Co-Packaged Optics (CPO) 2025-2035: Technologies, Market, and Forecasts
IDTechEx's "Co-Packaged Optics (CPO) 2025-2035" explores technical innovations and packaging trends, analyzing the value chain. It evaluates industry players and forecasts CPO's impact on data center architecture. Central to the report is the recognition of advanced semiconductor packaging (2.5D & 3D) as the cornerstone of co-packaged optics technology. IDTechEx places significant emphasis on understanding the potential roles that various semiconductor packaging technologies may play within the realm of CPO.
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