Speakers from the world's largest organizations will share their needs and experiences with many world first announcements. Learn of the requirements and case studies from end users and hear all about the latest innovations from companies across the value chain.
Transparent Conductive Film With Embedded Metallic Structure For Flexible And Emerging Electronics
Santa Clara Convention Center, CA, USA
Conference Room H
08:40 - 09:00
Flectrode has developed a novel TCF technology towards to the commercial needs for flexible and emerging electronics. With the proprietary technology of fine-pattern formation and embedded metallic structure, Flectrode's TCF can achieve outstanding optical (transparency up to 90%) and electrical performances (sheet resistance down to 0.1 ohm/sq). More importantly, the proprietary of micro-anchoring design of metal network enhances the overall TCF reliability in terms of material compatibility, environmental durability and mechanical flexibility. The advancement of our unique technology makes Flectrode's TCF outperform most of the existing technologies on the commercial market and enables high performing TCFs applying on many emerging electronic fields, such as automotive head-up display (HUD), EMI shielding, 5G transparent antenna, flexible display and window heater applications.