for Quantum Sensing |
| 5.7.1. | VCSELs: Background and context |
| 5.7.2. | VCSELs enable miniaturization of quantum sensors and components |
| 5.7.3. | Comparing key players in VCSELs for quantum sensing |
| 5.7.4. | SWOT analysis: VCSELs for quantum sensors |
| 5.8. | 5.8 Vapor Cells for Atomic Quantum Technologies |
| 5.8.1. | Vapor cells: Background and context |
| 5.8.2. | Innovation in commercial manufacture of vapor cells in quantum sensing |
| 5.8.3. | Alkali azides used to overcome high-vacuum fabrication requirements of vapor cells for quantum sensing |
| 5.8.4. | Comparing key players in chip-scale vapor cell development |
| 5.8.5. | SWOT analysis: Miniaturized vapor cells |
| 5.9. | Semiconductor Single Photon Detectors |
| 5.9.1. | Introduction to semiconductor photon detectors |
| 5.9.2. | Operating principles of SPADs: Avalanche photodiode (APD) basics |
| 5.9.3. | Operating principles of single-photon avalanche diodes (SPADs) |
| 5.9.4. | Arrays of SPADs in series can form silicon photomultipliers (SiPMs) as a solid-state alternative to traditional PMTs |
| 5.9.5. | Innovation in the next generation of SPADs |
| 5.9.6. | Key players and innovators in the next generation of SPADs |
| 5.9.7. | Applications of SPADs formed in a trade-off of resolution and performance |
| 5.9.8. | Development trends for groups of key SPAD players |
| 5.9.9. | Advanced semiconductor packaging techniques enabling higher pixel counts and timing functionality for SPAD arrays |
| 5.9.10. | Alternative semiconductor SPADs unlock infrared wavelengths beyond the range of silicon (1) |
| 5.9.11. | Alternative semiconductor SPADs unlock infrared wavelengths beyond the range of silicon (2) |
| 5.9.12. | Competition or cooperation for SPADs and SNSPDs in quantum communications and computing? |
| 5.9.13. | Emerging SPADs: SWOT analysis |
| 5.10. | Chapter Summary: Photonics for Quantum Technology |
| 5.10.1. | PIC materials used by quantum technology companies |
| 5.10.2. | Conclusions for PICs for quantum applications |
| 6. | NANOMATERIALS AND DIAMOND |
| 6.1. | Nanomaterials (CNTs, quantum dots, 2D/2.5D materials, MOFs) |
| 6.1.1. | Chapter Overview |
| 6.1.2. | Introduction to 2D Materials for Quantum Technology |
| 6.1.3. | Interest in TMD based quantum dots as single photon sources for quantum networking |
| 6.1.4. | Research interest in graphene membranes for RAM memory in quantum computers |
| 6.1.5. | 2.5D Materials pitches as solution to quantum information storage |
| 6.1.6. | Single Walled Carbon Nanotubes for Quantum Computers |
| 6.1.7. | Long term potential in the quantum materials market for Boron Nitride Nanotubes (BNNT) |
| 6.1.8. | Snapshot of market readiness levels of CNT applications - quantum only at PoC stage |
| 6.1.9. | Chromophore integrated MOFs can stabilize qubits at room temperature for quantum computing |
| 6.2. | Artificial Diamond |
| 6.2.1. | Overview of diamond in quantum technology |
| 6.2.2. | Material advantages and disadvantages of diamond for quantum applications |
| 6.2.3. | Element Six are leaders in scaling up manufacturing of diamond for quantum applications using chemical vapor deposition (CVD) |
| 6.2.4. | Supply chain and materials for diamond-based quantum computers |
| 6.2.5. | Overview of the synthetic diamond value chain in quantum technology |
| 6.2.6. | Quantum grade diamond benchmarked |
| 6.2.7. | IonQ, Element Six & AWS develop silicon-vacancy in diamond quantum memory |
| 7. | FORECASTS |
| 7.1. | Forecasting overview |
| 7.2. | Forecasting methodology |
| 7.3. | Forecast lines in this report & how they are organized |
| 7.4. | Overview of forecasting results |
| 7.5. | Superconducting chips vary in complexity and market direction |
| 7.6. | Market Size Forecast for Superconducting Chips for Quantum Technologies 2026-2046 |
| 7.7. | Market Size Forecast for PICs for Quantum Technologies 2026-2046 |
| 7.8. | Market Size Forecast for Diamond for Quantum Technologies 2026-2046 |
| 7.9. | Forecast Summary: Materials for Quantum Technologies 2026-2046 |
| 8. | COMPANY PROFILES |
| 8.1. | Alter Technology UK (quantum photonics) |
| 8.2. | Artilux Inc |
| 8.3. | Cisco Quantum Research |
| 8.4. | Covesion Ltd |
| 8.5. | CPI EDB (Quantum Sensing) |
| 8.6. | Diatope |
| 8.7. | Duality Quantum Photonics |
| 8.8. | Fraunhofer CAP |
| 8.9. | ID Quantique (Single Photon Detectors) |
| 8.10. | Infleqtion (Cold Quanta) |
| 8.11. | IonQ |
| 8.12. | IQM |
| 8.13. | Lumino Technologies |
| 8.14. | Microsoft Quantum |
| 8.15. | Neuranics |
| 8.16. | Orange Quantum Systems |
| 8.17. | ORCA Computing |
| 8.18. | Oxford Ionics |
| 8.19. | Pasqal |
| 8.20. | Photarix |
| 8.21. | Photon Force |
| 8.22. | PsiQuantum |
| 8.23. | Q-CTRL (quantum navigation) |
| 8.24. | Q.ANT (quantum sensing) |
| 8.25. | Qilimanjaro Quantum Tech |
| 8.26. | Quantinuum |
| 8.27. | Quantum Economic Development Consortium (QED-C) |
| 8.28. | QuantWare |
| 8.29. | QuiX Quantum |
| 8.30. | Rigetti |
| 8.31. | Rigetti (qubit fabrication and packaging) |
| 8.32. | SandboxAQ (Quantum Sensing) |
| 8.33. | Single Quantum |
| 8.34. | TE Connectivity: Connectors for Quantum Computing |
| 8.35. | Wave Photonics |
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量子技術向け材料の市場機会は2046年までに189億ドル規模になる見通し（年平均成長率は23.1%）
レポート概要
| スライド | 267 |
|---|---|
| 企業数 | 35 |
| フォーキャスト | 2046 |
| 発行日 | Dec 2025 |
コンテンツのプレビュー
 Sample pages
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