3D Electronics/Additive Electronics 2024-2034: Technologies, Players, and Markets
This IDTechEx report assesses the competing technologies that will enable PCBs to be replaced with integrated electronics. It covers technologies, materials and applications of electronics added to 3D surfaces (LDS, aerosol, valve jet/dispensing, LIFT and emerging techniques), in-mold electronics (IME), and fully printed 3D electronics. Also included are 29 market forecasts lines, over 40 company profiles, readiness level assessments, and identification of technological challenges/opportunities, thus providing a clear picture of the emerging 3D / additive electronics landscape.
Login or Register You are not logged in. For existing users, please login to learn more about this premium content. For new users, please register with idtechex.com or use the links below for more details about premium content from IDTechEx.
Subscription Benefits
A subscription from IDTechEx allows you to access our full body of research content on emerging technologies, including market, technology and company data, alongside direct engagement with our expert analysts.
Subscription content includes:
Subscription content includes:
- Market research reports
- Forecasts
- Premium articles
- Company profiles
- Industry digests
- Webinars
- Innovation maps
- Event summaries and write-ups