Materials, methods and applications for electromagnetic interference (EMI) shielding including package-level shielding, sputtering, printing, conductive inks, MXenes, nanocarbons, heterogeneous integration, system-in-package, compartmentalization.
TFT-LCD, OLED, microLED, Light field displays, CGH, dashboard displays, CID and heads-up displays. Display components overview, cover glass, display adhesives, display driver ICs. Technology landscapes, key market forecasts by technology and display type
Encompassing displays for XR headsets, including micro-LED, laser beam scanning, liquid-crystal on silicon displays, OLED, LCDs, holographic and light field displays, and more. Players, forecasts, and analysis in the VR, AR, and MR markets.
Covering applications such as wearable electronics, prototyping automotive electronics, and smart packaging, along with underlying technologies including conductive inks, flexible ICs, component attachment materials/methods and R2R manufacturing.
Assessment of flexible and printed electronics markets, covering smart packaging, printed/flexible sensors, e-textiles, conductive inks, wearable technology, flexible hybrid electronics, 3D electronics, in-mold electronics and more.
Electronic, smart and intelligent packaging for asset tracking, condition monitoring, illumination, customer engagement, pharmaceutical compliance, material identification.
The complete analysis of the global RFID industry
A comprehensive review of materials, processes, components, and companies of the global e-textiles market. Forecasts of e-textile product revenue and units sold 2023-2033.
In-mold structural electronics, functional film bonding, film insert molding, 3D electronics, structural electronics, capacitive touch sensors, stretchable conductive ink, additive electronics manufacturing, automotive interiors, human machine interfaces.
SWIR image sensors, hybrid sensors, hyperspectral imaging, event-based vision, wavefront imaging, hybrid sensors, CCD, thin film photodetectors, organic and perovskite photodetectors, InGaAs, quantum image sensors, and miniaturized spectrometers
Printed electronics equipment market covering roll-to-roll and sheet-to-sheet manufacturing, analogue and digital printing methods, vacuum processing, flexible hybrid electronics, mounting components.
6G, sub-THz, 6G technology benchmarking, Non-Terrestrial Networks (NTN), LEO, Reconfigurable Intelligent Surface (RIS), cell-free massive MIMO, THz components, low-loss materials, packaging, heterogeneous integration, player landscape
A technological and market evaluation of the sensors used in robots by sensor type and applications. Mobile robots, drones, industrial robotic arms, cobots, and service robots. Sensor types including force/torque, proximity, cameras, LiDAR, and more.
Flake-based, nanoparticle, particle-free, copper, stretchable, thermoformable nanowire inks for photovoltaics, EMI shielding, printed electronics, flexible hybrid electronics, wearable electronics, e-textiles, 3D electronics.
Data-centric approaches for design and discovery within materials science R&D. Notable advancements in data infrastructures and machine learning. Player profiles, technology progression, market outlook, business models, and case studies
Covering sustainable, green electronics, materials and manufacturing, integrated circuits, printed circuit boards, PCBs, printed, flexible, and hybrid electronics.
The most comprehensive assessment on the commercialization of flexible, wearable electronic skin patches spanning 13 applications including historic data, 10-year market forecast, interview-based player profiles, and technology analysis.
5G sub-6 GHz & mmWave, regional market forecast, 5G key technology benchmarking, supply chain, player assessment, Open RAN, vendor landscape, smart electromagnetic environment, power consumption, massive MIMO, 5G AiP (antenna-in-package), advanced 5G
Covering technologies such as motion sensors, optical sensors, chemical sensors, pressure sensors, strain sensors and electrodes for applications including continuous health monitoring, fitness tracking and augmented/virtual reality.
Covering emerging thin film photovoltaics, perovskites, organics, dye sensitized, cadmium telluride, copper indium gallium selenide, gallium arsenide, amorphous silicon, copper zinc tin sulfide, all-perovskite tandem, and perovskite on silicon tandem