Printed, Flexible and Organic Electronics Report

By 2027 flexible barrier manufacturing will be a market of more than $3.1 billion

Barrier Layers for Flexible Electronics 2017-2027: Technologies, Markets, Forecasts

Encapsulation films, in-line deposition, ALD and flexible glass


 
Table of Contents
1.INTRODUCTION
1.1.Introduction to flexible encapsulation & barrier layers
1.2.The need for flexible encapsulation & barrier layers
1.3.Comparison of performance metrics for different encapsulation solutions
1.4.Comparison of performance metrics for different encapsulation solutions
2.BARRIER TECHNOLOGY - COMMERCIALIZATION STATUS
2.1.Technology trends from major adopters - Samsung
2.2.Technology trends from major adopters - LG & others
2.3.Technology trends:TFE vs. barrier lamination
2.4.Technology trends: Single or multilayer - Substrate handling
2.5.Technology trends: The future of ALD in encapsulation
2.6.Technology trends: The future of ALD in encapsulation
2.7.Technology trends: plastics vs. flexible glass
2.8.Technology trends: plastics vs. flexible glass (2)
3.ENCAPSULATION- BASIC PRINCIPLES
3.1.Barrier technology principles
3.2.Barrier key requirements
3.3.Barrier key requirements
3.4.Encapsulation: Dyads
4.SURFACE SMOOTHNESS - DEFECTS
4.1.Surface smoothness considerations
4.2.Porosity pinholes and cracks
4.3.Barrier properties as a function of the thickness of the deposited film
4.4.Micro defects
4.5.Pinholes
4.6.Particles
4.7.Eliminating scratches and cracks
4.8.Resistance to scratching/cracking
4.9.Nano-defects
5.BARRIER TECHNOLOGIES - PAST DEVELOPMENTS
5.1.Vitex - The PML process
5.2.Vitex - Multilayers and dyads
5.3.The multilayer barrier and the Vitex flexible glass.
5.4.Vitex - Multilayers and dyads
5.5.Vitex - hybrid encapsulation and Samsung acquisition
5.6.GE - graded barrier
5.7.GE - graded barrier - Sabic acquisition
5.8.POLO - Fraunhofer
6.ADVANCES IN ENCAPSULATION MANUFACTURING PROCESSES
6.1.Advances in encapsulation manufacturing processes - ALD
6.2.R2R ALD
6.3.PECVD will compete head to head with ALD
7.BARRIER ADHESIVES
7.1.Barrier adhesives
7.2.Barrier adhesives: 3M
7.3.Barrier adhesives: DELO - Henkel
7.4.Barrier adhesives: tesa
8.ADDRESSABLE MARKET SEGMENTS FOR ENCAPSULATION TECHNOLOGIES
8.1.Addressable markets - Flexible OLED displays & lighting
8.2.Addressable markets - plastic rigid precede fully flexible OLED displays
8.3.Addressable markets: Quantum dot (QD) LCDs
8.4.Addressable markets: Integration approaches for QD LCDs
8.5.Addressable markets: quantum dot enhancement film
8.6.Addressable markets: OTFTs, LCDs and electrophoretic displays
8.7.Addressable markets: flexible photovoltaics
9.MARKET FORECASTS
9.1.The potential significance of organic and printed inorganic electronics: flexibility, robustness & lower cost
9.2.Challenges with non rigid substrates
9.3.Inkjet printing for organic material deposition
9.4.ALD entering maturity in encapsulation applications
9.5.Application driven choice between in-line TFE and barrier film: Flexible PV and Quantum Dots
9.6.Barrier material forecasts 2017-2027 (sq. m)
9.7.Barrier revenues forecasts 2017-2027 ($ million)
10.COMPANY PROFILES
10.1.1.Toppan Printing
10.1.2.Vitriflex
10.1.3.TNO Holst Centre
10.1.4.Mitsubishi
10.1.5.3M
10.1.6.Amcor
10.1.7.Tera-Barrier Films
10.1.8.Fujifilm
10.1.9.UDC
10.1.10.Konica Minolta
10.1.11.Samsung
10.1.12.LG Display
10.1.13.Applied Materials
10.1.14.Meyer Burger Group
10.2.Flexible glass
10.2.1.Schott AG
10.2.2.Corning
10.2.3.Asahi Glass Company (AGC)
10.2.4.Nippon Electric Glass (NEG)
10.3.ALD deposition for flexible barriers
10.3.1.ALD deposition for flexible barriers
10.3.2.Lotus
10.3.3.Beneq
10.3.4.Encapsulix
11.BARRIER MEASUREMENTS
11.1.The Calcium Test
11.2.MOCON
11.3.Vinci Technologies
11.4.SEMPA
11.5.VG Scienta
11.6.Fluorescent Tracers
11.7.Black Spot Analysis
11.8.Tritium Test
11.9.CEA
11.10.3M
11.11.IMRE
11.12.Mass Spectroscopy - gas permeation (WVTR & OTR potential applications)
11.13.Kisco Uniglobe

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