Automotive & Electric Vehicles Report

The market for thermal interface materials will reach $3.5bn by 2026

Thermal Interface Materials 2016-2026: Status, Opportunities, Market Forecasts

Technology benchmarking and market appraisal highlighting opportunities for polymeric and metallic thermal materials


 
Table of Contents
1.EXECUTIVE SUMMARY
1.1.Potential benefits of using TIMs
1.2.Drivers for the improvement of TIMs
1.3.Properties of Thermal Interface Materials
1.4.Research Aims
1.5.Uses for thermal interface materials
1.6.Key requirements by application
1.7.Materials by Application
1.8.Market Share by TIM type in 2016
1.9.Market Share by Application in 2016
1.10.Forecast by TIM type
1.11.Forecast by Application
1.12.Factors affecting adoption
1.13.Opportunities for developments
1.14.Growing Markets
2.INTRODUCTION
2.1.Schematics to show the role of Thermal Interface Materials
2.2.Comparison to Die Attach Technologies
3.DRIVERS
3.1.Causes of Electronic Failure
3.2.Temperature increase in Power Electronic Applications
3.3.Reducing temperature in Power Electronics Applications
3.4.Potential benefits of using TIMs
3.5.Drivers for the improvement of TIMs
3.6.Research Aims
3.7.Key Factors in System Level Performance
4.CHARACTERISING TIMS
4.1.TIM Designation
4.2.Thermal Conductivity vs Thermal Resistance
4.3.Thermal Testing of TIMs
4.4.Three Methods for Testing of TIMs
4.5.Laser Flash Diffusivity
4.6.Hot Disk
4.7.ASTM-D5470
4.8.Problems with ASTM D5470
4.9.Life-time Testing
4.10.Adhesion Testing
5.TYPES OF THERMAL INTERFACE MATERIAL
5.1.Ten Types of Thermal Interface Material
5.2.Definitions of Benchmarking Terms
5.3.Pressure-Sensitive Adhesive Tapes
5.4.Thermal Liquid Adhesives
5.5.Thermal Greases
5.6.Problems with thermal greases
5.7.Viscosity of Thermal Greases
5.8.Technical Data on Thermal Greases
5.9.The effect of filler, matrix and loading on thermal conductivity
5.10.Thermal Gels
5.11.Thermal Pastes
5.12.Technical Data on Gels and Pastes
5.13.Elastomeric pads
5.14.Advantages and Disadvantages of Elastomeric Pads
5.15.Phase Change Materials (PCMs)
5.16.Operating Temperature Range of Commercially Available Phase Change Materials
5.17.Graphite
5.18.Metal TIMs
5.19.Solders or Phase Change Metals
5.20.Which solder?
5.21.Soft Solder vs Hard Solder
5.22.Advantages and Disadvantages of Solders and Phase Change Metals
5.23.Properties of solders
5.24.Compressible Interface Materials
5.25.Liquid Metal
6.BENCHMARKING OF THERMAL INTERFACE MATERIALS
6.1.Factors which influence the choice of TIM
6.2.Operating Pressure
6.3.Voids
6.4.Properties of Thermal Interface Materials
6.5.Comparison of Thermal Interface Materials
6.6.Bounds on Thermal Conductivity of Commercially Available Thermal Interface Materials
6.7.Maximum Operating Temperature of Commercially Available Thermal Interface Materials
6.8.Efficiencies of fillers
7.RELATED TECHNOLOGIES
7.1.Heat Spreaders
7.2.Thermal Substrate Technologies
7.3.Immersion Cooling
7.4.Metallic foam heat exchangers - Versarien
8.EMERGING MATERIALS AND DISRUPTIVE TECHNOLOGIES
8.1.Pyrolytic Graphite Sheet (PGS)
8.2.Nanoparticle-Stabilized Solders - Kings College London
8.3.Nano-structured ceramics - Cambridge Nanotherm
8.4.New Conducting Particle Fillers for Thermal Greases
8.5.Carbon Nanotubes (CNT)
8.6.Carbon nanotubes - Stanford University
8.7.Graphene
8.8.Graphene - XG Science
8.9.Graphene - NanoXplore
8.10.Graphite Nanoplatelet - University of California Riverside
8.11.Nanodiamond filled polymers - Carbodeon
8.12.2D Boron Nitride
8.13.Metal nanoparticle fillers - Inkron
8.14.Nanostructured metal-polymer composites - Chalmers University of Technology
8.15.Silver flake-based conductive adhesives - Showa Denko
9.MARKETS
9.1.Uses for thermal interface materials
9.2.Key requirements by application
9.3.Materials by Application
9.4.LED Lighting
9.5.Advances in LED lighting
9.6.Effects of increasing the temperature of an LED
9.7.Photovoltaics
9.8.Effect of Temperature on Solar Cell Efficiency
9.9.Concentrated Photovoltaics
9.10.Lasers
9.11.Evolution of laser technology
9.12.Packaging of Laser Diodes to improve Thermal Management
9.13.Solder as the TIM in lasers
9.14.Semiconductor Thermal Packaging
9.15.Targeted applications within Semiconductor Thermal Packaging
9.16.Enterprise Computing
9.17.Personal Computing
9.18.Examples of TIMs in Personal Computing
9.19.Varieties of TIM in Personal Computing
9.20.Mobile Hand-held Devices
9.21.Examples of TIM in Consumer Electronics
9.22.Telecommunications Equipment
9.23.Increasing heat flux from telecommunication equipment
9.24.Defence and Aerospace
9.25.Automotive Electronics
9.26.Medical Electronics
10.EMERGING APPLICATIONS
10.1.Silicon Carbide Semiconductors
10.2.TIMs for Silicon Carbide Semiconductors
10.3.GaN Semiconductors
10.4.Wearable Electronics
10.5.IGBT
10.6.Thermoelectric Generators
11.PATENTS AND PUBLICATIONS
11.1.Google Trends
11.2.Worldwide Patent Publications
11.3.Scientific Journal Articles
11.4.Key Players
11.5.Thermal Interface Material Manufacturers
12.VALUE CHAINS
13.STATE OF THE MARKET IN 2016
13.1.Cost of TIM
13.2.Market Share by TIM type in 2016
13.3.Market Share by Application in 2016
13.4.Geographic Breakdown
14.FORECAST 2016-2026
14.1.Forecast by TIM type
14.2.Market Share by TIM type in 2026
14.3.Forecast by Application
14.4.Market Share by Application in 2026
14.5.Forecast Narrative
14.6.Forecast by TIM Type ($M)
14.7.Forecast by Application Type ($M)
14.8.Assumptions
15.LIMITATIONS, RESTRAINTS AND THREATS
15.1.Factors affecting adoption
15.2.Threats to the Industry
15.3.Global Opportunities
15.4.Opportunities for developments
16.THE WINNERS WILL ADDRESS...
16.1.Growing Markets
17.COMPANY PROFILES
17.1.3M Electronic Materials
17.2.AI Technology
17.3.AIM Specialty Materials
17.4.AOS Thermal
17.5.Denka
17.6.DK Thermal
17.7.Dow Corning
17.8.Dymax Corporation
17.9.Ellsworth Adhesives
17.10.Enerdyne
17.11.European Thermodynamics Ltd
17.12.Fujipoly
17.13.Fralock
17.14.GrafTech
17.15.Henkel
17.16.Honeywell
17.17.Indium Corporation
17.18.Inkron
17.19.Kitagawa Industries
17.20.Laird Tech
17.21.LORD
17.22.MA Electronics
17.23.MH&W International
17.24.Minteq
17.25.Momentive
17.26.Parker Chomerics
17.27.Resinlab
17.28.Schlegel Electronics Materials
17.29.ShinEtsu
17.30.Timtronics
17.31.Universal Science