Speakers from the world's largest organizations will share their needs and experiences with many world first announcements. Learn of the requirements and case studies from end users and hear all about the latest innovations from companies across the value chain.
How PARC's Innovation Services Group Rapidly Explores New Applications For Printed Electronics
Santa Clara Convention Center, CA, USA
Grand Ballroom G
10:00 - 10:20
PARC's Innovation Services Group has been working for several years to create a process for dynamically exploring the business impact and consumer experience of Al-augmented printed electronics on construction, agriculture, medicine, logistics and other industries. In this presentation we will review PARC's current approach and describe several explorations of printed sensors applied to smart packaging and logistics.
Mike Kuniavsky, Head of Design at PARC, a Xerox company, is a user experience designer, researcher, and author. A twenty-year veteran of digital product development, Mike designs products, business processes, and services at the leading edge of technological change. Prior to joining PARC, he co-founded several successful user experience centered companies. He specializes in multi-device interactions, cloud-based service design, and design of hardware products connected to cloud-based services. His background includes design for social analytics, consumer electronics, appliances, image retrieval, RGB LEDs, and financial services.
A global center for commercial innovation for 40 years, PARC, a Xerox Company, is a pioneer in the development and commercialization of thin film transistors, circuits, and sensors. With deep knowledge of printing technology applied in domains such as displays, image sensors, and medical sensors, PARC's technical expertise and facility support printed dielectrics, nanoparticle metals, organic, oxide, and silicon (amorphous, polycrystalline, printed nanowire) semiconductors. PARC's clients include display manufacturers, consumer electronics firms, IT companies, government agencies, and materials suppliers to the printed and flexible electronics markets.