Off Grid Report

Electrically Conductive Adhesives 2016-2026

Conductive Epoxy: Technologies, Markets, Forecasts and Opportunities

Already a $1.2 billion market in 2015
 

Order now

Table of Contents
1.EXECUTIVE SUMMARY
1.1.Hierarchy
1.2.Comparison of solders to ECAs
1.3.Top three technical requirements
1.4.Forecasts
1.5.Conclusions
2.INTRODUCTION
2.1.The need to replace solder
2.2.Lead-free solders
2.3.Electronic Materials
2.4.Hierarchy
2.5.Conductive Adhesives vs Solders
2.6.Stability in Conductive Adhesive Market
3.ISOTROPIC VS ANISOTROPIC
3.1.Schematic of Interconnects
3.2.Factors which influence the choice of material
4.ISOTROPIC CONDUCTIVE PASTE (ICP)
4.1.Isotropic Conductive Paste
4.2.Composition
4.3.Resins
4.4.Key Parameters of Commercial ICP
4.5.Other Characteristics of Commercial ICP
4.6.Processing
4.7.Thermal Curing
4.8.ICP for printed electronics
4.9.Silver migration control
5.INNOVATIONS IN ICP
5.1.Conductive, structural adhesives
5.2.Reduced silver content
5.3.Nanotechnology
5.4.ICP for back-contact PV modules
6.ANISOTROPIC CONDUCTIVE ADHESIVES
6.1.Introduction
6.2.ACP vs ACF
7.ANISOTROPIC CONDUCTIVE PASTE
7.1.Anisotropic Conductive Pastes
7.2.Market Demands
7.3.Materials for ACPs
7.4.Properties of Commercial ACP
7.5.Nanotechnology in ACP
7.6.MesoGlue
8.FUNCTIONS OF ACPS
8.1.Display Interconnection
8.2.Chip-on-Glass
9.ANISOTROPIC CONDUCTIVE FILM
9.1.Anisotropic Conductive Film
9.2.ACF Introduction
9.3.ACF Bonding Process
9.4.Filler Particles
9.5.Filler Particle Examples
9.6.Thickness of commercially available products
9.7.Issues
9.8.Technical Developments
9.9.Key Application Opportunities
10.FUNCTIONS OF ACFS
10.1.Typical ACF Assemblies
10.2.Touch Panels
10.3.Sensors
11.INNOVATIONS IN ACF
11.1.Dexerials - Particle-Arrayed ACF
11.2.Hitachi Chemical
11.3.Nanotechnology in ACF
11.4.Transparent ACF
12.APPLICATIONS
12.1.Cameras
12.2.Displays
12.3.Photovoltaics
12.4.Interconnections for Photovoltaics
12.5.Advantages of using ECAs in PV applications
12.6.Market Share of ECAs in PV applications
12.7.LEDs and OLEDs
12.8.Optoelectronics
12.9.Smart Cards and RFID
13.EMERGING MARKETS
13.1.Automotive Electronics
13.2.Flexible Displays
13.3.Future of Flexible Displays in Portable Devices
13.4.Displays for automotive industry
13.5.In-mould electronics
13.6.OLED lighting
13.7.Thin Film Photovoltaics
13.8.Thin Film Photovoltaics
13.9.E-textiles
14.VALUE CHAIN
14.1.Value Chain
15.FINANCIALS
15.1.Isotropic Conductive Paste
15.2.ACF
15.3.ACF - Dexerials
16.FORECASTS
16.1.Forecast: ICP
16.2.Forecast: ACF by Function
16.3.Forecast: Revenue by Type
17.CONCLUSIONS
17.1.Conclusions
17.2.On-going research
18.MANUFACTURERS
18.1.IDTechEx Portal Profiles
19.COMPANIES PRODUCING ICP
19.1.Chemtronics
19.2.Daejoo
19.3.DELO
19.4.EMS
19.5.Epotek
19.6.Ferro
19.7.Heraeus
19.8.Nepes
20.COMPANIES PRODUCING ACP
20.1.DELO
20.2.Henkel
20.3.Panacol
20.4.Panacol Products
20.5.Sun Ray Scientific
20.6.Tatsuta
20.7.Three Bond
21.COMPANIES PRODUCING ACF
21.1.3M
21.2.Btech
21.3.Hitachi Chemical
21.4.Kyocera
21.5.Tatsuta
22.COMPANY PROFILES
22.1.Creative Materials Inc.
22.2.Daejoo Electronic Materials Co., Ltd
22.3.Dai Nippon Printing
22.4.Dexerials America Corporation
22.5.Fujikura Kasei Co Ltd
22.6.Henkel
22.7.Mosaic Solutions AS
22.8.Nagase America Corporation
22.9.Seashell Technology
22.10.Showa Denko
22.11.TactoTek