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Transparent Conductive Film With Embedded Metallic Structure For Flexible And Emerging Electronics
Santa Clara Convention Center, CA, USA
Conference Room H
08:40 - 09:00
Flectrode has developed a novel TCF technology towards to the commercial needs for flexible and emerging electronics. With the proprietary technology of fine-pattern formation and embedded metallic structure, Flectrode's TCF can achieve outstanding optical (transparency up to 90%) and electrical performances (sheet resistance down to 0.1 ohm/sq). More importantly, the proprietary of micro-anchoring design of metal network enhances the overall TCF reliability in terms of material compatibility, environmental durability and mechanical flexibility. The advancement of our unique technology makes Flectrode's TCF outperform most of the existing technologies on the commercial market and enables high performing TCFs applying on many emerging electronic fields, such as automotive head-up display (HUD), EMI shielding, 5G transparent antenna, flexible display and window heater applications.
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This event is led by IDTechEx analysts who have studied the topic since 2002. We cover the most important topics and invite key companies to present to showcase end user needs, case studies and genuine technology breakthroughs.