We will present a new manufacturing approach - direct die placement (DDP) - that enables deterministic assembly of thin, high-performance semiconductor dies and layers directly onto flexible and soft substrates. We will demonstrate the capabilities of DDP for achieve high-yield and high-fidelity transfer of thin silicon dies and components (10s of micrometers - 300 nanometers in thickness) with diverse to flexible polyethylene terephthalate substrates. We will discuss the tailorability of DDP to accommodate carrier and destination substrates with properties that are of particular importance to the FHE industry.

Dr. David S. Grierson, co-founder and CTO of systeMECH, Inc, completed his Ph.D. in Engineering Mechanics in 2008 at the University of Wisconsin-Madison (UW-Madison) and was a postdoctoral associate at the University of Wisconsin-Madison from 2008-2011 investigating the reliability, mechanics, and scale-up of nanomembrane-based fabrication processes and scanning-probe based nanomanufacturing processes. David co-founded systeMECH in 2011, along with Prof. Kevin Turner, in order to commercialize technology developed in the Turner Lab at UW-Madison. David is chief technology officer and also manages the day-to-day operations at systeMECH.

systeMECH, Inc was founded by David Grierson and Kevin Turner in 2011 in order to commercialize technology developed at the University of Wisconsin-Madison. systeMECH is developing innovative and scalable manufacturing tools and processes that will transform the fabrication of a broad range of flexible micro- and nanoscale devices that incorporate high-performance semiconductors (e.g., single-crystal silicon) into their device architectures. systeMECH has developed a novel direct die-placement technology and tool for manufacturing next-generation flexible hybrid electronic and photonic systems through the direct transfer of high-performance materials and devices to flexible and soft substrates. systeMECH has expertise in micro- and nanofabrication, with a particular emphasis on bonding and layer-transfer techniques for fabricating advanced flexible electronics, photonics, MEMS, and semiconductor devices.