3D Electronics 2020-2030: Technologies, Forecasts, Players

This IDTechEx report on 3D electronics analyses and compares a suite of technologies that will enable separate PCBs to be replaced with integrated electronics, thus saving space and weight along with reducing manufacturing complexity. It includes in-mold electronics, film-insert molding, adding electronic functionality to 3D surfaces, and fully 3D printed electronics. It includes market forecasts, company profiles, case studies, identification of technological challenges and associated innovation opportunities. This comprehensive overview should enable readers to understand how they can take advantage of this exciting new approach that will ultimately replace PCBs in many applications.

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Slides
389
Forecasts to
2030