Flipchip Joining To Printed Ink Circuitry On Flexible Substrates
Santa Clara Convention Center, CA, USA
Exhibition Theater Talks: Day 1
14:20 - 14:40
Being able to join bumped silicon die to printed ink circuitry on temperature sensitive flexible substrates is a key manufacturing enabler for the flexible hybrid electronics industry. Attachment of such devices using asymmetric heating applied with a die bonder was explored as a means to minimize the thermal load on temperature intolerant substrates. Chip joining using SnAgCu and BiSnAg solders as well as an isotropic conductive adhesive material were all demonstrated using top side asymmetric heating. Polyimide, PET, and TPU substrates were examined for physical or chemical alteration from the thermal load of such bonding. The microstructures of joints formed on printed copper ink were examined along with basic joint properties.
Company Profile (Universal Instruments Corporation)
Universal Instruments is a global leader in the design and manufacture of advanced automation assembly equipment. Our solutions are used to build some of today's high-tech gadgets, and to create the most advanced technologies in the fast-moving electronics industry. From cell phones and tablets to infrastructure, industrial, automotive, military and medical products, our innovative solutions play an integral role in driving the future of technology! Visit us at www.uic.com to learn more.
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