Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications

IDTechEx's "Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications" report explores the dynamic semiconductor packaging landscape, emphasizing 2.5D and 3D packaging. It analyzes technology trends, industry barriers, and the progress of key players, forecasting market trends. Leveraging IDTechEx's expertise in AI, data centers, autonomous vehicles, 5G, and consumer electronics, the report offers a comprehensive understanding of how advanced semiconductor packaging shapes these sectors, providing valuable insights into the industry's future.

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Last update
Dec 2023