1. | EXECUTIVE SUMMARY |
1.1. | Introduction to in-mold electronics (IME) |
1.2. | Commercial advantages and challenges of IME |
1.3. | The route to commercialisation |
1.4. | Overview of key players across the supply chain |
1.5. | IME market forecast - application |
1.6. | Benchmarking competitive processes to 3D electronics |
2. | MANUFACTURING IN-MOLD ELECTRONICS |
2.1. | What is in-mold electronics (IME)? |
2.2. | IME: 3D friendly process for circuit making |
2.3. | What is the in-mold electronic process? |
2.4. | InMold Electronics production: required equipment set |
2.5. | InMold Decoration production: required equipment set |
2.6. | Processing conditions: traditional electronics vs. IME |
2.7. | Comments on requirements |
3. | CONDUCTIVE INK REQUIREMENTS FOR IN-MOLD ELECTRONICS |
3.1. | IME: value transfer from PCB board to ink |
3.2. | New ink requirements: stretchability |
3.3. | Evolution and improvements in performance of stretchable conductive inks |
3.4. | Performance of stretchable conductive inks |
3.5. | Bridging the conductivity gap between printed electronics and IME inks |
3.6. | The role of particle size in stretchable inks |
3.7. | Elantas: selecting right fillers and binders to improve stretchability |
3.8. | E2IP Technologies/GGI Solutions: particle-free IME inks |
3.9. | The role of resin in stretchable inks |
3.10. | New ink requirements: portfolio approach |
3.11. | Diversity of material portfolio |
3.12. | All materials in the stack must be compatible: conductivity perspective |
3.13. | All materials in the stack must be compatible: forming perspective |
3.14. | New ink requirements: surviving heat stress |
3.15. | New ink requirements: stability |
3.16. | All materials in the stack must be reliable |
3.17. | Design: general observations |
3.18. | SMD assembly: before or after forming |
3.19. | The need for formable conductive adhesives |
3.20. | Using Cu foils similar to PCB industry |
3.21. | The need for formable conductive adhesives |
3.22. | Adhesive |
3.23. | Conductive adhesives: general requirements and challenges |
3.24. | Different types of conductive adhesives |
3.25. | Electrically Conductive Adhesives |
3.26. | Conductive adhesives: surviving the IME process |
3.27. | Attaching components to low temperature substrates |
3.28. | AlphaAssembly: Low temperature solder |
3.29. | Low temperature solder alloys |
3.30. | Low temperature soldering |
3.31. | Conductive paste bumping on flexible substrates |
3.32. | Ag pasted for die attachment. |
3.33. | Safi-Tech: Ambient soldering with core-shell nanoparticles |
3.34. | Photonic soldering: A step up from sintering |
3.35. | Photonic soldering: Prospects and challenges |
3.36. | Photonic soldering: Substrate dependence. |
3.37. | Electrically conductive adhesives: A simple low temperature option? |
3.38. | Cross-overs |
3.39. | Multilayer circuits: need for cross-overs in IME devices |
3.40. | Cross-over dielectric: requirements |
3.41. | Cross-over dielectric: flexibility tests |
4. | EXPANDING RANGE OF FUNCTIONAL MATERIALS |
4.1. | Stretchable carbon nanotube transparent conducting films |
4.2. | Prototype examples of carbon nanotube in-mold transparent conductive films |
4.3. | 3D touch using carbon nanobudes |
4.4. | Prototype examples of in-mold and stretchable PEDOT:PSS transparent conductive films |
4.5. | In-mold and stretchable metal mesh transparent conductive films |
4.6. | Other in-mold transparent conductive film technologies |
4.7. | Beyond IME conductive inks: adhesives |
4.8. | Heaters |
4.9. | Growing need for 3D shaped transparent heater in automotive |
4.10. | CNBs: Insert film molding for 3D-shaped sensor transparent heaters |
4.11. | Benchmarking CNT 3D-shaped molded transparent heaters |
4.12. | Ultra fine metal mesh as transparent heater |
4.13. | Feature control capability of ultra fine metal mesh as transparent heater |
4.14. | Technology roadmap of ultra fine metal mesh as transparent heater |
4.15. | Substrates |
4.16. | One-film vs Two-film approach |
4.17. | Different molding materials and conditions |
4.18. | Special PET as alternative to common PC? |
4.19. | Can TPU also be a substrate? |
4.20. | Other: IC package requirement, software |
4.21. | IC package requirements |
4.22. | Special design software |
5. | TOWARDS MORE COMPLEX DEVICES SUCH AS SENSORS, ACTUATORS AND DISPLAYS |
5.1. | Beyond conductive inks: thermoformed polymeric actuator? |
5.2. | Thermoformed 3D shaped reflective LCD display |
5.3. | Thermoformed 3D shaped RGD AMOLED with LTPS |
5.4. | Molding electronics in 3D shaped composites |
6. | OVERVIEW OF APPLICATIONS, COMMERCIALIZATION PROGRESS, AND PROTOTYPES |
6.1. | In-mold electronic application: automotive |
6.2. | HMI: trend towards 3D touch surfaces |
6.3. | Addressable market in vehicle interiors in 2020 and 2025 |
6.4. | Automotive: In-Mold Decoration product examples |
6.5. | White goods, medical and industrial control (HMI) |
6.6. | White goods: In-Mold Decoration product examples |
6.7. | Is IME commercial yet? |
6.8. | First (ALMOST) success story: overhead console in cars |
6.9. | Commercial products: wearable technology |
6.10. | Automotive: direct heating of headlamp plastic covers |
6.11. | System integrates electronics |
6.12. | Automotive: human machine interfaces |
6.13. | GEELY Seat Control |
6.14. | Faurecia concept: prototype to test functionality |
6.15. | Faurecia concept: traditional vs. IME design |
6.16. | Increasing number of research prototypes |
6.17. | Consumer electronics prototypes to products |
6.18. | White goods: human machine interfaces |
6.19. | Antennas |
6.20. | Consumer electronics and home automation |
6.21. | Home automation becomes commercial |
7. | FUNCTIONAL MATERIAL SUPPLIERS |
7.1. | In mold electronics: emerging value chain |
7.2. | Stretchable conductive ink suppliers multiply |
7.3. | IME conductive ink suppliers multiply |
8. | COMPETING TECHNOLOGIES |
9. | AEROSOL |
9.1. | Printing directly on a 3D surface? |
9.2. | Aerosol: how does it work? |
9.3. | Aerosol deposition can go 3D |
9.4. | Applications of aerosol |
9.5. | Optomec: update on market leader |
9.6. | Aerosol deposition is already in commercial use |
9.7. | Nano ink challenges and directions of development for aerosol |
10. | MOLDED INTERCONNECT DEVICES |
10.1. | Three approaches to molded interconnect devices |
11. | LASER DIRECT STRUCTURING |
11.1. | Molded Interconnect Devices: Laser Direct Structuring |
11.2. | Applications of laser direct structuring |
11.3. | LDS MID: characteristics |
11.4. | LDS MID: material considerations |
11.5. | LDS MID: Laser roughing |
11.6. | Galvanic plating to the rescue? |
11.7. | LDS MID: Ease of prototyping and combining 3D printing with LDS? |
11.8. | Mass manufacturing the all-plastic-substrate paint? |
11.9. | LDS MID application examples: antenna |
11.10. | LDS MID application examples: insulin pump and diagnostic laser pen |
11.11. | LDS MID application examples: automotive HMI |
11.12. | LDS MID in LED implementation |
11.13. | MID challenges for LED integration |
11.14. | Expanding LDS MID to non-plastic substrates? |
11.15. | LDS MID 3D LED retrofit |
11.16. | LDS MID in LED with improved heat dissipation |
11.17. | LDS MID in sensors |
11.18. | LDS MID: fine pitch capability |
12. | TWO SHOT MOLDING |
12.1. | Two shot molding: process description |
12.2. | LDS MID application examples: insulin pump |
12.3. | Comparing LDS and Two-Shot MID |
13. | FILM INSERTION |
13.1. | PolyIC: inserting complex patterned functional films into 3D shaped parts |
13.2. | Transfer printing: printing test strips & using lamination to compete with IME |
13.3. | IME with functional films made with evaporated lines |
14. | 'PRINTING' PCBS |
14.1. | Printing PCBs: various approaches |
14.2. | Single-/double-sided printed PCB (approach I) |
14.3. | Single-/double-sided printed PCB (approach II) |
14.4. | Single-/double-sided printed PCB (approach III) |
14.5. | Single-/double-sided printed PCB (approach IV) |
14.6. | Multi-layer printed PCB (NanoDimension) |
14.7. | Multi-layer printed PCB (ChemBud) |
15. | 3D PRINTED ELECTRONICS |
15.1. | The premise of 3D printed electronics |
15.2. | Routes to 3D printing of structural electronics |
15.3. | Approaches to 3D printed electronics |
15.4. | Extrude conductive filament |
15.5. | Extrude sensing filament |
15.6. | Conductive plastics using graphene additives |
15.7. | Conductive plastics using carbon nanotube additives |
15.8. | Extrude molten solder |
15.9. | Paste extrusion, dispensing or printing during 3D printing |
15.10. | Ink requirements for 3D printed electronics |
15.11. | 3D printed with embedded metallization |
15.12. | Benchmarking different processes (IME, MID, 3DP, aerosol) |
16. | FORECASTS |
16.1. | Forecast Methodology |
16.2. | IME market forecast - application |
16.3. | Ten-year in-mold-electronics market forecast in area |
16.4. | Estimate of value capture by different elements in an IME product |
16.5. | Ten-year market forecasts for functional inks in IME |
16.6. | Ten-year market forecasts for plastic substrates in IME |
16.7. | Key observations from the MID market |
17. | COMPANY PROFILES |
18. | APPENDIX |
18.1. | In-Mold Electronic market forecast data |
18.2. | Functional ink and substrate for IME market forecast data |