Thermal Management for EV Power Electronics 2024-2034: Forecasts, Technologies, Markets, and Trends

The report delves into the thermal management strategies employed in electric vehicle (EV) power electronics. It encompasses various aspects such as the thermal architecture within EV power semiconductor packaging, the materials (e.g., solder, silver sinter, copper sinter, etc.) utilized for die and substrate attachment, thermal interface materials, as well as cooling methods involving air, water, and oil. A thorough technological examination of die attach, substrate attach, and thermal interface materials (TIMs) utilized in SiC MOSFETs, Si IGBTs, and GaN technologies. It also provides market forecasts for TIMs in the EV power industry categorized by technology (Si, SiC, GaN) and component (Inverter, Onboard Charger, and DC-DC Converter). A number of commercial use cases are included in the report. With historical market data spanning from 2021 to 2023 and future projections extending from 2024 to 2034, this study offers a comprehensive understanding of thermal management in the EV power electronics sector. It underscores significant growth prospects, with the total market value of TIMs anticipated to surpass US$900 million by 2034.

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