Semiconductors, Computing & AI Reports and Subscriptions

IDTechEx's Software-Defined Vehicle (SDV) Market Report 2026-2036 provides a detailed analysis of the transformation from legacy vehicle architectures to software-defined platforms. The report covers the rise of central compute and zonal architectures, SDV monetization models such as OTA updates and in-vehicle payments, and the integration of generative AI in next-gen vehicles. It also explores V2X technologies including C-V2X, DSRC, and 5G, with region-by-region regulatory insights and adoption forecasts. Forecasts span SDV hardware revenue, unit sales, and feature monetization through 2036. This report is essential for OEMs, Tier 1s, and mobility tech developers seeking to capitalize on the shift to connected, software-centric vehicle ecosystems.

This report provides a comprehensive overview of thermal challenges in advanced semiconductor packaging (ASP), covering power delivery evaluation for 2.5D and 3D ICs, identification of key thermal bottlenecks, assessment of emerging thermal interface materials, and analysis of advanced cooling technologies for next-generation packaging technologies. Coverage across different emerging TIM1 and TIM1.5 for ASP, historic market size data from 2021 to 2025 and a market forecast for TIM1 and TIM1.5 from 2026 to 2036 are all included, along with the market forecast for liquid and microfluidic cooling.

This report characterizes the emerging and next-generation microelectromechanical systems (MEMS) technologies that are set to disrupt the US$15 billion a year industry. Advanced MEMS gyroscopes for inertial sensing, chip-scale gravimeters, and MEMS speakers are all emerging technologies targeting different use-cases and markets. This report covers the enabling MEMS advancements underpinning these new technologies, assessing market readiness, and covering the key players. Granular market forecasts reveal significant growth opportunities in the MEMS market.

Materials Informatics leverages AI and data-driven approaches to accelerate material discovery and development. This report provides a comprehensive analysis of the market, including growth projections to 2035, key players, business models, and emerging technologies. With insights from over 30 company profiles, it examines industry trends, competitive strategies, and applications. Revealing an opportunity for external materials informatics services of US$725M by 2035, it forms a valuable resource for stakeholders seeking to understand the evolving landscape of AI-driven materials innovation.

This report characterizes the AI chips for data centers and cloud markets, technologies, and players. Coverage across current and emerging chip types, including GPUs, CPUs, custom AI ASICs, and other AI chips, from over 40 chip designers, historic market data from 2022-2024, and market forecasts from 2025 to 2035. The AI chip market continues to be a significant growth area, with a market forecast to grow to US$453 billion by 2030 at a CAGR of 14% from 2025.

This report characterizes the humanoid robotics markets, technologies, and players. Coverage across humanoids in automotive and logistics industries, technical analysis of critical humanoid robot components, historic market data from 2023-2024 and market forecasts from 2025 to 2035. It reveals significant opportunity, with the humanoid robotics market forecast to grow to around US$30bn by 2035.

This report provides a comprehensive analysis of the memory and storage markets, technologies, and key players. It examines three dominant technologies - HDDs, SSDs/NAND, and DRAM - across major application areas, including AI/HPC, datacenters/cloud, and edge computing. The analysis includes historical market data from 2018 to 2024 and market forecasts from 2025 to 2035. Additionally, the report explores emerging memory technologies, such as MRAM, ReRAM, FeRAM, and PCM, detailing their market potential and adoption trends. With the global memory and storage market projected to exceed US$300 billion by 2035, this report highlights key opportunities shaping the industry's future.

This report offers an in-depth analysis of the current technologies used for in-cabin sensors, including IR sensors, ToF sensors, radars, torque and capacitive steering sensors, and other emerging technologies, as well as the roadmap of technologies moving forward. It also provides an overview of regional regulations, along with their impacts on the adoption of technologies enabling driver monitoring and occupant monitoring. The report also covers emerging trends in automotive OEMs, such as integrating AI features and software-defined vehicle features (e.g., vital signal monitoring, smart interiors, infotainment, etc.), reducing the costs of hardware, and leverage the existing in-cabin sensors to achieve more functions and monetize them.

This report categorizes the photonic integrated circuit industry, including silicon photonics. It outlines key market players, emerging materials (such as TFLN, and BTO), and key applications such as AI, to forecast the growth of the Silicon Photonics and Photonic Integrated Circuit (PIC) market. IDTechEx also discusses emerging technologies, including Programmable Photonics, Photonic Quantum Computers, and Co-Packaged Optics. It unveils enormous opportunities, forecasting a US$50 bn+ market within a decade.

This report characterizes green data center technologies, players, and markets. With coverage across solutions for reducing scope 2 emissions (renewable power generation and energy efficiency) and scope 3 emissions (carbon credits, green concrete, and decarbonized IT manufacturing), spanning over 170 companies, and market forecasts until 2035, it is a comprehensive study compiled for this topic. It reveals promising data center decarbonization technologies, ongoing investments, projected cost savings by switching to carbon-free energy, and future CO2 emission trends.

This report examines sustainable electronics innovations, throughout the PCB and semiconductor industries. It covers key manufacturing processes and materials, including granular market forecasts from 2025-2035 and featuring profiles of green electronics players, this report provides indispensable insight into innovations in the electronics industry. Energy and water usage in the semiconductor industry are set to grow at a CAGR of 12% and 8% respectively, with efficient management strategies critical.

This report examines the high-performance computing (HPC) and AI hardware markets. Covering 7 key areas of componentry from AI chips to thermal management, including granular market forecasts from 2025-2035 and featuring over 50 profiles of HPC industry players, this report provides indispensable insight into this fast-growing industry. It reveals huge opportunity, with the HPC hardware market forecast to exceed US$580 billion by 2035, driven by growing AI deployment.

Quantum computing promises a revolution in computational capabilities. This accessible quantum computing market report evaluates key technologies, companies, drivers for growth and adoption barriers across this emerging industry. Multiple competing quantum computer technologies are assessed: superconducting, silicon-spin, photonic, trapped-ion, neutral-atom, topological, diamond-defect, and annealing. Detailed SWOT analysis, company roadmaps, and benchmarking are provided for each modality, along with twenty-year market forecasts outlining the prospects of each.

This comprehensive report draws on IDTechEx's extensive knowledge and experience in the field, offering valuable insights into materials and processing techniques used in advanced semiconductor packaging. It covers crucial technology trends, including the 2.5D packaging process flow and the innovative Cu-Cu hybrid bonding technology for 3D packaging. Additionally, the report provides a 10-year market forecast for the Organic Dielectric Advanced Semiconductor Packaging Module, presenting projections for unit and area metrics.

IDTechEx's "Advanced Semiconductor Packaging 2025-2035" report delves into the evolving semiconductor packaging landscape, with a focus on 2.5D and 3D packaging technologies. It examines current technology trends, industry challenges, and the advancements of key players, while also forecasting future market trends. Utilizing IDTechEx's expertise in AI, data centers, autonomous vehicles, 5G, and consumer electronics, the report provides a thorough understanding of how advanced semiconductor packaging is influencing these sectors, offering valuable insights into the industry's future trajectory.

This report explores the transformative impact of chiplet technology on semiconductor design, driven by the need for flexibility and cost-effectiveness as Moore's Law slows. It highlights advancements by relevant players in the supply chain, addressing challenges such as integration, interconnect & communication, and thermal management. The report provides a 10-year market forecast, projecting growth to US$411 billion by 2035, with applications in servers, telecommunications, PCs, mobile phones, and automotive industries. It offers insights into key technologies, market trends, and supply chain dynamics, making it an essential resource for understanding the evolving chiplet landscape.

This report analyzes air cooling, single and two-phase cold plate/direct-to-chip cooling, immersion cooling, as well as the associated coolant distribution units (CDUs), coolants, thermal interface materials (TIMs), and pumps used in data centers. It evaluates the advantages and disadvantages of each cooling method, presents a roadmap illustrating the market adoption of these technologies by data center server rack capacity and applications, such as AI, based on insights from industry leaders. The report conducts a cost analysis on the supply chain and evaluates the potential supply chain consolidation opportunities, as well as outlines crucial factors that companies need to consider when supplying components to the data center cooling industry.

IDTechEx's "Co-Packaged Optics (CPO) 2025-2035" explores technical innovations and packaging trends, analyzing the value chain. It evaluates industry players and forecasts CPO's impact on data center architecture. Central to the report is the recognition of advanced semiconductor packaging (2.5D & 3D) as the cornerstone of co-packaged optics technology. IDTechEx places significant emphasis on understanding the potential roles that various semiconductor packaging technologies may play within the realm of CPO.

This report characterizes the entire quantum technology market, identifies key trends, and provides an overview of the major players. Coverage across three key sectors including quantum computing, quantum sensing, and quantum communications is included, alongside market forecasts from 2024 to 2034 and over 50 company profiles. This comprehensive study provides clarity on the complexities of this rich and fast-moving industry, revealing significant opportunity, with the quantum technology market forecast to grow at a CAGR of 25% in the next ten years. IDTechEx has over 25 years of experience covering emerging technology markets, and is uniquely placed to analyze the interplay of related trends in the automotive, semiconductor, photonics, advanced materials, and sensor technology industries with the quantum technology market.

The report delves into the thermal management strategies employed in electric vehicle (EV) power electronics. It encompasses various aspects such as the thermal architecture within EV power semiconductor packaging, the materials (e.g., solder, silver sinter, copper sinter, etc.) utilized for die and substrate attachment, thermal interface materials, as well as cooling methods involving air, water, and oil. A thorough technological examination of die attach, substrate attach, and thermal interface materials (TIMs) utilized in SiC MOSFETs, Si IGBTs, and GaN technologies. It also provides market forecasts for TIMs in the EV power industry categorized by technology (Si, SiC, GaN) and component (Inverter, Onboard Charger, and DC-DC Converter). A number of commercial use cases are included in the report. With historical market data spanning from 2021 to 2023 and future projections extending from 2024 to 2034, this study offers a comprehensive understanding of thermal management in the EV power electronics sector. It underscores significant growth prospects, with the total market value of TIMs anticipated to surpass US$900 million by 2034.

IDTechEx's brand new report, "Antenna in Package (AiP) for 5G and 6G 2024-2034: Technologies, Trends, Markets," delves into AiP technologies for 5G mmWave and 6G, focusing on various substrate types and packaging methods. It also explores antenna integration for beyond 100 GHz applications, showcasing case studies and addressing challenges. Drawing on IDTechEx's expertise, the report offers valuable insights into the evolving landscape of antenna packaging for future generations of wireless technology.

This report provides critical market intelligence about quantum communication technology. This includes an overview of the emerging quantum computing to data security and solutions offered by quantum random number generators (QRNG) and quantum key distribution (QKD). There is global coverage of trends in the quantum communication market, including comparison with post-quantum cryptography (PQC). This comprehensive study includes over 25 company profiles, and market forecasts for 2024-2034. The quantum communications market is predicted to grow significantly, with a CAGR of 28%.

This report characterizes the edge AI chip markets, technologies, and players. Granular forecasts over a 10-year period (up to and including 2034) across 6 different areas (therein 3 primary regional geographies, consumer and enterprise use, 5 device architectures (GPUs, CPUs, ASICs, DSPs and FPGAs), 3 device packaging types, 3 application areas, and 7 industry verticals) - along with surveys of key edge applications for AI including smartphones, tablets, and automotive - make this the most comprehensive study compiled for AI processors and accelerators at the edge. This report reveals significant opportunity in various parts of the edge AI chip landscape, with the edge AI chip market forecast to grow to over US$22 billion by 2034.

'Flexible Hybrid Electronics 2024-2034' evaluates the status and prospects of this emerging manufacturing methodology, which aims to combine the best aspects of printed and conventional electronics. Often described as 'print what you can, place what you can't', flexible hybrid electronics (FHE) brings the benefits of digital additive electronics manufacturing without compromising on the processing capabilities of integrated circuits. Drawing on years of following the printed electronics industry and 40 interviews, the report outlines trends and innovations in the materials, components, and manufacturing methods required to produce FHE circuits.

This report provides holistic and deep coverage of semiconductor usage for a new era of vehicles. Understand the key trends within enabling technologies such as radar, LiDAR, cameras, inverters, battery management systems, MCUs and SOCs and how they impact future semiconductor demand. The report's granular 10-year forecasts include semiconductor wafer demand, semiconductor material demand including Si, SiC, GaN, InGaAs and more, as well as revenue through wafer production in US$.