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2021
20 Oct 2021

PrintCB / Kundisch

Early-stage copper conductive ink company PrintCB has partnered with established HMI electronics manufacturer Kundisch. PrintCB's copper inks have recently been qualified by Kundisch, and are thus set for adoption in membrane switches for keyboards and other applications of hybrid electronics.
6 Oct 2021

Solder Alternatives for Flexible and Integrated Electronics

Attaching electronic components such as integrated circuits and LEDs to substrates is an essential aspect of electronics manufacturing. While conventional lead-free solder excels at the task for conventional rigid PCBs, it is not so well suited for emerging applications that require components to be attached to flexible substrates or conformal surfaces.
16 Aug 2021

Elephantech

Elephantech have developed an alternative method of manufacturing both rigid and flexible printed circuit boards (PCBs). This is termed 'print-then-plate', and involves printing a thin layer of conductive ink followed by electroless plating.
21 Jul 2021

Repurposing Fossil Fuel Assets: New Options

A more value-added approach to repurposing redundant fossil fuel assets such as coal mines and power stations is available.
5 Jul 2021

University of Coimbra (Stretchable Electronics)

Researchers at the University of Coimbra (Portugal) have developed a new stretchable conductive ink based on a liquid metal alloy gel. They are aiming to commercialize this technology for wearable/medical applications such as electronic skin patches.
14 Apr 2021

Flexible PCBs with Unprecedented Opportunities for the Lighting Market

Lumitronix is a specialist for LED systems with in-house development and production for LED modules and controllers in southern Germany. For more than 10 years, the high-quality lighting solutions have been implemented with rigid PCBs.
10 Mar 2021

Creative Materials Introduces Series of Electrically Conductive Films

Creative Materials introduces a series of isotropic and anisotropic B-stage electrically conductive adhesive films. The controlled reflow and high reliability of these adhesive films sets them apart from most other adhesive films.
2020
11 Dec 2020

Flexible Hybrid Electronics Requires New Component Attachment Material

Despite the promise of and the commercial interest in FHE, some technological challenges remain. One of the most important is developing the ability to robustly attach mounted components to flexible substrates, given the substantial difference in mechanical and thermal properties.
19 Nov 2020

Printed Electronic Materials Market Forecast to Reach $6.9Bn by 2031

In total, IDTechEx Research forecast that the market for specialized solution processable materials for printed/flexible electronics will reach $6.9Bn by 2031.
28 Aug 2020

Harting

Harting is a German company that manufactures a wide range of electrical, electronic and mechanical components, including connectors and 3D-MID devices. This profile focuses on their activities in 3D-MID, more specifically laser direct structuring (LDS).
18 Aug 2020

Nopion

Nopion are a Korean company that specializes in metallic nanoparticles. Along with applications such as EMI shielding, thesenanoparticles are employed in a self-assembling anisotropic conductive adhesives that enables component attachment at lower pressures than the incumbent technology.
12 Aug 2020

CondAlign

CondAlign has developed a technology for making anisotropic conductive films, in which electrically and/or thermally conductive particles are aligned by applying an electric field during film manufacture.
17 Jun 2020

Flexible Hybrid Electronics: Strategies to Enable Cheaper Substrates

Picture a flexible circuit board (FPCB) and you will almost inevitably visualise a sheet of orange/brown plastic, probably with a few copper traces and maybe some soldered components on it. This plastic is PI (polyimide/Kapton), and its ubiquity is primarily due to its temperature resistance and general durability.
6 May 2020

Flexible Hybrid Electronics: Future of Flexible Printed Circuit Boards

Flexible hybrid electronics (FHE) is a novel approach to electronic circuit manufacturing that aims to combine the best of printed and conventional electronics.
4 May 2020

Component Carrier Now Replacing Flexible PCBs

Flexible circuit boards offer numerous advantages. However, the mechanical fixation of these circuit boards is highly complex. HARTING has developed a new solution based on 3D-MID technology that is capable of replacing flexible circuit boards. Thanks to component carriers, cost savings of up to two-thirds can be achieved.
1 May 2020

Palomar Technologies

Palomar provides automated die attach, wire bonding and vacuum reflow equipment. With the advent of 5G, Palomar foresee a rise in the use of Ag sintering for RF GaN devices in 5G infrastructure.
13 Apr 2020

Routes to 3D Electronics: Assessment of Technologies and Applications

Metallization of 3D surfaces is a growing field with diverse applications. In this article, we briefly discuss some techniques and applications thereof. More specifically, we discuss and critically benchmark laser direct structuring, aerosol, 3D printed electronics, two-shot molding and In-Mold Electronics.
8 Apr 2020

Quantum Dots: Progress, Challenges And Future In LED Lighting

In this article, we discuss the challenges and prospects faced by QDs in the general lighting market. This article draws from the report "Quantum Dot Materials and Technologies 2020-2030: Trends, Markets, Players".
9 Mar 2020

ITN Energy Systems

ITN Energy Systems presented at Flex2020 a thin film battery that served as a substrate for power control circuits and sensors, all within a thin film format.
20 Feb 2020

Indium Corporation

Indium Corporation offers a range of electronic assembly materials, such as solder, thermal interface materials, In this profile we focus primarily on the aspects of their range relevant to printed electronics, particularly low temperature solder and ITO.