This report relates the emerging market for 3D printed electronics to the existing markets for printed electronics and 3D printing that IDTechEx has been researching for years. We explain why some candidate applications will not succeed commercially and identify main applications that will create a total market worth over $2bn by 2029 thanks to core advantages over competing technologies and huge addressable markets. In addition we explore many potential applications for fully 3D printed electronics.
This report discusses all existing and emerging technologies that span 3D printed electronics, all major applications, all players bringing products to market in this space. Specifically, the inkjetting of conductive and insulating inks, extrusion of conductive pastes and insulators and the Aerosol Jet technology.
The following technologies are covered in detail including lists of all major vendors for each technology type and SWOT analyses quantifying characteristics such as equipment and material prices, conductivities and precision:
- Inkjetting conductive and insulating inks.
- Extrusion of conductive metals and insulating thermoplastics.
- Extrusion of conductive pastes and insulating thermoplastics.
- Aerosol Jet.
The following materials are covered:
- Conductive thermoplastics.
- Conductive inks.
- Conductive pastes.
- Conductive photopolymers.
Many potential commercial applications of 3D printed electronics are considered, most of which have already been demonstrated in the lab.
All major players are covered including SWOT analyses comparing their commercial products and technologies.
This report gives forecasts to 2029 broken down into the following market sectors:
3. Professional PCB prototyping.
4. Antenna manufacture
Restraints that are inhibiting the uptake of 3D printed electronics are covered as well as drivers.
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|1.1.||Drivers and restraints|
|1.2.||Total market forecast|
|2.2.||Printed Electronics: commercial failures|
|2.3.||Printed Electronics: commercial successes|
|2.5.||3D Printing: commercial applications|
|2.6.||3D Printing: hybrid machines|
|3.1.||Traditional PCBs: history|
|3.2.||Traditional PCBs: mounting components|
|3.3.||Traditional PCBs: layers|
|3.4.||Traditional PCBs: complexity|
|3.5.||Traditional PCBs: geography|
|3.6.||Traditional PCBs: prototyping|
|3.7.||Traditional PCBs: mechanics|
|3.8.||Traditional PCBs: heat|
|3.9.||Traditional PCB: SWOT analysis|
|4.3.||Conductive thermoplastic filaments|
|4.4.||Conductive plastics using graphene additives|
|4.5.||Conductive plastics using carbon nanotube additives|
|4.7.||Ink requirements for 3D printed electronics|
|5.4.||Low volume manufacturing|
|6.1.||Extrude molten solder|
|6.2.||Extrude molten solder: SWOT|
|6.3.||Extrude conductive filament|
|6.4.||Extrude conductive filament: SWOT|
|6.8.||Aerosol Jet: SWOT|
|7.1.||3D Printer and conductive ink/paste/glue|
|7.3.||Laser Direct Structuring (LDS)|
|7.4.||Benchmarking different processes (IME, MID, 3DP, aerosol)|
|8.6.||Nano Dimension: SWOT|
|8.14.||Neotech AMT: comparison|
|8.15.||Neotech AMT: SWOT|
|8.16.||Novacentrix and nScrypt|
|9.1.||University of Texas at El Paso (UTEP)|
|10.||MARKETS AND FORECASTS|
|10.3.||Technology strengths and weaknesses|
|10.6.||Education and research market|
|10.7.||Professional PCB prototyping market|
|10.9.||Total market forecast|
|10.10.||Limitations of the forecast|