Materials and Processing for Advanced Semiconductor Packaging 2024-2034
This comprehensive report draws on IDTechEx's extensive knowledge and experience in the field, offering valuable insights into materials and processing techniques used in advanced semiconductor packaging. It covers crucial technology trends, including the 2.5D packaging process flow and the innovative Cu-Cu hybrid bonding technology for 3D packaging. Additionally, the report provides a 10-year market forecast for the Organic Dielectric Advanced Semiconductor Packaging Module, presenting projections for unit and area metrics.
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